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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 月薪32000~60000元 台南市永康區 工作經歷不拘 4天前展開
擴大徵才，募集新夥伴加入我們的行列，對於網路寬頻事業有興趣的朋友，快點來吧！ 全科寬頻以業務人員為主題的徵才活動，有興趣從事相關領域者千萬不要錯過喔! 有過人機智的你 喜歡與人接觸的你 你是個充滿熱情與喜悅的人嗎？ 是不是有展翅高飛的夢想，卻沒有大顯身手的舞台？ 我們可以許你一個舞台 但我需要一個能給全科寬頻夢想的你！ 【工作內容】 1.喜歡與人接觸，服務各大樓用戶。 2.新社區開發進場。 3.現有社區客戶的關係維持。 4.不定期社區大樓現埸活動展示。 5.依需求針對客戶客制服務。 6.參與社區簡報委員會議。 【條件需求】 1. 需要不斷的學習，提升自己。 2. 需要有自信、自律有親和力。 3. 溝通協調能力佳，具有耐心者。 薪資+獎金
全勤獎金年節獎金員工生日禮金年終獎金三節獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16564&source=1111&tags=AO+2026_1111 因為期待無限可能，所以選擇台積電！ 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境，並提供高於業界平均水準的薪酬與福利。加入台積電，您將有機會與世界一流的卓越夥伴共事，透過最先進的製程技術，共同成就改變世界的偉大事業。每一項突破與創新，都凝聚了我們的努力與心血。 2026年台積電預辦登積計畫：招募2026年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您，透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會！ 參與2026年預聘暨研發替代役熱門職缺，您將可： ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日：2025/10/31 如您對此計畫感興趣，台積電將前往校園辦理實體行動徵才車活動；活動當天不僅請您喝咖啡，並安排畢業校友與同學們互動交流，機會難得敬請把握機會。校園場次與報名資訊請參考官網（如未報名成功，也歡迎至現場和台積人資互動，現場投遞履歷，還可抽《限量》積星神秘小禮！） 此外，我們特別為同學安排了校園徵才實體與線上說明會，歡迎踴躍報名參加，以便了解公司市場趨勢、組織概況，並掌握求職技巧！報名連結：請參考官網 建議您根據學習領域與專業，投遞申請以下2~4個職位。符合主管需求者，將會收到面談邀請通知。 ▋歡迎志同道合的你，一起加入台積電 ▋世界上的每一個夢，都由我們來圓夢 Because we believe in endless possibilities, we choose TSMC! TSMC offers a wide variety of fulfilling experience and opportunities across our organization in many different locations. By joining TSMC, you will work with the high-performing teams in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. 2026 TSMC Advanced Offer and R&D Substitute Service Program Welcome to submit your resume via our application systems and apply to the following vacancies : 2026 TSMC Advanced Offer(AO) and R&D Substitute Service Program (RDSS). You will then be able to: • Get the offer before graduation. • Work with professional experts in the industry. • Fulfill yourself on the world stage. Application Deadline: October 31, 2025 Attending Campus Recruitment events with TSMC to enjoy a coffee with the industry experts to find out what suit you the best. For campus event schedule and registration details, please refer to TSMC career website (even if you are unable to register successfully, feel free to visit our booth and have a chat with us.) Submit your resume now, and gain a chance to win a limited TSMC’s gift! We’re also organizing a series of 〝TSMC Campus Recruitment Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We’re also organizing a series of 〝TSMC Campus Recruitment On-Site & Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We recommend you applying for two to four positions based on your academic background and professional expertise. If your qualifications meet the position requirements, you will receive an invitation for interviews. ▋Join TSMC｜Together, We Grow ! 2026 TSMC AO&RDSS Recruitment Job (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D) 1-2 Design and Technology Platform Engineer (DTP) 1-3 Specialty Engineer (Specialty) 1-4 Integrated Interconnect & Packaging Engineer (IIP) Operations (營運組織) 2-1 Process Integration Engineer (PIE) 2-2 Process Engineer (PE) 2-3 Equipment Engineer (EQ) 2-4 Intelligent Manufacturing Engineer (IMC/MFG) 2-5 Facility Engineer (FAC) 2-6 Product Engineer (PE) 2-7 Advanced Packaging Technology and Service Engineer (APTS) 2-8 Quality & Reliability Engineer (Q&R) 2-9 Module Associate Engineer (MAE) Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT) 3-2 Corporate Planning Organization (CPO) 3-3 Materials Management Engineer (MM) 3-4 Human Resources Specialist (HR) 【履歷填寫重點提醒】 1. 請務必優先填寫完成「畢業學校、畢業年份、就讀科系」後再更新履歷細節資訊，在系統資料送出後，您仍可以在收到面試邀請前持續更新內文。 2. 請詳細填寫履歷資料，包括學歷、專業關鍵字及自傳等內容；若您非外籍人士，除專業關鍵字外，其他欄位請以全中文填寫即可。 3. 自傳與專業關鍵字欄位有字數限制(1000字)，請確認字數是否符合要求，以免導致網頁無法成功送出。 4. 若履歷欄位為下拉式選單，當找不到合適內容時，可點選「其他」手動資料送出。 更多2026預聘暨研發替代役招募活動，請密切關注台積電FB粉絲專頁@加入台積 共創奇蹟 【Notes for Resume Submission】 1. Please prioritize completing the 〝Graduation School, graduation year and major〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. 4. If a resume field is presented as a dropdown menu and you cannot find a suitable option, you may select 〝Other〝 and manually submit the required information. For more information about the 2026 Advanced Offer (AO) and R&D Substitute Service Program (RDSS), please follow our TSMC Facebook fan page@加入台積 共創奇蹟
- 月薪35000~60000元 新北市三芝區 工作經歷不拘 6天前展開
1.樹木病蟲害防治、樹木修剪 2.養護工作，例如：澆灌、除草、修剪、整地、噴藥施肥、除蟲。
產假員工團保尾牙員工在職教育訓練勞保 - 月薪33000~80000元 高雄市三民區 工作經歷不拘 4天前展開
【工作內容】 社區大樓網路整合性服務 1.推廣和銷售寬頻網絡業務。 開拓新客戶，維護老客戶。 2.瞭解需求： 瞭解客戶需求，提供合適的寬頻網絡解決方案。 3.市場分析： 關注行業動態，分析競爭對手情況。 4.技術支持： 為客戶提供技術咨詢和支持。 5.內部協調： 與公司內部其他部門保持良好溝通協調，確保客戶需求得到滿足。 6.遵守規定： 遵守公司規章制度，維護公司形象。 7.新社區開發進場與維護。 【條件需求】 1. 不懼困難，能吃苦耐勞，善於溝通，善解人意。 2. 有高度服務的熱誠、有積極的工作態度，。 3. 對賺錢有興趣，想當老闆的人。 4. 對服務有興趣，積極學習，不斷提升能力。 5. 具汽、機車駕照。 【薪資】 前三個月：底薪 33000~40000區間 通過考核：底薪 33000~60000區間+個人工作獎金+公司配給獎金 ※薪資，我們會依照你的工作表現與能力展現成果來適時地給予調整。※ 【休假】 依行政機關行事曆公告當月應休幾日為依據配合排休。
全勤獎金年節獎金員工生日禮金年終獎金三節獎金 - 月薪33000~45000元 新北市三峽區 工作經歷不拘 3天前展開
1.認識、學習操作及維修牙醫器材設備 2.指導患者做好口腔衛生及保健 3.協助牙醫師看診跟看診前準備器械 讓看診流程順暢 4.器械消毒、Ｘ光攝影之清潔及準備 5.接受診所課程，提升自我的醫療專業度 有意從事牙科助理 願意長期從事正職工作 無誠勿試 有經驗者優先錄取，無經驗歡迎加入 星期日上班者另有假日津貼 上班時間：一周休二日 *一個月上滿44診
產假產檢假安胎假全勤獎金年終獎金 - 時薪210~250元 台北市內湖區 工作經歷不拘 3天前展開
1.不需跟專職輔導老師一樣，但也要有部分輔導解題能力 2.行政助理，協助導師排課派課、現場管理 福利：有全勤獎金、有代班獎金、可免費參加每次段考同樂會用餐、可免費參加尾牙。
三節獎金不用補班員工在職教育訓練良好升遷制度 - 時薪210~250元 台北市內湖區 工作經歷不拘 3天前展開
1.不需跟專職輔導老師一樣，但也要有部分輔導解題能力 2.行政助理，協助導師排課派課、現場管理 福利：有全勤獎金、有代班獎金、可免費參加每次段考同樂會用餐、可免費參加尾牙。
三節獎金不用補班員工在職教育訓練良好升遷制度 - 1111南台灣職場小語
【推薦給你】可週休二日(或固定休六日)、月薪３萬起工作機會！
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 月薪32000元 台北市中正區 工作經歷不拘 今天展開
💼【業務助理】熱烈招募中！ 你是擅長管理時間與處理多項任務的高手嗎？對細節有驚人的專注力且充滿團隊精神？那麼你就是我們正在尋找的一員！ ✨ 工作內容： 1. 客戶關係管理：協助業務快速完成訂單流程，提供準確又貼心的服務。 2. 行政庶務處理：負責文件整理、資料輸入等，確保所有資料都一絲不苟！ 3. 業務支援：需要的時候協助公司產品送貨，讓每張訂單都能順利完成。 4. 活動協助：定期參與展覽或課程研討會，為團隊出一份力！ 5. 時間管理：智慧地安排工作優先級，成為主管的強力後盾！ 🎯 加入我們，感受團隊活力十足的氛圍，並成為不可或缺的一環！準備好迎接挑戰並在工作中尋找成就感了嗎？期待看到你的加入！👏
就業保險員工生日禮金年終獎金激勵獎金績效獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16567&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16568&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪30000~32000元 台南市中西區 無工作經驗 2天前展開
1、協助專業技師執行各項查檢勤務工作。 2、協助處理一般文書建檔歸檔及追蹤之行政工作和工務資料庫管理。 3、負責各項工具/物料管理(含進料、接料、檢查庫存備料)。 4、差勤管理系統登入與管理、請(維)修單執行與追蹤。 5、負責製作會議記錄並追蹤處理決議事項。
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