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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 18天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22578&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 18天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪40000元 高雄市楠梓區 工作經歷不拘 4天前展開
我們是一家專注於先進半導體技術的公司，致力於為全球客戶提供高效能半導體製程解決方案。我們的服務主要涵蓋製程技術研究、設備管理以及跨領域技術合作，服務對象包括全球知名科技公司與製造業客戶。 須配合無塵室環境並接受派駐日本。 工作內容： 1. 負責開發和優化半導體製程技術，包括製造工藝設計與數據分析，確保新產品製程順利導入量產。 2. 熟練操作半導體製程設備，進行相關製程數據的分析及效能提升。 3. 執行設備日常維護及故障排除，撰寫設備技術報告，並進行技術升級和改善。 4. 分析製作晶片設計規格，參與IP演算法研究及數位模組設計。 5. 測試半導體元件與積體電路，對設備進行精確調試及檢測。 6. 負責無塵室設備的日常維護，並制定設備保養計畫以確保生產順暢與提升產品良率。 7. 與跨部門技術團隊進行協作與技術支持，協助處理製程相關問題。 8. 撰寫技術文件與申請專利，密切關注技術發展與市場趨勢。 我們歡迎對尖端半導體產業充滿熱忱的人才加入我們的行列！加入我們的團隊，您將有機會參與全球範圍的技術專案，見證和塑造科技的未來。立即投遞履歷，我們期待您的加入！
全勤獎金年節獎金年終獎金三節獎金意外險 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 18天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 18天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
- 月薪38000元 台中市后里區 工作經歷不拘 2天前展開
1.現場安全衛生管理 2.工地安全衛生巡檢與稽核 3.工安報表文書作業 4.其他安全衛生管理及交辦事項 ※ 至少需具備乙級職業安全衛生管理技術士 ※ 具工安經驗或環安衛科系畢業者尤佳 ※ 具經驗者，薪資另議
國內、外旅遊補助社團補助員工在職教育訓練就業保險產假 - 1111南台灣職場小語
徵【助理】無經驗可、週休二日/固定休六日
- 面議（經常性薪資達4萬元或以上） 台北市南港區 工作經歷不拘 5天前展開
1.規劃個人金融產品數位流程 2.規劃個人金融產品風險控管平台 3.評估及導入新技術及工具
家庭日員工結婚補助生育補助員工及眷屬喪葬補助良好升遷制度 - 面議（經常性薪資達4萬元或以上） 新北市土城區 工作經歷不拘 5天前展開
1.FW 對接與需求管理 • 擔任對內、外之 FW 單一溝通窗口。 • 統整 HW / 系統架構需求，並轉譯為 FW 規格。 • 評估 HW Change 及客戶變更對 FW 的影響度與風險。 2.FW Release 進度管控 • 規劃並追蹤 FW Release Schedule 全局時程。 • 嚴格管控 Code Freeze、Alpha / Beta / SIT 等關鍵里程碑。 • 跨部門協調、排除 Release 過程中的關鍵阻礙（Blockers）。 3.FW 驗證與品質把關 • 追蹤 FW 驗證進度。 • 主導 Bug Review、Re-test 與 Bug Closure 的協調流程。 • 評估 FW 品質狀態，作為是否具備正式 Release 條件之決策依據。 4.版本控制與文件管理 • 維護與更新 FW Version List。 • 審查 Release Note、Known Issues 等核心技術文件。 • 負責 Team Center 檔案之歸檔落實度與資料完整性稽核。
- 面議（經常性薪資達4萬元或以上） 新北市土城區 工作經歷不拘 5天前展開
1、負責 AI Data Center 系統級熱流模擬分析，評估整機/Rack 散熱性能。 2、偕同不同function team跨功能團隊合作，進行熱流驗證、問題分析與改善。 3、進行熱流模擬新技術導入與研究，提升分析效率與準確性。 4、執行熱流模擬工具二次開發及流程優化。 5、使用 CFD 模擬工具進行電子散熱與資料中心冷卻分析。
- 月薪35000元 桃園市龍潭區 工作經歷不拘 4天前展開
1. 定期維修保養、異常緊急處理、系統維護與巡檢並確保設備運作正常。 2. 監督工程/新設備的導入、配置、安裝與確保符合公司需求。 3. 監督與協調施工業者，確保施工品質及進度符合公司標準。 4. 記錄、統計、分析廠務系統運作資料，如有必要提案改善建議。 5. 維護暨管理工廠電力、弱電、空調、用水、廠務設備等系統。 6. 整理並撰寫設備導入及修繕的詳細記錄與報告，供內部參考與後續評估。 7. 其他主管交辦事項 8.做為儲備幹部訓練 年薪約15個月~17個月(依公司營運狀況及個人表現調整)
需穿著員工制服員工在職教育訓練良好升遷制度員工生日禮金年終獎金 - 月薪30000~45000元 台南市永康區 工作經歷不拘 2天前展開
【職務名稱】 工程會計／起重調度行政專員 【工作待遇】 1. 月薪 30,000～45,000 元（依學經歷、工作經驗及能力敘薪）。 2. 具工程會計、起重會計相關經驗者，薪資可依能力另議。 【工作內容】 1. 辦理工程案件及起重業務之請款、收付款、應收及應付帳款等相關作業。 2. 處理發票開立、帳務整理、銀行往來及會計憑證管理。 3. 協助工程計價、工程結算、請款資料整理及帳務核對。 4. 安排司機出勤、吊車派工及車輛調度，追蹤案件執行情形。 5. 定期至安定車廠收集司機簽單，整理、核對並彙整相關作業資料。 6. 管理車輛保險、定期檢驗、證照及相關文件資料。 7. 整理工程合約、請款文件及專案資料，並建檔、歸檔與維護。 8. 協助工程成本、專案收支及營運報表整理與分析。 9. 跨部門協調工務、司機、客戶及廠商，追蹤案件進度並協助問題處理。 10. 完成主管交辦事項。 【應徵條件】 1. 熟悉 Word、Excel 等文書作業。 2. 具基本會計帳務觀念及數字敏感度。 3. 細心負責，具良好溝通協調能力。 4. 具起重會計、工程會計或營造業會計相關經驗者佳。 5. 熟悉工程請款、工程成本、派工調度或相關工程行政流程者優先。 【工作發展】 1. 完整學習工程請款、工程會計及起重調度等實務流程。 2. 培養工程成本分析、專案管理及跨部門協調能力。 3. 提供教育訓練及多元學習機會，鼓勵持續成長。 4. 視個人能力及工作表現，提供職務發展及晉升機會。 【薪資與福利】 1. 年終獎勵（依公司營運及個人工作表現核發）。 2. 年度薪資調整機會（依工作能力、工作表現及公司整體營運狀況評估）。 3. 績效獎勵制度（依公司制度及個人工作表現核發）。
全勤獎金年終獎金員工聚餐下午茶禮品 - 月薪42000元 台北市大安區 無工作經驗 3天前展開
1.具廠房環境衛生管理與食品檢驗經驗 2.相關食品科系畢業 3.執行主管交辦事務 4.具食品相關行業實務工作經驗 5.具有食品安全HACCP 證照60A 60B 6.週休二日與國定假日均休 7.有無經驗皆可 . 歡迎應屆畢業生皆可
尾牙員工國內、外進修補助員工在職教育訓練良好升遷制度需穿著員工制服 -
