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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 4天前更新展開
* 根據積體電路設計流程、半導體器件、量測、良率提升等相關知識進行數據分析 * 建立人工智慧框架與工作流程，以提升數據運營與分析的生產力 * 與不同的內部及外部團隊溝通協作，提出策略建議
- 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 4天前更新展開
1. 參與CPU IP電路設計弱點之檢視與審查。 2. 開發 CPU IP 電路穩定度之測試項目，以排查/篩選出電路弱點。 3. 制定 CPU 電源完整性與電源量產品質方法
- 面議（經常性薪資達4萬元或以上） 新竹市東區 5年工作經驗 4天前更新展開
根據不同專案使用的各種CPU架構: * Function validation * Margin characterization & validation * System stability validation * Power/VF/Benchmark characterization * Customer issue resolve
- 面議（經常性薪資達4萬元或以上） 新竹市東區 2年工作經驗 4天前更新展開
• Conduct regular market analyses and benchmarking studies (e.g., annually or quarterly) to ensure the company‘s compensation and benefits packages remain competitive and aligned with industry best practices. • Develop and implement comprehensive compensation and benefits initiatives related to fixed pay, incentives, equity plans, and employee benefits, based on the company‘s business needs. • Act as a resource to business leaders by providing insights & recommendations on compensation practices, ensuring alignment with broader business objectives. • Collaborate with HR Business Partners as a trusted advisor on compensation inquiries, providing guidance to resolve complex cases and ensuring consistent and fair application of policies. • Manage global contingent workforce cost/efficiency in partnership with internal and external stakeholders to ensure compliance to drive project and business success.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
1. Android平台相關軟體問題，SCM, Code line管理等...主要客戶聯絡窗口。 2. 分析、釐清並解決或轉交客戶回報的系統層級問題。 3. 進行問題根因分析，並提供即時解決方案或替代方案。 4. 與內部工程團隊協作，確保問題有效解決。 5. 進行Android系統的性能分析與優化。 6. 支援Android平台的整合，包括問題排查、除錯與驗證。 7. 撰寫問題分析、解決方案及實踐文件，供內外部參考。 8. 與國內外客戶（包含美國）有效溝通，了解需求並提供技術支持。 9. 參與客戶會議、技術討論及專案檢討等相關活動。
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
AI Coding Agent 應用 •熟練使用 Claude Code / GitHub Copilot / Cursor 等 AI Coding Assistant 加速開發 •能夠設計並撰寫有效的 Prompt，引導 LLM 生成高品質 EDA 腳本（TCL / Python） •運用 AI Agent 自動化生成、審查與重構 Flow 腳本，提升開發效率 •探索 LLM-based EDA Flow Co-pilot 的可能性，協助工程師做流程決策 •評估並導入 AI Coding 工具至部門開發流程（AI-assisted SDLC） 研究與創新 •追蹤最新 AI for EDA / ML for CAD / LLM for CAD 學術研究與業界趨勢 •與 EDA Vendor（Synopsys / Cadence / …）合作探索 AI 整合方案 •探索 Agentic AI Workflow 應用於多步驟 EDA Flow 自動化
- 面議（經常性薪資達4萬元或以上） 新竹市東區 2年工作經驗 4天前更新展開
1. AI processor subsystem架構與RTL設計 2. AI processor subsystem整合驗證與介面設計 3. AI processor subsystem效能與低功耗設計與分析
- 面議（經常性薪資達4萬元或以上） 新竹市東區 6年工作經驗 4天前更新展開
1. 2.5D/3.5D package technology development 2. SoC/Memory heterogeneous integration package development 3. Package technology integration, NPI and MP 4. Project management
- 面議（經常性薪資達4萬元或以上） 新竹市東區 8年工作經驗 4天前更新展開
8+ years experiences in IC Advance Package Design such as 3DIC Development, ASIC (APR) design, flow development, and EDA enablement KEY RESPONSIBILITIES: 1. Contribute to the development and enhancement of design methodologies for 2.5D and 3D IC advanced package design. 2. Lead the development of new design and signoff flows for physical, electrical, and thermal quality assurance. 3. Support package design teams in defining a tool roadmap for advanced package design. 4. Contribute to interposer designs, advanced package designs, and test vehicles for the product design roadmap and feasibility. 5. Represent the Package design team in customer engagements for advanced package designs.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 2年工作經驗 4天前更新展開
1. 應用於I/O 小晶片的 SerDes 設計驗證工作. 包含從原型測試到量產晶片, 並與類比, 數位和演算法設計團隊合作. 2. 負責實現 SerDes 韌體設計, 以驗證連線效能和實現量產測試 3. 負責建立自動測試和資料分析, 以測試SerDes的晶片特性和分析失效晶片
- 面議（經常性薪資達4萬元或以上） 新竹市東區 8年工作經驗 4天前更新展開
- Lead and manage RFI/RFQ/SOW processes and negotiate commercial terms with AI data center clients, ensuring timely and accurate responses. - Collaborate closely with engineering, sales, and marketing teams to deliver data center ASIC solutions tailored for AI workloads. - Develop compelling product positioning and messaging for both internal and external stakeholders. - Work with field teams to assess competitive landscape and maintain market intelligence. - Support business development activities to the sales team to foster strong customer relationships. - Drive cross-functional teams to align on product specifications, timelines, and deliverables. - Prepare and present detailed product proposals and reports to executive leadership and customers. - PLM (Product Lifecycle Management), manage program from kickoff, execution, NPI all the way to volume production
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
Co-work with algorithm, digital/analog design, firmware, AI tool teams. 0+ ~ 10+ Years Experience in: Agentic AI Workflow/Tool Evaluation/Deployment Data Center & High-Speed SerDes Design Verification Plan & Project Execution Automotive Design Verification Plan & Project Execution 5G/6G Wireless Communication Design Verification Plan & Project Execution Satellite/NTN Communication Design Verification Plan & Project Execution Processor Platform/Peripherals Design Verification Plan & Project Execution Subsystem / System Level Design Verification Plan & Project Execution
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 4天前更新展開
1. High Speed digital design implementation 2. Integration from RTL to gate level, including flow QC, timing closure and issue analysis & solving 3. Signoff on design with mixed-signal interface 4. Design methodology and integration flow improvement
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