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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 月薪50000元 台北市大同區 工作經歷不拘 4天前展開
我們是一家專注於社區管理服務的公司，致力於為住戶提供高品質的生活環境與專業服務，服務客群為住宅社區住戶及管委會。我們秉持責任感與專業精神，為社區運作提供全面支持。 1. 確保落實執行社區規約及管理辦法，維護社區正常運作。 2. 召開管委會定期會議，負責會議資料準備及紀錄。 3. 負責社區決議事項的推動與執行。 4. 規劃及監督社區清潔、警衛、設施設備維修等日常管理工作。 5. 管控及審核社區財務與預算，確保財務透明和穩健。 6. 監督環境清潔、維修及公共設施保養工作，確保住戶滿意。 7. 協調社區住戶與管委會之間的溝通，促進良好社區氛圍。 8. 危機處理與應急管理，迅速應對社區突發事件。 歡迎您加入我們！如果您對社區管理充滿熱情，擁有良好的管理能力及責任感，我們誠摯邀請您成為我們團隊的一員，與我們一同為住戶創造更優質的生活環境。期待您的履歷！
員工結婚補助生育補助員工宿舍子女教育補助需穿著員工制服 - 月薪38000~40000元 台南市柳營區 工作經歷不拘 1天前展開
1. 協助工地職安衛事務、巡檢稽核及行政管理作業。 2. 協助安全會議、教育訓練、環境維護及改善追蹤。 3. 負責工地職安衛文件建檔、表單申請及資料整理。 4. 其他主管交辦事項。
家庭照顧假產假安胎假產檢假就業保險 - 月薪38000~40000元 台中市南屯區 工作經歷不拘 1天前展開
1. 協助工地職安衛事務、巡檢稽核及行政管理作業。 2. 協助安全會議、教育訓練、環境維護及改善追蹤。 3. 負責工地職安衛文件建檔、表單申請及資料整理。 4. 其他主管交辦事項。
家庭照顧假產假安胎假產檢假就業保險 - 月薪35490~43000元 花蓮縣花蓮市 工作經歷不拘 2天前展開
資格條件： 1.學歷大學以上，醫學影像暨放射科學系畢，具醫事放射師證書。 2.具輻射防護人員證書且有相關經驗尤佳。 工作內容： 1.執行同位素治療的病人照護、指導病人輻射安全須知、操作測量儀器。 2.熟知放射線儀器操作，於檢查時給予操作協助。 3.處理牙科部輻防相關作業。 4.將病人的查檢資料整理、儲存、歸檔。 5.安排儀器的保養、修繕事項之執行。 6.每日儀器清潔及保養作業。 7.協助拍攝病人口內照。 其他事項： 1.放射線器材操作使用 2.執行醫事檢驗相關作業 3.放射線檢查作業執行 月薪資：35,490元至43,000元 ♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦♦ 誠摯邀請您的加入！！ 可備妥履歷表、自傳、成績單及相關證書影本參與面談 聯絡人：牙科 黃主任 聯絡電話：03-8561825分機12442 聯絡時間：週一至週五上午0900-1200；下午1330-1730 電子信箱：ming_jays@tzuchi.com.tw
員工結婚補助子女教育補助壽險員工團保年節獎金 - 月薪38000~40000元 新竹縣竹北市 工作經歷不拘 1天前展開
1. 協助工地職安衛事務、巡檢稽核及行政管理作業。 2. 協助安全會議、教育訓練、環境維護及改善追蹤。 3. 負責工地職安衛文件建檔、表單申請及資料整理。 4. 其他主管交辦事項。
家庭照顧假產假安胎假產檢假就業保險 - 月薪38000~40000元 桃園市桃園區 工作經歷不拘 1天前展開
1. 協助工地職安衛事務、巡檢稽核及行政管理作業。 2. 協助安全會議、教育訓練、環境維護及改善追蹤。 3. 負責工地職安衛文件建檔、表單申請及資料整理。 4. 其他主管交辦事項。
家庭照顧假產假安胎假產檢假就業保險 - 月薪30000~35000元 彰化縣埔心鄉 工作經歷不拘 1天前展開
1. 設計模具，並參與模具製造、加工、組立、送樣、試模及驗收工作。 2. 繪製2D與3D的模具設計圖。 3. 負責開模前之規劃及開模後之進度掌控。 4. 進行模流分析。 5. 負責模具估價及成本分析。 6. 規劃與管理模具之生產線。 7. 負責生產單位檢具、治具製作及異常事項的處理及改善。 8. 負責模具的維修及保養作業。 9. 評估新產品模具開發的可行性。 10. 負責品質異常問題分析。
就業保險產檢假安胎假年終獎金員工團保 - 1111南台灣職場小語
【推薦工作】行政內勤、行政助理｜無經驗可，享週休二日！
- 月薪36000元 高雄市楠梓區 工作經歷不拘 今天展開
***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude
分紅入股年終獎金三節獎金激勵獎金員工團保 - 月薪30000~35000元 彰化縣埔心鄉 工作經歷不拘 1天前展開
1. 設計沖壓模具，並參與模具製作、加工、組立、送樣及試模工作。 2. 繪製2D與3D的沖壓模具設計圖。 3. 規劃與管理模具之生產線。 4. 負責開模前之規劃及開模後之進度掌控。 5. 負責模具的維修及保養作業。 6. 依據生產模次排定保養計畫，並督導執行狀況。 7. 管理與監督庫存模具。 8. 協助生產單位處理模具異常狀況。 9. 管理射出模、製造模的現場工作人員。 10. 負責模具技術開發。
就業保險產檢假安胎假年終獎金員工團保 - 月薪36000元 高雄市楠梓區 工作經歷不拘 今天展開
***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 工作經歷不拘 今天展開
Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.
分紅入股年終獎金三節獎金激勵獎金員工團保 - 月薪38000元 桃園市中壢區 工作經歷不拘 2天前展開
◆生產設備操作，技能培訓，累積實務經驗 ◆生產現場進度及品質管理，建立問題解決能力 ◆人員調度、督導生產作業及安全管理 ◆跨部門溝通與協調 ◆儲備基層管理幹部培養 ✓ 薪資38000元(含加班費) ✓ 採做四休二制度 ✓ 固定班，不需日夜輪班 ✓ 中文檢定B1級別 ◎協助僑外生申請評點制 ◎協助僑外生住宿安排
激勵獎金績效獎金員工團保國內旅遊員工聚餐 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 今天展開
Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Principal-Process-Integration-Engineer_R-10063266 Job Description 【Why This Role?】 Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness. Lead Mass Production Breakthroughs: Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM). Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below). 【Key Responsibilities】 Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks. Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions. Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency. Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer. 【Required Qualifications】 Education: Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field. Experience: 10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM). Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics. 【Preferred Skills】 Process Transfer Expertise: Successful track record in 〝Copy-Smart〝 process migration, ensuring process consistency and rapid yield ramp-up during technology transfer. BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization. Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond. Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design. 【Soft Qualities】 Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies. Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks. Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams.
分紅入股年終獎金三節獎金激勵獎金員工團保 - 月薪33000~36000元 新北市中和區 工作經歷不拘 今天展開
1. 進、出貨單資料建檔及輸入。 2. 進、出貨之連絡及傳達訊息。 3. 協助拆櫃數量統計及製表。 4. 庫存核對、庫存盤點、資料彙整。 5. 獎金計算。 6. 電腦文書。 7. 環境清潔整理及維謢。 8. 郵局寄信及採買庶務用品。 9. 主管交辦事項。
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