-
職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
- 面議（經常性薪資達4萬元或以上） 新北市土城區 工作經歷不拘 2天前展開
1.PCB Layout方案評估、Placement、Routing、Gerber out。 2.板廠工程問題回覆。 3.產線DFx問題解決。
- 月薪35000元 桃園市龍潭區 工作經歷不拘 1天前展開
1. 定期維修保養、異常緊急處理、系統維護與巡檢並確保設備運作正常。 2. 監督工程/新設備的導入、配置、安裝與確保符合公司需求。 3. 監督與協調施工業者，確保施工品質及進度符合公司標準。 4. 記錄、統計、分析廠務系統運作資料，如有必要提案改善建議。 5. 維護暨管理工廠電力、弱電、空調、用水、廠務設備等系統。 6. 整理並撰寫設備導入及修繕的詳細記錄與報告，供內部參考與後續評估。 7. 其他主管交辦事項 8.做為儲備幹部訓練 年薪約15個月~17個月(依公司營運狀況及個人表現調整)
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金年終獎金 - 面議（經常性薪資達4萬元或以上） 新北市土城區 工作經歷不拘 今天展開
1.負責製程中出現的技術問題排除與即時處理 2.印刷電路板（PCB）產品設計，確保符合客戶需求與製造規範 3.製作產品料號，並進行Tooling設計與規格設定 此職務將接觸研發、製程與設計三大面向，具備高度技術挑戰與學習空間。 歡迎對電子製程與產品開發有熱情的你加入我們，一起推動創新製造。
需穿著員工制服員工國內、外進修補助員工及眷屬喪葬補助國內、外旅遊補助社團補助 - 面議（經常性薪資達4萬元或以上） 新北市土城區 工作經歷不拘 今天展開
1.負責製程中出現的技術問題排除與即時處理 2.印刷電路板（PCB）產品設計，確保符合客戶需求與製造規範 3.製作產品料號，並進行Tooling設計與規格設定 此職務將接觸研發、製程與設計三大面向，具備高度技術挑戰與學習空間。 歡迎對電子製程與產品開發有熱情的你加入我們，一起推動創新製造。
需穿著員工制服員工國內、外進修補助員工及眷屬喪葬補助國內、外旅遊補助社團補助 - 1111南台灣職場小語
【推薦工作】行政內勤、行政助理｜無經驗可，享週休二日！
- 月薪40000元 彰化縣芬園鄉 工作經歷不拘 6天前展開
＊更換輪胎、拆裝、平衡、補胎、定位。 ＊檢查輪胎周圍相關問題及抓車況問題，提供專業建議。 ＊了解顧客問題及車況。確認將進行的維修項目。 ＊需有經驗且具備上列能力，能獨立完成整套作業流程。 ＊輪胎庫存整理、盤點。 ＊須具備汽車駕照。 ＊快速保養。
免費供餐勞保健保 - 月薪40000元 南投縣草屯鎮 工作經歷不拘 6天前展開
＊更換輪胎、拆裝、平衡、補胎、定位。 ＊檢查輪胎周圍相關問題及抓車況問題，提供專業建議。 ＊了解顧客問題及車況。確認將進行的維修項目。 ＊需有經驗且具備上列能力，能獨立完成整套作業流程。 ＊輪胎庫存整理、盤點。 ＊須具備汽車駕照。 ＊快速保養。
免費供餐勞保健保 - 月薪40000元 台中市烏日區 工作經歷不拘 4天前展開
＊更換輪胎、拆裝、平衡、補胎、定位。 ＊檢查輪胎周圍相關問題及抓車況問題，提供專業建議。 ＊了解顧客問題及車況。確認將進行的維修項目。 ＊需有經驗且具備上列能力，能獨立完成整套作業流程。 ＊輪胎庫存整理、盤點。 ＊須具備汽車駕照。 ＊快速保養。
免費供餐勞保健保 - 面議（經常性薪資達4萬元或以上） 桃園市桃園區 工作經歷不拘 2天前展開
英業達首屆【新訓班】招募中! *應屆畢業生及新鮮人：歡迎國內外大學/碩士應屆畢業生及一年內畢業之新鮮人。 你，就是我們要找的未來領航者！ 我們為你準備了四大核心優勢： *全方位系統化培訓：告別盲目摸索！由高階主管與業界導師親自帶領，從產業趨勢、核心技術到管理思維，進行全方位的「通才x專才」統一受訓。 *透視全球科技產業鏈：深入英業達核心業務，讓你用最快的速度看懂科技業的局勢與商業邏輯。 *專屬職涯雙軌通道：表現優異者將納入公司關鍵人才庫，享有更快速的晉升管道與海外派駐/出差機會。 *超強同梯人脈網：與來自海內外頂尖學校的優秀應屆畢業生一同受訓，在職涯起跑點就建立起最強大的跨領域戰友情誼。 【招聘職缺】 1. 伺服器硬體設計工程師 2. 伺服器BMC設計工程師 3. 伺服器BIOS設計工程師 4. 伺服器機構設計工程師 5. 伺服器電源設計工程師 6. 伺服器散熱設計工程師 7. 伺服器SI Simulation工程師
員工及眷屬喪葬補助社團補助員工電影自強活動員工停車位或停車補助 - 月薪35250元 台南市永康區 工作經歷不拘 1天前展開
1.製程自動控制、門禁、監視器攝影機、電子磅秤、地磅等設備工程規劃設計及維修護作業。 2.具上述相關技術士證照為佳。 3.需配。 4.上級交代事項。
員工宿舍員工餐廳員工結婚補助生育補助年終獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣竹東鎮 工作經歷不拘 今天展開
1.負責PLC控制系統軟硬體之研發、設計、測試與除錯，確保系統功能符合規格並達最佳化 2.配合能源管理系統，規劃、執行相關控制策略，以提升整體營運效率 3.負責既有PLC系統及新型設備電控之相關維護、保養、改善與建議 4.參與跨部門技術研討，並與外部廠商協同合作，以解決複雜技術課題並提升技術層次
良好升遷制度員工在職教育訓練家庭日尾牙產檢假 - 月薪33000~40000元 高雄市左營區 工作經歷不拘 2天前展開
1.儀器故障修復 2.須進入工廠進行設備維護保養 3.重新組裝並測試已修復之設備 4.儀器安裝測試
年節獎金年終獎金三節獎金禮品意外險 -
