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  • 月薪31900~35900元 高雄市楠梓區 工作經歷不拘 今天
    工作內容: • 與倉庫、報關行、快遞及貨運業者溝通,處理出口及提貨相關作業 • 執行每日成品與半成品出貨作業(含 SAP 系統操作、出口報單種類、統計方式、開立提單) • 接收內部出貨指令,協調倉庫進行包裝作業 • 與各單位協調,完成跨部門作業 • 與報關行及貨運代理(Forwarder)聯繫並進行工作協調 • 追蹤貨件遞送進度及異常狀況 • 執行主管交辦事項 • 每兩個月調整班表,輪值月份需於每週六上班,並於平日排休 應徵條件: • 大學畢業,國際貿易、運籌管理、企業管理相關科系尤佳 • 英文能力:聽略懂、說略懂、讀中等、寫中等 • 具 1 年以上相關工作經驗者佳 • 具英檢證書或 TOEIC 550 分以上者佳 • 熟悉 Microsoft Word(如函數及樞紐分析)及 Excel 等辦公軟體者優先
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 月薪29500元 高雄市楠梓區 工作經歷不拘 今天
    早班上班時間: 07:30-16:00, 固定班別, 排班制(非固定休六日) 工作內容: • 負責倉庫收貨、出貨及庫存管理 • 管理貨物進出,執行定期盤點及儲位規劃調整 • 三班制(排休),工作期間需全程穿著無塵服 • 操作 SAP 系統(GR、GI、Shipping、庫存管理等) • 分片機器操作 • 冷凍庫作業(攝氏 5 度冷房) • 拆箱作業 • 執行主管交辦事項 • 需搬運貨箱(重量低於 20 公斤) • 需使用推車搬運貨物(重量約 200 公斤),將產品由產線推回倉庫 應徵條件: • 可接受操作英文介面系統 • 英文能力:聽、說、讀、寫略懂 • 高中職以上學歷,科系不限 • 能長時間站立與走動
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 月薪31000~41000元 高雄市楠梓區 工作經歷不拘 今天
    1. 負責生產線機器、設備之操作,並維持機台正常運作。 2. 進行製造現場的產品組裝、檢驗、包裝出貨等作業。 3. 與其他作業員進行協調,以符合生產及程序標準。 4. 完成主管交辦有關生產產品、程序事宜。
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 月薪38000~47000元 高雄市楠梓區 工作經歷不拘 今天
    1. 負責生產線機器、設備之操作,並維持機台正常運作。 2. 進行製造現場的產品組裝、檢驗、包裝出貨等作業。 3. 與其他作業員進行協調,以符合生產及程序標準。 4. 完成主管交辦有關生產產品、程序事宜。
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 面議(經常性薪資達4萬元或以上) 台北市南港區 工作經歷不拘 今天
    Please also apply unto our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Taipei/Supply-Chain-Planner_R-10062641 Job Description Supply Chain Modeling -Manage the integral supply chain to match demand and supply, using the master planning system -Drive to set Supply Chain Parameters (e.g. Supply Chain Model, Lead times, Safety Stocks) in planning system according to product life cycle. S&OP Support -Cowork together with BU/BL Capacity planners on S&OP process -Review resource loading situation impacting S&OP. Order Management -SO Management: Be responsible for fulfillment of customer sales orders, customer programs forecast and safety stock replenishment -PO Management: Plan and release feasible plans to manufacturing sites fulfilling demand and loading policy. Monitor and control supply deviation -Based on demand and supply situation, communicate with BU/BL to align business strategy -Returns Management: Support and arrange returns (quality, technical, logistics and commercial returns) according to relevant procedures. -Exceptional Management: a) In case of allocation, follow allocation process and decision b) In case of tight supply, co- work with BU/BL and Customer Service and Site for production priority to prevent customer line down c) Support New Product Introduction Improvements / PDCA -Regular review KPI and initiate improvement activities in case KPIs are below targets -Participate in projects Education Degree in business administration, industrial engineering or information management (preferable) Personal Requirements - Integral working and thinking style - Analytical thinking - Independence / problem solving - Team player with good cooperation and information conduct
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 面議(經常性薪資達4萬元或以上) 高雄市楠梓區 工作經歷不拘 今天
    Job Description - Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. - Take lead of new product introduction (NPI) for IC test - To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer - To improve new product introduction procedure to enable smooth product transfer - To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation - To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy - To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. - Process of Test Engineering Notice and Enovia ECO Requirement - Bachelor degree (or above), Engineering background is preferred. - Excellent communication skills (English/Mandarin, TOEIC>600) - Good logic thinking - Be familiar with MS Office tool - 1 yrs experience in IC testing or related working experience is preferred
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 月薪36000元 高雄市楠梓區 工作經歷不拘 今天
    ***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 1111南台灣職場小語

    【推薦工作】作業員、技術員、包裝員|無經驗可、享週休二日!

  • 月薪36000元 高雄市楠梓區 工作經歷不拘 今天
    ***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude
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    分紅入股年終獎金三節獎金激勵獎金員工團保
  • 面議(經常性薪資達4萬元或以上) 新竹縣竹北市 工作經歷不拘 今天
    Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.
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  • 月薪42000~45000元 高雄市楠梓區 工作經歷不拘 今天
    Wire Bond 製程助理工程師工作內容: 1. 協助進行基本統計分析(如平均值、趨勢圖、良率統計等),並製作簡易報表。 2. 協助異常產品之初步處理與分析,包含資料整理、產品追蹤。 3. 支援製程工程師進行實驗(DOE)或製程改善相關之資料準備工作。 4. 協助維護製程文件、SOP 及相關記錄之更新。 5. 其他主管交辦之製程支援事項。 Wire Bond 助理工程師協助製程工程師進行日常製程支援相關工作,包含樣品(sample)收集、製程資料彙整、文書作業及基本統計分析,確保製程資料完整性與準確性,並支援製程改善與量產穩定。 本職位對公司業務發展具有重要意義,為公司製程、設備及產品品質提供技術支持。未來在半導體行業中擁有廣泛的發展前景。 歡迎符合上述資格的求職者申請本職位,並表達您對本職位的興趣。
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 工作經歷不拘 今天
    Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Principal-Process-Integration-Engineer_R-10063266 Job Description 【Why This Role?】 Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness. Lead Mass Production Breakthroughs: Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM). Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below). 【Key Responsibilities】 Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks. Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions. Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency. Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer. 【Required Qualifications】 Education: Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field. Experience: 10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM). Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics. 【Preferred Skills】 Process Transfer Expertise: Successful track record in 〝Copy-Smart〝 process migration, ensuring process consistency and rapid yield ramp-up during technology transfer. BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization. Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond. Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design. 【Soft Qualities】 Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies. Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks. Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams.
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  • 月薪33000~33000元 屏東縣內埔鄉 工作經歷不拘 今天
    一、工作內容 檢瓶維護清潔人員 (短期3~5個月) 二、薪水 薪$33,000 三、休假 見紅休 四、公司福利 (一)勞保、健保(依法投保) (二)團體人壽險、意外險 (三)年節獎金或禮券 (四)結婚補助金與結婚禮金 (五)生育補助金 (六)年終獎金 (七)公司負擔6﹪退休金(依實際薪資級距提撥) (八)健康檢查 (九)提供制服、不押保證金 (十)提供專業教育訓練及核發證照 (十一) 完整的人事管理與升遷制度 面試時段  :  周一至週五上午08:30 及 下午14:00
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    員工結婚補助就業保險生育補助產假年節獎金
  • 月薪39000~39000元 屏東縣內埔鄉 工作經歷不拘 今天
    一、工作內容 操作堆高機(需具堆高機證照 ) (短期3~5個月) 二、薪水 薪$39,000 三、休假 見紅休 四、公司福利 (一)勞保、健保(依法投保) (二)團體人壽險、意外險 (三)年節獎金或禮券 (四)結婚補助金與結婚禮金 (五)生育補助金 (六)年終獎金 (七)公司負擔6﹪退休金(依實際薪資級距提撥) (八)健康檢查 (九)提供制服、不押保證金 (十)提供專業教育訓練及核發證照 (十一) 完整的人事管理與升遷制度 面試時段  :  周一至週五上午08:30 及 下午14:00
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    員工結婚補助就業保險生育補助產假年節獎金
  • 月薪34700~34700元 屏東縣內埔鄉 工作經歷不拘 今天
    一、工作內容 操作堆高機(需具堆高機證照 ) 二、薪水 薪$34,700 三、休假 見紅休 四、公司福利 (一)勞保、健保(依法投保) (二)團體人壽險、意外險 (三)年節獎金或禮券 (四)結婚補助金與結婚禮金 (五)生育補助金 (六)年終獎金 (七)公司負擔6﹪退休金(依實際薪資級距提撥) (八)健康檢查 (九)提供制服、不押保證金 (十)提供專業教育訓練及核發證照 (十一) 完整的人事管理與升遷制度 面試時段  :  周一至週五上午08:30 及 下午14:00
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    員工結婚補助就業保險生育補助產假年節獎金
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