面議（經常性薪資達4萬元或以上） 台南市新市區 工作經歷不拘 7天前更新
(1)Lead the development of advanced package 2.5D interposer and 3D wafer-on-wafer platforms.
(2)Co-work with module teams to evaluate new processes and resolve issues.
(3)Drive FMEA for new product/process integration by aligning cross-module controls, updating control plans, and validating risk mitigations.
(4)Monitor and improve yield by analyzing in-line and WAT data, driving process window optimization, and maintaining/updating Best-Known Methods (BKM).
(5)Establish and validate new process flows in Design Support Manual (DSM) for customer-specific applications.
展開 週休二日分紅入股員工生日禮金員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助
