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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
- 月薪30000~35000元 新竹縣竹北市 1年工作經驗 42天前更新展開
1.協助工程師處理及彙整相關資料與行政作業。 2.工程文件及檔案的歸檔。 3.製作工程送審文件及竣工資料。 4.物資管理與費用報銷。 5.主管交辦事項。 ※熟練文書作業、具工程行政工作經驗者佳。 ※此為約聘職，聘期約一年，期滿視工案進度調整聘期。
國內、外旅遊補助社團補助員工在職教育訓練就業保險產假 - 面議（經常性薪資達4萬元或以上） 台中市大雅區 3年工作經驗 3天前更新展開
1.負責客戶關係維護及產品專案管理，確保專案執行順利 2.規劃並控管專案進度、成本與品質，以達成專案目標 3.協調跨部門資源並解決專案執行問題，提升專案執行效率 4.進行市場開發與市場趨勢分析，發掘潛在商機 5.制定並執行銷售策略，達成公司營運與銷售目標 6.管理客戶訂單與交付流程，維持良好客戶關係 7.完成主管交辦事項
- 面議（經常性薪資達4萬元或以上） 新北市土城區 7年工作經驗 3天前更新展開
【主要工作職責】： 1.國際租稅新知分析與應對，如Pillar II等。 2.稅務籌劃、投資架構與交易規劃。 3.稅收優惠政策分析與申請。 4.併購交易稅務盡職調查。
- 月薪80000~100000元 新北市土城區 10年工作經驗 3天前更新展開
一、依據全球採購策略，制定庶務與服務及實體物料品類的採購方針、策略與年度成本節降目標。 二、建立標準化作業流程及制度，涵蓋服務與實體物料採購之招標、議價、驗收與付款管理。 三、負責集團庶務與服務類及相關物料採購作業，推動集中採購與框架合約機制，提升議價效益與採購效率。 四、主導供應商管理，包括準入、分級、績效評估及淘汰制度，確保品質、交期與成本穩定。 五、導入數位化採購平台（eProcurement），強化採購透明度與報表自動化，確保實體物料採購數據可追溯。 六、監督服務外包品質與物料交付成果，建立量化 KPI（服務品質、物料合格率、交期達成率）。 七、推動 ESG 與綠色採購政策於庶務、服務及物料品類中落地執行，支持集團永續發展目標。 八、與園區運營、行政、財務、法務、人資等部門協同合作，確保採購服務與物料供應支援營運需求。 九、持續優化成本結構，推動跨區域集採、區域中心採購整合與供應鏈在地化策略。
- 面議（經常性薪資達4萬元或以上） 新北市土城區 5年工作經驗 3天前更新展開
工作內容： ✨ 我們正在尋找充滿熱忱、勇於接受挑戰的人才，攜手參與全球領先的 AI Server 專案，共同創造產品價值。 1.維護及建立量產後的伺服器產品物料清單（BOM），確保資料正確性、完整性並即時更新。 2.管理量產後的伺服器產品相關文件，包含組裝文件（Assembly Guideline）、機櫃走線圖（Cable Routing）、標籤規格（Label Specifications），確保工廠生產文件一致。 3.跨部門協調量產問題改善，協助分析並追蹤產品於量產階段的系統異常與品質議題，與PM、研發設計、製造單位共同推動問題解決。 4.發起工程變更需求並執行，優化伺服器產品設計及替代料導入，提升產品品質、供料彈性與生產效率。 ************************************************************************************************************************************************************* 1.Manage and maintain Bill of Materials (BOM) for mass production Server products, ensuring data accuracy, completeness, and timely updates. 2.Maintain engineering documentation for mass production Server products, including Assembly Guidelines, Cable Routing and Label Specifications. 3.Drive cross-functional resolution of production, system, and quality issues by working closely with PM, NPI teams and Manufacturing sites. 4.Initiate the Engineering Change Requests (ECR) to optimize server design and manage second source qualification.
- 面議（經常性薪資達4萬元或以上） 高雄市大寮區 2年工作經驗 3天前更新展開
1. 配合資安查核,矯正缺失管理與追蹤 2. 資安教育訓練與資安宣導與技術支援 3. 負責各類資安系統維護(防毒、WSUS) 4. 終端設備維運與管理 5. HelpDesk窗口 6. 上級主管交辦事項
- 月薪38000元 台中市后里區 工作經歷不拘 42天前更新展開
1.現場安全衛生管理 2.工地安全衛生巡檢與稽核 3.工安報表文書作業 4.其他安全衛生管理及交辦事項 ※ 至少需具備乙級職業安全衛生管理技術士 ※ 具工安經驗或環安衛科系畢業者尤佳 ※ 具經驗者，薪資另議
國內、外旅遊補助社團補助員工在職教育訓練就業保險產假 - 月薪80000~150000元 新北市土城區 工作經歷不拘 3天前更新展開
一、依全球採購策略制定工程類採購計畫與年度預算目標。 二、管理招標、比價、議標、決標與合約簽署等全流程發包作業。 三、建立技術與商務分審制度，確保公平競標與合理決標。 四、開發並維護工程供應商名錄，建立評分與資格審查制度。 五、推動框架合約、集中採購與長期合作，提升議價與協同效率。 六、進行工程造價分析與市場價格比較，建立標準化估價模板。 七、審核合約條款與付款條件，確保風險可控與合規。 八、與建設、設計、財務、法務及園區單位協作，確保工程執行順利。 九、監控供應商履約表現與品質評分，進行季度稽核與改善。
- 面議（經常性薪資達4萬元或以上） 新北市土城區 2年工作經驗 3天前更新展開
1.根據年度營運情況完成BU年度新產品專案及研發預算制定並建立費用管控機制 2.製作月度費用達成報告，與處/部檢討當月費用狀況，分析費用異常原因 3.完成部門專案工作(ex.ISO體系建置、職業安全衛生管理等)並交付成果
- 月薪100000~150000元 新北市土城區 10年工作經驗 3天前更新展開
一、策略規劃與流程標準化 •制定並推動全球園區Non-BOM採購策略與成本優化目標（含 VA (Value Analysis) /VE (Value Engineering) 推進）。 •建立品類採購模型（分類如工程、資訊、維保、能源、服務、租賃、行政等）與 採購SOP。 •整合區域需求，導入集中/分散混合採購策略。 •主導全球園區Non-BOM選品平臺規劃與建置，制定標準化流程（供應商入駐、商品上架、需求提交、智能比價等），並建立數據分析機制以優化品類策略。 二、供應商管理與風險控管 •發展全球供應商網絡，執行績效管理與合約談判。 •推行供應商準入審核、ESG與風險評估制度（供應商財務、環安法規、地緣風險等）。 •主導供應合約（Master Agreements）制定及標準化。 三、跨部門整合與價值提升 •協同工程、總務、IT、ESG、人資、法務等部門，導入服務型採購方案。 •結合預算/項目管理與系統採購平台，提升採購可視性與決策即時性。 •對接集團級資本支出與運營支出需求（CapEx + OpEx）, 確保採購成本符合要求。 四、組織發展與團隊管理 •領導中央園區全球NON-BOM採購團隊（包含中央及各區域製造中心），推動制度落地。 •建立人才培育體系，提升分類採購與談判專業力。 •推動 Non-BOM 採購部門 KPI 管理與效益追蹤報表機制。 •確保全球採購團隊符合各地法律、國際貿易規範、公司內控制度及採購內規，合法合規運作。
- 面議（經常性薪資達4萬元或以上） 台北市南港區 工作經歷不拘 1天前更新展開
1.規劃個人金融產品數位流程 2.規劃個人金融產品風險控管平台 3.評估及導入新技術及工具
家庭日員工結婚補助生育補助員工及眷屬喪葬補助良好升遷制度 - 面議（經常性薪資達4萬元或以上） 新北市土城區 工作經歷不拘 3天前更新展開
1.PCB Layout方案評估、Placement、Routing、Gerber out。 2.板廠工程問題回覆。 3.產線DFx問題解決。
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