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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 桃園市平鎮區 工作經歷不拘 2天前展開
本職位負責擔任智動化工程師，根據DFM開發自動化程式與優化現有系統，以提升製造效率，支援產品的智能化發展。 主要職責: 1. 透過python對CAM現有系統做手稿開發與維護，在符合DFM情況下，設計與開發智動化程式。 * 使用Python、API等工具，開發自動化CAM腳本，實現設計標準化、批量處理及重複性工作的自動化。 * 將演算法應用於CAM腳本開發，例如：形狀優化、拓撲優化演算法等。 2. 學習自動化量測技術，並對現有自動化量測系統做開發與優化。 * 使用 VBA、Python、API等工具，開發自動化量測腳本，實現設計標準化、批量處理及重複性工作的自動化。 3. 設計數據分析與優化，從製造數據和設計文件中提取數據，進行分析，找出設計中的瓶頸和改進空間。 4. 技術支援與協調: * 為CAM工程師、量測工程師提供智慧設計工具的操作指導與技術支援。 * 與跨部門團隊合作，共同推進智慧設計的應用和落地。 * 參與設計標準的建立與更新，確保設計符合規範和智能化要求。
產假全勤獎金年節獎金員工生日禮金年終獎金 - 月薪43000~43000元 台北市中山區 工作經歷不拘 30天前展開
1監督及參與建築及設備之清潔、修理及維護 2具親和力維持住戶公共安全，消除火災、竊盜或其他 危險 3操控照明、取暖、空氣調節及通風設備 4收發信件跟寄物登記 5接應訪客，確認來訪人員意圖以確保安全 6樓面管理與服務、廠商連繫與開發 7負責門禁管制訪客登記、訪客車輛登記、大廈巡邏硬 體設備、防竊作業及竊盜處理工作等安全維護工作
年節獎金員工生日禮金意外險員工團保免費供餐 - 月薪40780元 新竹縣湖口鄉 工作經歷不拘 2天前展開
1.制訂製造程序與產品標準。 2.評估製程專案計劃，訂出最適化的製造流程。 3.負責新產品製程的導入，並進行製程的檢測，以使新產品能夠穩定生產且符合相關標準。 4.定期檢測製程設備的重點參數。 5.持續改善現有生產製程。 Job Descriptions 1. Establish manufacturing procedures and product standards. 2. Evaluate the manufacturing process project plan and establish the optimal manufacturing process. 3. Be responsible for the introduction of new product manufacturing processes and testing of the manufacturing processes in order that new products will be produced stably and comply with relevant standards. 4. Regularly check up the key parameters of the equipment in the manufacturing processes. 5. Continuously improve existing production processes.
三節獎金績效獎金旅遊假意外險員工團保 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 8天前展開
1. 負責自動化專案之設計、開發、維運與技術文件撰寫。 2. 參與企業內部流程優化與自動化解決方案開發。 3. 協助自動化系統建置、測試、除錯及效能調整。 4. 配合業務團隊推動流程自動化改善專案。
- 面議（經常性薪資達4萬元或以上） 屏東縣內埔鄉 工作經歷不拘 3天前展開
1. 推廣畜牧用藥品，進行產品、用途及療效專業說明。 2. 規劃並執行銷售計劃，提升區域市場佔有率。 3. 定期拜訪客戶，建立並維持良好的客戶關係。 4. 主動開發潛在客戶，拓展公司產品市場。 5. 參與畜牧相關展覽和會議，提升品牌影響力。 6. 收集市場資訊與競品分析，支持業務決策。 7. 處理客戶產品相關問題，提供適當售後服務支持。 8. 撰寫銷售報告，定期向管理層回報業績與計劃。 9. 負責產品報價及產品展示，並處理帳款回收相關事宜。 **需有動物用藥業務經驗者為主** 可專攻專案客戶，拓展市場。
產假全勤獎金年終獎金禮品績效獎金 - 月薪47000~47000元 新北市林口區 工作經歷不拘 3天前展開
1.巡邏案場公共區域，維護現場安全與安寧 2.監控案場進出人員與車輛 3.操作監視系統設備，隨時注意異常狀況並即時通報 4.執行夜班安全檢查，確保消防設備及逃生路線通暢 5.處理案場夜間突發狀況，與相關單位保持即時聯繫 6.提供訪客指引與諮詢服務，必要時協助現場秩序維護 7.完成主管指派之其他保全相關任務，維持案場最佳管理品質
年節獎金員工生日禮金三節獎金績效獎金意外險 - 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 工作經歷不拘 今天展開
1. 驗證計劃提案(客戶需求、項目目標、時間表等相符) 2. 成本分析 3. 製造設備評估及提案 4. 產品商品化 5. 專案時程規劃及控管 6. 開發流程標準化控管 7. 專案風險管控 8. 跨部門溝通協調 9. 客戶需求定義 10. 其他主管交辦事項
年節獎金年終獎金激勵獎金績效獎金伙食津貼 - 1111南台灣職場小語
【推薦給你】可週休二日(或固定休六日)、月薪３萬起工作機會！
- 月薪43000元 新北市中和區 工作經歷不拘 9天前展開
1.接待新住戶 2.執行社區大樓安全巡邏與周邊環境檢查 3.確保門窗安全，防範外部入侵及竊盜事件 4.處理緊急情況並執行安全及消防應變措施 5.協助住戶接待與訪客登記，引導進出動線 6.執行安全事件記錄，並撰寫管理與報告作業 7.門禁管理、操作基本電腦系統 8.車道門禁
全勤獎金年終獎金禮品需穿著員工制服員工在職教育訓練 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Opening roles for you: 1. Global Procurement and Supply Planning Professionals 2. Global Logistics Digital Transformation Engineer 3. Responsible Supply Chain Management Engineer 4. Supply Chain Auditor 5. Resource Recovery Management Engineer For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16580&source=1111&tags=AO+2026_1111 Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Our key responsibilities include: 1. We ensure customers‘ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency and reach profit maximization. 2. We drive for business effectiveness to bring world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. 4. We seek individuals who meet the following criteria: (1) Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. (2) Have skills in logic thinking and communication, learning agility, and business acumen. Opening roles for you: 1. Account PC Planner 2. Fab Production Control Planner 3. Fab Rationalization Engineer 4. Operation Resources Planning Engineer 5. DevOps Engineer 6. ML/AI Engineer 7. Corporate Planning Associate For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=16579&source=1111&tags=AO+2026_1111 Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16564&source=1111&tags=AO+2026_1111 因為期待無限可能，所以選擇台積電！ 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境，並提供高於業界平均水準的薪酬與福利。加入台積電，您將有機會與世界一流的卓越夥伴共事，透過最先進的製程技術，共同成就改變世界的偉大事業。每一項突破與創新，都凝聚了我們的努力與心血。 2026年台積電預辦登積計畫：招募2026年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您，透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會！ 參與2026年預聘暨研發替代役熱門職缺，您將可： ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日：2025/10/31 如您對此計畫感興趣，台積電將前往校園辦理實體行動徵才車活動；活動當天不僅請您喝咖啡，並安排畢業校友與同學們互動交流，機會難得敬請把握機會。校園場次與報名資訊請參考官網（如未報名成功，也歡迎至現場和台積人資互動，現場投遞履歷，還可抽《限量》積星神秘小禮！） 此外，我們特別為同學安排了校園徵才實體與線上說明會，歡迎踴躍報名參加，以便了解公司市場趨勢、組織概況，並掌握求職技巧！報名連結：請參考官網 建議您根據學習領域與專業，投遞申請以下2~4個職位。符合主管需求者，將會收到面談邀請通知。 ▋歡迎志同道合的你，一起加入台積電 ▋世界上的每一個夢，都由我們來圓夢 Because we believe in endless possibilities, we choose TSMC! TSMC offers a wide variety of fulfilling experience and opportunities across our organization in many different locations. By joining TSMC, you will work with the high-performing teams in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. 2026 TSMC Advanced Offer and R&D Substitute Service Program Welcome to submit your resume via our application systems and apply to the following vacancies : 2026 TSMC Advanced Offer(AO) and R&D Substitute Service Program (RDSS). You will then be able to: • Get the offer before graduation. • Work with professional experts in the industry. • Fulfill yourself on the world stage. Application Deadline: October 31, 2025 Attending Campus Recruitment events with TSMC to enjoy a coffee with the industry experts to find out what suit you the best. For campus event schedule and registration details, please refer to TSMC career website (even if you are unable to register successfully, feel free to visit our booth and have a chat with us.) Submit your resume now, and gain a chance to win a limited TSMC’s gift! We’re also organizing a series of 〝TSMC Campus Recruitment Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We’re also organizing a series of 〝TSMC Campus Recruitment On-Site & Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We recommend you applying for two to four positions based on your academic background and professional expertise. If your qualifications meet the position requirements, you will receive an invitation for interviews. ▋Join TSMC｜Together, We Grow ! 2026 TSMC AO&RDSS Recruitment Job (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D) 1-2 Design and Technology Platform Engineer (DTP) 1-3 Specialty Engineer (Specialty) 1-4 Integrated Interconnect & Packaging Engineer (IIP) Operations (營運組織) 2-1 Process Integration Engineer (PIE) 2-2 Process Engineer (PE) 2-3 Equipment Engineer (EQ) 2-4 Intelligent Manufacturing Engineer (IMC/MFG) 2-5 Facility Engineer (FAC) 2-6 Product Engineer (PE) 2-7 Advanced Packaging Technology and Service Engineer (APTS) 2-8 Quality & Reliability Engineer (Q&R) 2-9 Module Associate Engineer (MAE) Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT) 3-2 Corporate Planning Organization (CPO) 3-3 Materials Management Engineer (MM) 3-4 Human Resources Specialist (HR) 【履歷填寫重點提醒】 1. 請務必優先填寫完成「畢業學校、畢業年份、就讀科系」後再更新履歷細節資訊，在系統資料送出後，您仍可以在收到面試邀請前持續更新內文。 2. 請詳細填寫履歷資料，包括學歷、專業關鍵字及自傳等內容；若您非外籍人士，除專業關鍵字外，其他欄位請以全中文填寫即可。 3. 自傳與專業關鍵字欄位有字數限制(1000字)，請確認字數是否符合要求，以免導致網頁無法成功送出。 4. 若履歷欄位為下拉式選單，當找不到合適內容時，可點選「其他」手動資料送出。 更多2026預聘暨研發替代役招募活動，請密切關注台積電FB粉絲專頁@加入台積 共創奇蹟 【Notes for Resume Submission】 1. Please prioritize completing the 〝Graduation School, graduation year and major〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. 4. If a resume field is presented as a dropdown menu and you cannot find a suitable option, you may select 〝Other〝 and manually submit the required information. For more information about the 2026 Advanced Offer (AO) and R&D Substitute Service Program (RDSS), please follow our TSMC Facebook fan page@加入台積 共創奇蹟
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.
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