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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 台北市士林區 工作經歷不拘 今天展開
1.接待客人並安排諮詢及回診事宜 2.熟練操作醫療系統進行客卡資料管理 3.病歷文書管理以及影像病歷管理 4.管理診所零用金及負責結帳對帳作業 5.維持候診區清潔並整理日常用品庫存 6.熟悉Microsoft Office製作報表及文書
勞保健保 - 月薪35000~42000元 彰化縣二林鎮 工作經歷不拘 2天前展開
工作內容： 1. 工程現場的管道安全監督和環境衛生檢查，確保作業規範。 2. 執行配管作業相關的安全稽核，並制定必要的預防措施。 3. 進行施工現場巡查，確保管道施工符合職業安全衛生法規。 4. 管理並維護安全相關設備，定期檢查並提出改善建議。 5. 提供安全教育訓練，並對現場人員進行安全操作的輔導與檢核。 6. 協助制定緊急應變計畫，處理突發事故並檢討和改善。 7. 與工程團隊合作，評估施工現場的潛在風險並進行安全管理。 8. 製作相關安全報告及文件，並確保合於法規要求。 請來電0972282167、0989219832楊小姐
- 月薪40000元 新北市中和區 工作經歷不拘 2天前展開
1.負責總經理及重要主管之日常接送及行程安排 2.確保車輛於行駛前進行檢查及保養維護 3.熟悉路線與交通狀況，確保準時抵達目的地 4.處理車輛內外清潔，提供舒適乘車環境 5.應對臨時行程調整，靈活安排最佳行車路線 6.協助完成相關文件或包裹的送達與接收 7.確保行車安全並遵循公司及交通相關規範
績效獎金國內旅遊國外旅遊員工聚餐尾牙 - 月薪30000~35000元 宜蘭縣宜蘭市 工作經歷不拘 2天前展開
＜維修人員(學徒or師傅)＞ •工作內容 1.協助本店機器修繕服務(維修品大多為小型引擎農機) 2.主動與客戶溝通修繕事宜(報價、告知取件、維修狀況等) 3.維修顧客之接待與需求服務，維護客戶關係 4.協助門市銷售機器時，新機器之發動測試、錯誤排除 5.維修之餘，協助門市服務部之庶務事項(帶看貨物、補貨等) 6.組裝機器、農機具、二次加工貨物等 7.協助主管交辦事務處理 8.協助保持環境整潔 •具備能力 ⑴須擁有服務的熱忱 ⑵具備抗壓性、效率、細心及責任感 ⑶具備解決問題及團隊溝通之能力 ⑷具備不排斥學習新事物的熱忱 •加分條件 ⑴曾從事服務業相關工作(五金、賣場等) ⑵台語溝通能力順暢 ⑶熟悉電腦文書系統操作（Excel、Word) (4)擁有汽車or機車駕照 (5)熟悉維修技能及故障排除 •休假制度 排休＋固定休（達年資享有法定特休） •福利 (1)全勤獎金、年終獎金、維修績效獎金 (2)定期員工聚餐、不定期員工旅遊 (3)享有員購福利 歡迎所有求職者
全勤獎金年節獎金績效獎金員工聚餐尾牙 - 月薪30000~50000元 桃園市蘆竹區 工作經歷不拘 2天前展開
📢【加入政和地政士聯合事務所】成為專業地政幕後推手！ 你是否正在尋找一份穩定、具專業發展空間，又能逐步邁向地政士之路的工作？ 你是否細心負責、對土地與不動產相關業務充滿興趣？ 政和地政士聯合事務所正在尋找一位值得信賴的 代書助理， 在這裡，你不只是個行政人員，更是未來地政士的儲備戰將！ –––––––––––––––––––––––––––––––––––––––– 💼【工作內容 | 你將參與的專業任務】 ▸協助辦理土地及建物標示、權利變更等登記業務 ▸代理民眾向政府機關提出土地登記申請 ▸撰擬契約、申請書、協助房地產仲介事務 ▸對接地政、戶政、國稅局等機關申請資料 ▸事務所提供完整培訓，協助你成為合格簽約代書 –––––––––––––––––––––––––––––––––––––––– 💥【職缺資訊】 • 工作性質：全職 • 工作時間：日班 08:30 ~ 18:00 • 休假制度：週休二日(六、日) • 工作地點：桃園市蘆竹區中山北街1號5樓 • 待遇範圍：薪資依資歷與績效調整 –––––––––––––––––––––––––––––– 【我們提供的】 - 穩定的工作環境與明確的職涯路線 - 從實務中學習代書專業，打造你未來的專業身分 –––––––––––––––––––––––––––––––––––––––– 🍳【我們希望你具備...】 ☑ 有2年以上代書事務所經驗或相關科系畢業者尤佳 ☑ 細心、有責任感，願意學習、願意成長 ☑ 需具備機車與自排小客車駕照 –––––––––––––––––––––––––––––––––––– 🌱你不是一個人努力，我們是一個團隊，一起成長！ 在政和，不只是工作，而是一場專業與責任感的養成旅程。 如果你準備好了，歡迎加入我們的行列，踏上不動產法律專業的職涯之路！ 📩 立即投遞履歷，讓我們看見你的專業與潛力！
全勤獎金員工生日禮金年終獎金三節獎金旅遊假 - 1111南台灣職場小語
【推薦工作】行政內勤、行政助理｜無經驗可，享週休二日！
- 時薪200~200元 基隆市仁愛區 工作經歷不拘 2天前展開
🔹 工作內容 ・協助特殊需求幼兒的日常生活與課程活動 ・配合導師進行教學與情緒行為輔導 ・維護教室秩序與安全 ・與教師家長保持良好溝通與合作 🔹 工作時間與待遇 ・每日工作4小時，實際排班時段由園方安排，工作時段介於08:00–20:00之間 ・時薪新台幣200元 🔹 條件要求 ・學歷：專科以上畢（幼保、特教相關科系尤佳） ・有相關經驗者尤佳 ・具愛心、耐心、責任感，樂於團隊合作 = = = = = = = = = = = = = = = = = = = = 🔹為提升對特殊需求幼兒的支持與陪伴，本園誠摯邀請您加入教育夥伴行列，一同用愛守護孩子的成長。
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 2天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16573&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化，滿足客戶交期，為公司帶來營收；身為工廠的第一線管理者，需掌握生產流程，藉由良好且精準派工提升機台生產效率，帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer 2. CIM Intelligent Manufacturing Engineer 3. Data Analyst & Data Scientist 4. AMHS (Automated Material Handling System) Engineer 5. PIDS/WAT (Wafer Acceptance Test) Engineer 6. PIDS/NTO (New TapeOut) Engineer 7. Quality Management Engineer
- 月薪28590~37912元 雲林縣斗六市 工作經歷不拘 2天前展開
1.辦理病患出、入院相關作業流程手續。 2.每日登錄病人使用各項醫療、護理處置、衛材之計價及漏帳費用之催繳。 3.請領及請購醫材，庫房管理之大量點滴、衛材、各項表單、日常用品的補充與歸類。 4.臨時交辦事項。
績效獎金三節獎金年終獎金年節獎金員工體檢 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 2天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16574&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源，提供晶圓生產所需之電力、水、氣體、化學品、空調等，為台積高度智慧自動的生產單位，供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任，如何精進節水、節能、減碳、環保的廠務運轉技術，更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for the planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system is operating at the highest level of quality when on duty. 4. Construction management & project coordination.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 2天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology.
- 時薪190~190元 桃園市八德區 工作經歷不拘 2天前展開
1.熟悉使用掃把、拖把和吸塵器等清潔工具進行環境清理 2.負責廢棄物分離與資源回收處理，熟悉回收分類規範 3.執行園內公共區域走廊及衛生間的日常清掃與保養 4.具備基本安全意識，熟悉清潔用品使用安全及其應用方法 5.適時提供日常垃圾清理，維持室內外整潔與衛生標準 6.協助處理特殊清潔要求，應對緊急清潔情況 7.適度與小朋友互動，確保清潔時兒童活動的安全 8.愛乾淨潔癖的你歡迎加入~
勞保健保 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 2天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16576&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production.
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