1. 稅務規劃及申報 :稅務優惠適用、結帳申報及爭訟處理
2. 稅務自動化系統建置
3. 合約與付款稅務流程管理
4. 協助其他各項專案
1. Tax planning and filing: Application of tax incentives, tax closing and filing, and dispute resolution
2. Implementation of tax automation systems
3. Management of contract and payment tax processes
4. Other ad hoc analysis
1. Package related structure stress analysis including warpage, material study.
2. Package and board level stress modeling for TCT, drop and vibration.
3. IC and package thermal analysis, modeling and characterization
4. Chip-Package-PCB thermal co-simulation and design.
5. System level thermal simulation 6. System level stress simulation
• System/Architecture design for 4G/5G communication systems
• Baseband algorithm design
• DSP embedded system coding/performance optimization
• System performance verification