1. Frontend IC substrate design including the SIP/SOP/RF/System package by using Cadence APD or PCBs Allegro
2. Manufacturing backend Validation with CAM350 features alignment and design discrepancy comparison.
3. Mechanical drawing for manufacturing process with AutoCAD.
4. Customers TV/DUT design integration and collaboration.
5. Impedance simulation and measurement for transmission line.
1. Placement, constraints setting, high speed bus and MISC bus routing for mulit layers. ((20 layer above)
2. Layout feasibility assessment, provide Solutions, Schedule and Quality control
3. Solve problem capability and communication skill
4. New Chipset technology study and improvement
※依學經歷、工作年資敘薪