- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 5天前更新展開
1.先進半導體蝕刻製程設備規畫建置。 2.下世代半導體蝕刻製程技術開發。 3.中心專案計畫所需之各類蝕刻材料製程(IBE/ALE/ICP etching)規劃與執行。 4.半導體元件整合與驗證。 5.主管交辦事項。
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=399&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1.Support Layout production and quality verification for advanced node 2.Advanced node path finding for best speed, power and area by using layout technique. 3.Methodology development for layout optimization, productivity and quality enhancement. 4.Machine Learning/AI exploratory for layout quality and productivity enhancement.
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=461&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: Building world-class cloud native infrastructure and ramping to high-volume production is key to enabling TSMC to scale worldwide. We are looking for a highly motivated engineer to join our global systems development team to support TSMC fabrication worldwide. The ideal candidate is highly technical with multi-discipline engineering skillset, that can push the limits of complex system design at large scale. Responsibility: 1. Develop state-of-the-art applications 2. Continue to refactor existing applications 3. Write and pass various kinds of tests (unit/feature/integration) to ensure software quality 4. Apply software design principles, such as 12-factor app, to ensure software quality 5. Ensure sustainability and performance of applications by working with SRE to define SLI/SLO and providing metrics for monitoring/alerting 6. Collaborate with peers in design, pair programming and code reviews 7. Willing to learn new IT technology
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=532&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs, responsible for designing with the state-of-the-art process technologies and developing corresponding CAD flows that explores cutting edge design methodologies and latest EDA tools, either for internal first-in-the-industry testchips or leading customer’s products
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=541&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Role: Software Engineer, Backend Development at TSMC IT focus on designing the most flexible, scalable backend architecture with optimized performance to support TSMC world-class manufacture, engineering and business systems. The ideal candidate has a highly technical multi-discipline engineering skillset that can push the limits of complex system design at large scale. Responsibilities: 1.Implement the features and services of backend for TSMC software products 2.Develop state-of-the-art code 3.Continue to refactor existing applications 4.Contribute to write tests to ensure software quality 5.Apply software design principles to ensure software quality 6.Ensure sustainability and performance of software applications 7.Willing to learn new IT technologies
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=545&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1.Hands on SOC chip/ block implementation from gate level netlist to GDS tape-out. 2.Develop IC design methodology 3.Chip tape-out; Design methodology development
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. Development of world-class cutting-edge technology, and responsible for the success of the A10/A14 technology: (1) Process integration across process modules, including test key design, tape out, device analysis, simulation, model, and robust. (2) Test key designs for design rule validation, electrical modeling, and yield learning. (3) Characterization of state-of-the-art devices, spice targets‘ setting for modelling, occasional bench measurement. (4) Lot handling: periodically serves as on-duty engineer to coordinate device lots‘ handling. 2. Advanced process integration development: integration and baseline sustaining to meet process KPIs on performance/ yield/ reliability/ manufacturability in A10/A14 program. 3. Advanced integration baseline process transfer to volume production. 4. Data analysis to identify the issue and issue owner. 5. Co-work with various teams to evaluate new processes and solve the issue. 6. Routine integration logistic job.
- 面議（經常性薪資達4萬元或以上） 新竹市 3年工作經驗 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers.
- 月薪45000~65000元 台中市大里區 3年工作經驗 2天前更新展開
1.資訊工作計畫及目標擬定。 2.資訊系統評估、規劃、優化與建置管理。 3.資訊機房網路設備之管理維運。 4.防火牆政策管理、維護。 5.資訊資產及軟體管理。 6.資訊專案規劃、執行、進度追蹤等管理相關事宜。 7.日常維護管理、跨部門溝通與協調能力。 8.可獨立作業完成專案交辦任務。 9.熟悉Delphi者尤佳。 10.其他交辦任務
全勤獎金年節獎金員工生日禮金年終獎金三節獎金 - 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=253&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. Operation, maintenance and monitoring of IT systems. 2. Responsible for incident management and internal IT support as a member of the on-call service. 3. Write scripts (Python, PowerShell, Bash, etc.) for IT operation automation (e.g., auto-recovery and ITSR automation). 4. Collaborate with DevOps teams and Infra teams to ensure the reliability of IT systems.
- 月薪28590~55000元 桃園市中壢區 工作經歷不拘 4天前更新展開
本公司擴大營業，廣邀人才！提供保障薪資+優渥的銷售獎金+完善的員工褔利 + 完整的訓練發展 + 絕佳的『升遷』機會。『時勢造英雄』，歡迎您加入，一起共創未來。 【工作內容】: 1.商品銷售與陳列管理。 2.客戶服務與管理。 3.門市營運作業。 4.營運幹部培訓。 5.偶爾須配合支援資訊展等活動。 6.業績獎金另計。 7.月休8~11天。
員工團保伙食津貼員工聚餐尾牙春酒 - 月薪33800元 台南市善化區 工作經歷不拘 39天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=505&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 說明: 1. 負責廠務系統與半導體機台連接配管、佈線工程、現場施工、安全及品質管理。 2. 施工配管物料估算及領料、進料管理。 3. 焊接機具及施工工具操作、校正、維護與管理。
- 月薪37000~42000元 台北市松山區 3年工作經驗 1天前更新展開
1.工作技能需求： 熟悉PC環境安裝及設定，懂網路環境設定，資訊設備環境設定，熟悉運用各種工具軟體。 熟windows系統，會系統及資料備份與復原。 懂資訊設備資產管理，懂資訊預算管理。 AD Exchange server 維護作業。 2.能獨立作業，並能分析及解決使用者端問題。 3.執行主管交辦之事項。 備註：公司為運輸與物流業而非資訊業，工作內容跟資訊行業稍有不同。
生育補助子女教育補助員工手機配發或補助員工及眷屬喪葬補助員工在職教育訓練 - 面議（經常性薪資達4萬元或以上） 台北市大安區 5年工作經驗 4天前更新展開
【為什麼要加入台灣大哥大 IT 攻城精英團隊】 1.我們有穩定的福利制度，也有新創公司般的工作挑戰 2.我們致力打造一起學習、正向鼓勵回饋的工作環境 3.我們有體貼的居家上班制度 4.我們不是傳統的電信公司!正加速往區域級科技電信集團目標大步邁進 5.我們能讓你從「攻城師」升級為「攻城精英」，這裡絕對是個讓你可以升級武器、切磋技能、激發潛能的難得機會 6.我們還有一位跨領域身經百戰、兼具感性與知性、熱愛分享，每週都請喝咖啡的超強 CIO 隊長！ 【我們喜歡什麼樣的人】 1.具備團隊合作精神的 team player 2.優異的溝通及表達能力 3.開創性思考的能力 4.極端正面的工作態度、積極進取 5.具備優異的技術專案規劃、統籌與實作能力 6.對新興技術展現優異的理解能力及應用思維 工作不是人生的全部，但是一份精彩的工作會豐富成就你更好的人生 請給自己也給我們一個機會，加入我們一同持續精進IT專業技術，改寫自己的人生與改寫世界，讓我們一起變得更好，歡迎登艦！ 【工作內容】 我們正在尋找對系統穩定性與資安充滿熱情的系統管理員，加入我們的 IT 基礎架構團隊： 安裝、設定與維護 Linux/Windows 作業系統 維運私有雲平台（如 VMware、Nutanix 等） 系統資源監控、異常排除與效能調校 備份、還原測試與災難復原規劃 資安防護作業(如防火牆、權限控管、弱點掃描與漏洞修補) 管理與維護伺服器、儲存設備等硬體 撰寫與維護系統操作文件與維運流程 IT新技術評估與導入(如AI與自動化) 可以WFH：每個月有10天可以居家辦公 【我們使用的技術與工具】 Linux（RHEL/Oracle Linux/Ubuntu）、Windows Server VMware / Nutanix / K8s / Container Zabbix / Nagious 【我們希望你具備】 熟悉伺服器硬體與作業系統操作 有虛擬化平台管理經驗（如 VMware 或 Nutanix） 能獨立處理系統故障與排除問題 樂於學習新技術、善於團隊合作 若具備自動化腳本或資安經驗者佳 【加分條件】 具 RHCE、Linux+、VMware VCP 、Nutanix NCP等相關證照 有資料中心建置、遷移、DR 計畫經驗 熟悉容器化技術（如 Docker、Kubernetes) 【薪資待遇】面議，依績效另有豐厚年終獎金與員工紅利。
國內、外旅遊補助員工購物優惠員工低利貸款員工退休規劃（包括退休金及退休後之福利等）員工及眷屬喪葬補助 -
