面議（經常性薪資達4萬元或以上） 台南市新市區 工作經歷不拘 1天前更新
(1)Lead the development of advanced package 2.5D interposer and 3D wafer-on-wafer platforms.
(2)Co-work with module teams to evaluate new processes and resolve issues.
(3)Drive FMEA for new product/process integration by aligning cross-module controls, updating control plans, and validating risk mitigations.
(4)Monitor and improve yield by analyzing in-line and WAT data, driving process window optimization, and maintaining/updating Best-Known Methods (BKM).
(5)Establish and validate new process flows in Design Support Manual (DSM) for customer-specific applications.
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