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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16567&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16568&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16570&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16571&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 9天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16572&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 機台是工廠穩定運作的基礎，我們在生產線上，負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題；如此可減少機台當機的時間與提升機台可運轉的時間，進而降低生產成本並提升公司的獲利能力。 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪70000元 彰化縣大城鄉 工作經歷不拘 1天前展開
1.醫師處方之調劑 2.藥品管理 3.關心病人的用藥與病人溝通正確用藥知識 4.OTC銷售(完全無業績壓力) 5.(排班彈性月休8-10天)休假天數比照勞基法 6.享有團保 勞健保 6％提撥 7.本藥局為複合式健保藥局非一般門前藥局
全勤獎金員工生日禮金年終獎金三節獎金意外險 - 面議（經常性薪資達4萬元或以上） 台北市大同區 工作經歷不拘 5天前展開
1. 確保前台運作流暢 2. 協助客人並提供旅客諮詢服務 3. 確保賓客服務標準一致，提升顧客滿意度 4. 處理賓客抱怨、突發狀況及特殊需求 5. 辦理客人進房、退房、結帳作業 6. 總機、出納等相關作業 7. 具服務熱忱、合作精神、協調力，能與團隊成員合作達成任務 8. 協助主管交辦事項
年節獎金員工生日禮金年終獎金三節獎金禮品 - 1111南台灣職場小語
徵【助理】無經驗可、週休二日/固定休六日
- 月薪43000~52000元 台中市北屯區 工作經歷不拘 3天前展開
▲目前職缺店家▲ 【湯棧鍋物】 中清店-台中市北屯區中清路二段1037號 ★薪資福利 儲備幹部需配合輪班(早班/中班/中空班/晚班) 月薪43000-52000 (需輪班， 加班費另算 ) ★月休９天、國定假日補休或雙薪、聚餐、生日餐卷、春酒、除夕休假、員工旅遊、中秋禮盒、用餐折扣、供膳等 ▲ 具服務熱忱，對餐飲管理有興趣。 ▲ 願意接受培訓計畫的挑戰。 ▲ 具管理潛能及抗壓性 。 ▲ 協助主管及各項工作安排，具高度責任心。 ▲ 能協助伙伴工作並教育訓練。 ▲ 顧客經營諮詢慰問處理。 ▲ 妥善營運管理，了解食材並開源節流控管成本。 ●職務內容 【內場】各項食材準備及擺盤、品質控管、內外出餐前置作業、協助營運管理內場營運等。 【應徵方式】 1.請先投遞履歷，如通過審核，人資部將以電話通知安排面試。 2.若您接獲面試通知，請下載履歷表填妥後，攜帶履歷前來面試。 履歷下載連結網址: http://bit.ly/2D4p6YB
產假全勤獎金禮品員工團保免費供餐 - 月薪40000元 台北市士林區 工作經歷不拘 今天展開
1. 巡視建築及周邊區域，檢查門窗及設施狀況，確保環境安全無虞。 2. 操控監控設備與記錄系統，分析人員進出及監測異常活動。 3. 即刻應對警方案件與突變狀況，保護建築與住戶安全。 4. 執行消防設備巡檢，熟練緊急應變流程並提供急救支持。 5. 定期檢查與維護公共設施，維繫高品質使用環境。 6. 負責訪客登記與整理記錄，提供住戶問題協助與溝通服務。
員工生日禮金年終獎金禮品生日假意外險 - 月薪67000元 新竹市 工作經歷不拘 3天前展開
1. 參與新藥研發專案之規劃、申請、執行及管理，帶領團隊完成各項研發目標。 2. 進行新藥研發前臨床評估實驗設計、試驗執行、數據分析及報告撰寫。 3. 與跨領域團隊合作，進行新藥專利申請、技術移轉及產業化推廣等工作。 4. 其他主管交辦事項
良好升遷制度就業保險產假產檢假安胎假 - 月薪62000~120000元 桃園市中壢區 工作經歷不拘 4天前展開
① 日式采耳 ② 做臉服務 ③ 全身SPA指油壓按摩 ④ 無業績壓力 ⑤ 無腳底按摩 ⑥ 無推銷產品/票卷
年節獎金分紅入股員工生日禮金三節獎金禮品 - 月薪62000~120000元 桃園市中壢區 工作經歷不拘 4天前展開
① 日式采耳 ② 做臉服務 ③ 全身SPA指油壓按摩 ④ 無業績壓力 ⑤ 無腳底按摩 ⑥ 無推銷產品/票卷
年節獎金分紅入股員工生日禮金三節獎金禮品 - 月薪40000元 新北市中和區 工作經歷不拘 6天前展開
工作技能需求： 【1】協助開發工業顯示器/工業電腦機殼之結構設計與圖面繪製。 【2】依照實品1:1相容繪製能力。 【3】使用 2D／3D 軟體製作零件圖、組立圖。 【4】圖面渲染擬真需求。 【5】管理與更新產品BOM表、圖檔與相關技術文件。 【6】與業務、內勤同仁溝通，落實產品製作細節。 【7】完成主管交辦事項。 【8】具備小客車駕照。 【9】須配合到現場量測/試安裝，與業主溝通。 【10】據相關學經歷者佳。 【11】試用期過後會有額外個人製圖獎金(論件)。 我們最重視： - 肯學習的心態：擁有願意學習、不計較的態度，是我們最看重的特質！ - 歡迎加入：我們非常期待你能成為團隊的一份子，共同打拼、成長。 注意事項： - 工作繁忙，有意者請直接投遞履歷，請勿來電洽詢，謝謝您的理解！
年終獎金三節獎金員工聚餐勞保健保 - 月薪45000~46000元 新北市林口區 工作經歷不拘 4天前展開
1.負責商業大樓早班大廳安檢及出入登記作業 2.操作監控設備監視公共區域維持安全環境 3.檢查公共設施狀況，回報設備異常並協助維修單處理 4.巡邏大樓及周邊區域，確保無異常情況發生 5.提供住戶或訪客指引與基本諮詢服務 6.管理進出貨物搬運車輛登記及管制 7.即時處理突發安全事件，與主管及相關單位聯繫
年節獎金員工生日禮金三節獎金員工團保員工結婚補助 -
