面議(經常性薪資達4萬元或以上) 東南亞印尼 5年工作經驗 1天前更新
1.曾負責 DDIC(Display Driver IC)及 Gold Bump Wafer 之 CP 測試者優先
2.負責 CP 測試程式、測試條件及測試流程之建立與最佳化,包含新產品導入、工程批驗證及量產條件建立。
3.負責測試相關 SOP、Control Plan、PFMEA、OCAP及相關工程文件建立與維護。
4.視專案需求參與新 Tester、Prober、Probe Card及測試平台之評估、導入與 Qualification。
5.具有設備選型、新產線建置或 Technology Transfer經驗。
6.具英文技術文件閱讀、撰寫及溝通能力。
Responsibilities
1.Candidates with hands-on CP testing experience for DDIC (Display Driver IC) and Gold Bump wafers are highly preferred.
2.Responsible for the development and optimization of CP test programs, test conditions, and test flows, including New Product Introduction (NPI), engineering lot validation, and mass production test setup.
3.Develop and maintain test-related SOPs, Control Plans, PFMEAs, OCAPs, and other related engineering documentation.
4.Participate in the evaluation, selection, qualification, and implementation of new testers, wafer probers, probe cards, and test platforms according to project requirements.
5.Experience in equipment selection, new production line setup, or technology transfer is preferred.
6.Proficiency in reading and writing technical documents in English, with effective English communication skills.
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