- 月薪36000元 高雄市楠梓區 工作經歷不拘 3天前更新展開
***Please upload English resume onto our official platform: https://reurl.cc/Em0W00 Job Description - To work with IT and Equipment/Production team for MMS (Machine Maintenance Solution) spare part and tool management system build up - To assist Automation project of introducing AMHS (Automatic Material Handling System) for product transportation from wire bond stage to molding stage. Qualifications: - The candidate must be pursuing a Bachelor’s or Master’s degree in Mechanical/Electronic Engineering or related. - Available to work 3 days/ week. - Good verbal and written English communication skills - MS Office, AutoCAD or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude
分紅入股年終獎金三節獎金激勵獎金員工團保 - 月薪36000元 高雄市楠梓區 工作經歷不拘 3天前更新展開
***Please upload English resume onto our official platform: https://reurl.cc/qpRoqg Job Description - To work with operation/maintenance to ensure production smoothly. - To assist action confirmations with system monitors. - To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator. Job Qualification: - Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures - Bachelor‘s or Master‘s student in Material/Science/Electronic Engineering or related - Available to work at least 3 days/week. - Good verbal and written English communication skills - MS Office or Programming skill - Self-motivated, results oriented, willing and eager to learn, proactive attitude
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹市東區 5年工作經驗 3天前更新展開
Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/APAC-Foundry-Operations-Senior-Principal-Engineer_R-10062827 Job Description The APAC Foundry Operation team works with foundry partners on technologies which are evaluated and/or subjected to production. The key areas of responsibility of the jobholder are: - Lead the release and transfer of process options at foundries. - Close collaboration with foundries, NXP technology groups, the business lines and various other stakeholders to qualify and release process - Lead and steer the projects towards timely completion to support NXP business needs. - Main decision maker on subjects related to process integration, striking a good balance between the various dynamics in a project; not limiting to technical judgement, resource planning, project schedule, logistics, supplier relationships etc. The requirement fulfilling the job: - Bachelor or MSc in physics, material engineering or electrical engineering. In-depth knowledge of semiconductor physics, process development and manufacturing. - ＞10 years of experience with semiconductor process integration, working in foundries’ production or development teams. - Hands on experience in being a lead; leading teams with responsibilities in development, transfer or production projects. - All rounded knowledge on process integration, product testing, reliability testing, tapeouts, device physics will be needed in the discharge of duties as a project/ integration lead. - Good communication skills. - Pro-active working attitude, creative, pragmatic, enterprising and result driven. - Having the ability to influence and steer a discussion. - Familiar in managing/working with foundries, maximizing leverage from foundries.
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 工作經歷不拘 3天前更新展開
Please also apply through: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Tape-Out-Engineer_R-10063230 Role Overview, Responsibilities, and Qualifications The Tape Out Engineer plays a crucial role in the semiconductor design process, serving as the final checkpoint before integrated circuit designs are sent for fabrication. This position is responsible for ensuring that all physical and logical design data meet manufacturing requirements and quality standards, working closely with design, program managers, technologists, and manufacturing teams to resolve issues and optimize outcomes. Key Responsibilities 1. Coordinate and execute the tape out process for semiconductor products, ensuring timely and accurate delivery of design data to manufacturing. 2. Verify design integrity by reviewing database and documentation, and addressing any discrepancies or errors. 3. Work collaboratively with cross-functional teams, including design, technologists, program managers, and process engineering, to resolve technical issues and optimize designs for manufacturability. 4. Ensure all deliverables conform to foundry requirements. 5. Maintain detailed records of tape out procedures, revisions, and outcomes for future reference and process improvement. Qualifications 1. Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field (Master’s preferred). 2. Experience with physical design tools (e.g., Cadence, Synopsys) and semiconductor manufacturing workflows. 3. Excellent attention to detail, problem-solving skills, and ability to work under tight deadlines. 4. Willingness to work with flexible working hours to support critical Tape-outs. Effective communication in English for collaborating across technical teams. This role is ideal for individuals with a passion for precision and innovation, seeking to contribute to the successful launch of leading-edge semiconductor products.
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 3天前更新展開
Please also apply on our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Hsinchu/Principal-Process-Integration-Engineer_R-10063266 Job Description 【Why This Role?】 Drive Core Technology: Lead the integration and development of advanced CMOS processes and Non-Volatile Memory (NVM), directly impacting product performance and market competitiveness. Lead Mass Production Breakthroughs: Take ownership of the critical path from New Product Introduction (NPI) to high-volume manufacturing, defining technical specifications and Best Known Methods (BKM). Cross-Domain Collaboration: Bridge the gap between design teams and Tier-1 Foundries, exerting technical influence at advanced process nodes (28nm and below). 【Key Responsibilities】 Process Integration Leadership: Lead the design of CMOS and NVM process flows; optimize device performance to achieve industry-leading yield and reliability benchmarks. Deep Characterization & Analysis: Conduct statistical and Physical Failure Analysis (PFA) for fail modes; proactively identify process defects and drive optimization solutions. Yield Enhancement & Stability: Spearhead cross-functional yield improvement programs to ensure production stability and cost-efficiency. Foundry Management: Lead technical teams in collaboration with international major foundries, managing technical alignment, communication, and process transfer. 【Required Qualifications】 Education: Master’s degree or PhD in Electronics, Electrical Engineering, Physics, Materials Science, or a related field. Experience: 10+ years of semiconductor industry experience, with a focus on CMOS logic processes or NVM technologies (eFlash, RRAM, MRAM). Data Insight: Proficiency in data analysis tools (e.g., JMP, Python, or Spotfire) with a proven ability to analyze complex statistical distributions and electrical characteristics. 【Preferred Skills】 Process Transfer Expertise: Successful track record in 〝Copy-Smart〝 process migration, ensuring process consistency and rapid yield ramp-up during technology transfer. BCD Process Expertise: Experience in BCD (Bipolar-CMOS-DMOS) process development or integration; familiarity with PMIC (Power Management IC) optimization. Advanced Node Experience: Proven experience in NVM integration and mass production at 28nm/16nm/12nm or beyond. Design Collaboration: Solid understanding of memory architecture, NVM operation principles, and peripheral circuit design. 【Soft Qualities】 Analytical Thinking: Ability to synthesize complex data into actionable insights and identify root causes of technical anomalies. Proactive Ownership: Courage to transcend functional boundaries and mobilize resources to overcome technical bottlenecks. Effective Communication: Excellence in translating complex engineering issues into clear, actionable optimization strategies for design and process teams.
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新北市土城區 5年工作經驗 今天剛更新展開
1. 規劃電子仿真團隊技術方向、年度目標與人力配置。 2. 建立 SI / PI / EMI / ESD / Power simulation 標準流程與驗證規範。 3. 審核重大專案仿真結果，判斷設計風險並提出改善策略。 4. 協調 EE、PCB Layout、Power、Thermal、Mechanical 與客戶端技術需求。 5. 推動仿真自動化、資料庫建置、專利佈局與團隊技術能力提升。
- 面議（經常性薪資達4萬元或以上） 台南市永康區 工作經歷不拘 4天前更新展開
1. SAP 模組維運與程式設計 2. User 需求訪談，表單與資料結構設計 3. Interface : BAPI / RFC for interface between SAP and other system 4. ABAP development and maintenance 5. 可接受彈性任務安排，隨時學習新的程式語言 *預計2026年中，總部從永康遷往歸仁，地址為台南市歸仁區沙崙里高發三路二段160號。
員工停車位或停車補助員工宿舍員工（調職）搬家安家費員工健身房員工餐廳 - 面議（經常性薪資達4萬元或以上） 新北市土城區 5年工作經驗 今天剛更新展開
1. 使用 VHDL/Verilog 進行 CPLD 電路邏輯開發。 2. 執行模擬、合成與晶片燒錄，並進行 Debug。 3. 設計 I²C、SPI、UART 等數位介面，與硬體電路整合。 4. 確保設計符合時序需求，並優化資源與功耗。 5. 產出設計規格書/測試報告，並與韌體、製造團隊協同作業。
- 面議（經常性薪資達4萬元或以上） 新北市新店區 工作經歷不拘 1天前更新展開
1. 負責醫療資訊系統安裝與維護工作，包括醫療軟體的安裝、升級及故障排除，確保系統穩定運作。 2. 執行醫療設備電腦硬體組裝、修復及升級方案設計，確保醫療設備相關電腦硬體效能符合需求。 3. 監控醫院網路效能，進行網路流量分析，並管理防火牆、路由器及交換器等設備，優化網路基礎設施。 4. 進行醫院網路安全評估，設計與實施網路安全對策，保護醫療資訊隱私及安全防護。 5. 提供醫療院區技術支援與內部人員專業技能培訓，提升系統操作與使用效率。 6. 定期執行醫療電腦系統維護與檢查，撰寫相關維護及測試報告以追蹤系統健康狀態。 7. 協助制定醫療網路災難復原機制與資料備份機制，確保重要資料的妥善保存與災後快速恢復。 加入我們，成為醫院資訊管理與網路安全的重要夥伴，一起推動智慧化醫療服務的未來，期待您的專業貢獻！
- 面議（經常性薪資達4萬元或以上） 新北市土城區 工作經歷不拘 今天剛更新展開
1. 開發與維護自動化測試框架核心模組 2. 設計硬體通訊介面，整合多種設備連接協定 3. 建構分散式任務排程與執行系統 4. 對接外部工廠資訊系統（SFC/MES）API 5. 維護管理介面與開發者工具
- 時薪200~210元 新北市土城區 工作經歷不拘 今天剛更新展開
* 負責雲端Server伺服器的相關工作 1. 協助硬體部門CPLD Function量測專案測試及報告撰寫 2. 協助部門處理庶務事項 • 計畫介紹： • 實習期間: 即日起-2027/6 (長期實習) • 職缺內容: 實習生 (電子/電機 相關科系佳) • 實習薪資: 時薪(一週3天以上)，優於基本工資
- 面議（經常性薪資達4萬元或以上） 新北市土城區 工作經歷不拘 今天剛更新展開
1. 設計與建置 HPC / AI 叢集高速網路架構（Spine-Leaf、Fat-Tree 等大規模拓撲） 2. 具備 InfiniBand（IB）或 RoCE / RDMA 高速網路實務經驗 3. 建構網路自動化工具與配置管理流程，降低人工操作風險 4. 執行網路設備驗測與效能壓測，確保 AI 訓練工作負載的穩定性與吞吐量 5. 診斷並排除複雜網路問題，建立故障根因分析（RCA）機制
- 月薪30000~45000元 台北市南港區 工作經歷不拘 4天前更新展開
1.協助開發與維護後端 APIs，與團隊共同完成專案功能開發。 2.協助撰寫或維護自動化腳本（例如自動生成 DTO、Services、Controllers 等 Boilerplate 程式碼），以加速開發流程。 3.在資深工程師的指導下，學習並實行結構化的程式碼架構。 4.處理基礎的資料庫操作、 Schema 設計與 ORM 模型定義。 5.撰寫單元測試、協助系統除錯與問題排除。 ※本職缺沒有提供遠端工作。
禮品績效獎金產假產檢假就業保險 - 面議（經常性薪資達4萬元或以上） 台北市南港區 3年工作經驗 4天前更新展開
1.設計、開發並維護高可用性、高擴展性的後端系統與 RESTful APIs。 2.處理複雜的業務邏輯與工作流，例如票務路由管理、參數發布與版本控制系統。 3.規劃並實作高維護性的軟體架構，熟練應用 Service、Repository、Factory 等設計模式。 4.管理與優化資料庫效能，進行複雜的 SQL 資料結構設計與資料整併。 5.編寫自動化腳本以優化團隊開發流程與程式碼生成。 6.與前端團隊密切協作，協助評估風險控制與系統整合需求。 ※本職缺沒有提供遠端工作。
禮品績效獎金產假產檢假就業保險 -
