共計筆電機技師/工程師+電子通訊+IC設計工程師+半導體工程師+PLC/自動控制工程師+光電工程師職缺在等你,馬上去應徵吧!

  • 月薪35000~42000元 高雄市楠梓區 工作經歷不拘 今天
    <可直接電洽0983-398-915>謝先生 - 科技廠 電盤結線配線、拉線、線槽安裝。
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  • 月薪28590~32000元 高雄市鳥松區 工作經歷不拘 1天前
    1.具備電機(子)、控制基礎知識。 2.弱電監控、空調安裝測試、除錯和故障排除。 3.通訊與控制設備現場線路配置及安裝測試。 4.電信網路、產品和設備維護,以確保它們能夠正常運行。 5.工作地點固定。 6. 其他相關任務。
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    年終獎金三節獎金員工團保伙食津貼員工結婚補助
  • 月薪36000元 台中市西屯區 工作經歷不拘 1天前
    1.電子硬體電路開發設計、硬體界面驅動程式撰寫及軟體開發、電子化與智慧化系統整合 2.工作條件: a.熟悉程式語言,如:Python、Visual Basic(VB)、Visual Basic for Applications(VBA)、C++、C#等程式語言能力 b.具MCU架構開發經驗 c.具電子產品電路設計經驗者佳
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    就業保險產假產檢假家庭照顧假員工生日禮金
  • 月薪36000元 高雄市前金區 工作經歷不拘 2天前
    1.負責場站電腦收費設備管理,場域規劃配置。 2.執行團隊工作協調,人員現場維修、保養停車場收費設備協調事宜。 3.停車場收費設備安裝結線測試、架設內外網路、軟體安裝操作設定、 4.電腦硬體及其他系統周邊裝置檢測維修、教育客戶設備使用等。 5.場站在建工程與設備維護管理。 6.其他主管交辦事項
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    全勤獎金員工生日禮金年終獎金三節獎金意外險
  • 面議(經常性薪資達4萬元或以上) 新北市土城區 工作經歷不拘 2天前
    * 負責雲端Server伺服器的相關工作 1. Server platform BIOS development, validation, debugging. 2. BIOS requirements implementation and issues fixed. 3. Project handle and collaborate with customer and cross-functional teams.
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  • 面議(經常性薪資達4萬元或以上) 台南市善化區 工作經歷不拘 4天前
    原廠機台維修 具機台維修經驗者佳 歡迎無經驗願學習者 可獨立作業 工作環境良善學習機會多 客戶廠區帶學新手機台維修 學習訓練與原廠英文溝通 不定期年度機會出國受訓學習 歡迎工作穩定度高二次就業人才 工作地點:南科與高雄
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    就業保險產假產檢假安胎假家庭照顧假
  • 月薪50000元 台南市歸仁區 工作經歷不拘 2天前
    工業技術研究院綠能所氫能應用研究室現招募一位氫能系統整合研究員,並參與計畫管理工作, 主要工作內容如下: 1.產氫及燃料電池系統整合 2.電控及電機系統整合 3.系統控制策略研究 4.熱傳/質傳/電化學等學理及實作數據分析 5.計劃管理工作 6.配合能源署業務工作 7.須不定期配合國內出差業務 8.其他主管交辦業務
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    良好升遷制度年節獎金年終獎金員工團保績效獎金
  • 1111南台灣職場小語

    【推薦工作】行政內勤、行政助理|無經驗可,享週休二日!

  • 月薪50000元 台南市六甲區 工作經歷不拘 2天前
    {線上面談} 1. 機器手臂手眼協調系統整合、運動控制整合。 2. 針對手眼協調專案進行開發,與軟硬體整合測試(影像處理或影像辨識等)。 3. 手臂運動最佳化以提高應用效率。 ※具申請工研院宿舍資格 ※應屆畢業生、研發替代役 可 【HR貼心提醒】若有意願應徵,請附上個人作品,提升履歷能見度,加速主管們對您的認識,謝謝。
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    良好升遷制度年節獎金年終獎金員工團保績效獎金
  • 月薪35000~50000元 高雄市路竹區 工作經歷不拘 2天前
    有機械概念實務及機械操作技能 1.負責生產線機器、設備之操作,並維持機台正常運作。 2.進行製造現場的產品組裝等作業。 3.與其他作業員進行協調,以符合生產及程序標準。 4.完成主管交辦有關生產產品、程序事宜。
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    產假全勤獎金年終獎金禮品績效獎金
  • 面議(經常性薪資達4萬元或以上) 新竹市 工作經歷不拘 43天前
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5354&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. We invite you to become an integral part of our forward-thinking team, where you will be at the vanguard of nanosheet transistor device design for our prestigious A14 technology initiative. This role offers a unique opportunity to work on the frontier of semiconductor innovation, collaborating with industry leaders and contributing to technologies that define the next generation of electronics. Responsibilities: 1. Pioneering Nanotechnology Development: (1) Seamless Integration: Integrate devices across various process modules, including the creation of test keys, execution of tape-outs, meticulous device analysis, advanced simulations, and fortification of model integrity. (2) Innovative Design: Craft precision test key designs to facilitate accurate electrical modeling and comprehensive device characterization. (3) Advanced Characterization: Define the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting occasional bench measurements. (4) Experimentation: Design experiments to meet device KPIs for performance and periodically serve as the on-duty engineer to coordinate device process management. 2. Diagnostic Analysis: Critical Data Assessment: Apply your analytical expertise to dissect transistor electrical and physical data, pinpointing issues and identifying responsible parties for targeted resolution. 3. Collaborative Problem-Solving: Interdisciplinary Teamwork: Join forces with a spectrum of specialized teams to scrutinize and appraise new processes, driving the resolution of complex challenges through collective insight and expertise.
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  • 面議(經常性薪資達4萬元或以上) 新竹市 工作經歷不拘 43天前
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Aspire to be a part of a visionary team that develops world-class, cutting-edge technology for the A14 platform? This is a call to those who wish to delve into the realm of interconnect and chip/package (2D/3D) co-optimization, where your work will be integral to our success. Responsibilities: 1. Championing Technological Excellence: (1) Optimization Wizardry: Ensure the A14 program excels by harmonizing process requirements across performance, yield, reliability, and manufacturability through strategic process integration and baseline maintenance. (2) Design & Validation Expertise: Lead the tape-out process and rigorously test key designs to validate design rules, refine electrical modeling, and elevate yield outcomes. (3) Benchmarks & Characterization: Analyze and characterize the electrical performance relative to the process, establish SPICE modeling benchmarks, and perform selective bench measurements to guarantee precision and quality. 2. Collaborative Innovation: (1) Analytical Problem-Solving: Bring your innovative mindset to team efforts, using data analysis to uncover process issues and co-developing new processes as solutions alongside talented peers. (2) Process Evolution: Play a pivotal role in evolving processes from advanced integration baselines to full-scale volume production, ensuring a smooth transition and exemplary results.
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  • 面議(經常性薪資達4萬元或以上) 新竹市 工作經歷不拘 43天前
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=5351&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Embark on a career journey with us, where innovation meets impact. We are searching for a dedicated professional to join our elite team, harnessing the world‘s most sophisticated technology to engineer SRAM that impacts the lives of millions globally. Responsibilities: 1. Spearhead A14 SRAM Development: (1)Yield and Device Optimization: Apply your analytical prowess to enhance SRAM/Device performance and ensuring excellent yield. (2)SRAM Cell Design and Testing: Craft cutting-edge SRAM cells and conduct critical process window evaluations to guarantee optimal design resilience. (3)SRAM Characterization and Validation: Utilize advanced simulation tools to characterize and validate SRAM, paving the way for silicon success. 2. Collaborative Excellence: Cross-Functional Teamwork: Engage with a network of experts across various specialties, including Integration, Design, Product, and Reliability, to fortify SRAM cell robustness. 3. Identify issues and build up methodology, propose solutions and evaluation plans.
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  • 月薪38000~45000元 台南市善化區 工作經歷不拘 2天前
    1. 助理工程師;設備組裝、架設、現場工程、人力支援、技術助理、巡迴保養修復、緊急叫修。 2. 工程師:設備組裝、架設、現場工程、人力支援、技術助理、巡迴保養修復、緊急叫修輪值、參與 原廠訓練課程及日後工作相關之連繫。
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    就業保險產假產檢假安胎假家庭照顧假
  • 月薪38000~45000元 台南市新市區 工作經歷不拘 5天前
    ▶工作需求: 1.於無塵室工作,進行裝機、調機、移機相關業務 2.會需要爬高、蹲低、進入機台內部作業 3.基本文書業務處理及其他主管交辦事項 4.視業務狀況配合出差/輪班(出差津貼、輪班津貼另計) 5.需配合排班、輪班、國內出差、國外出差 ★有機會到國外出差增廣見聞 ▶面試資訊: 1.請至人力銀行投遞履歷 2.書審通過者,將透過電話聯繫安排視訊面試時間 ★未來有機會轉調至日本、美國工作 ★公司享有年度調薪、三節獎金、生日禮金...等福利
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    產假產檢假員工生日禮金三節獎金員工團保
  • 無經驗!跳槽職缺大放送!