• 面議(經常性薪資達4萬元或以上) 新竹市東區 2年工作經驗 今天剛更新
    1. Work on AI development for design flow 2. Perform floorplan, clock planning, place and route, timing closure, ECO, IR signoff flow automation
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 工作經歷不拘 今天剛更新
    1. 5G/6G通訊IP開發. 2. 多模(5G/6G)解調架構開發以及RTL coding/verification/integration.
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  • 面議(經常性薪資達4萬元或以上) 台北市內湖區 2年工作經驗 今天剛更新
    1. 優化數位 IC 設計流程與方法 (使用 AI) 2. 執行與管理數位 IC 設計 EDA 相關任務 (2.a) Physical aware synthesis, DFT-SCAN, DFT-MBIST insertion (2.b) STA timing analysis 與 fixing (2.c) Netlist level QC,例如 CLP 3. 使用 AI 或 EDA 工具針對 PPA(Performance, Power, Area)進行優化 4. 將依應徵者的年資與專業經驗,提供不同的職級
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  • 面議(經常性薪資達4萬元或以上) 台北市內湖區 2年工作經驗 今天剛更新
    1. 資料中心AI晶片架構設計與RTL實作 2. 資料中心SoC與AI運算平台設計與驗證 3. 系統匯流排與AI週邊設計 4. SoC系統效能分析
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  • 面議(經常性薪資達4萬元或以上) 台北市內湖區 4年工作經驗 今天剛更新
    - 針對下一代資料中心產品,推動並導入 SoC 層級的先進功耗優化技術;與 RTL、合成與布局團隊協作,完成低功耗功能的架構規劃與導入。 - 於各設計階段(RTL → 閘級 → 佈局後)進行功耗估算與分析,提出可執行的省電建議與改善方向。 - 與 Tier-1 客戶合作制定功耗規格,並提供下一代產品的功耗估算結果與技術說明。 - 支援樣品回片後的功耗量測比對(silicon correlation)與功耗相關問題除錯(sample back / bring-up)。
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  • 面議(經常性薪資達4萬元或以上) 桃園市大園區 工作經歷不拘 2天前更新
    1.透過雲端後台與管理系統分析問題與提出改善報告 2.現場與基礎建設廠商對應及安裝、測試充電站 3.技術服務協助(維護、分析和故障排除) 3.對客戶、服務團隊人員教育訓練 4.主管交辦事項
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    誤餐費自強活動國內旅遊國外旅遊員工聚餐
  • 面議(經常性薪資達4萬元或以上) 台北市內湖區 6年工作經驗 今天剛更新
    - 透過推動跨部門在技術需求、介面定義與交付項目上的一致性,協調先進封裝解決方案的開發(例如 CoWoS、2.5D/3.5D 整合,以及 Chiplet 架構)。 - 主導 SoC Floorplanning 以最佳化 PPA(功耗、效能與晶片面積),並在時序收斂、繞線壅塞、電源域邊界,以及 PDN/熱設計等考量間取得平衡。 - 與封裝團隊合作制定並優化 Ball/Bump 配置(bump/ball map),以滿足 SI/PI、電流承載能力、可製造性與可靠度等需求。
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 2年工作經驗 今天剛更新
    1. Familiar with DFT plan, methodology, implementation 2. Familiar with new DFT flow such as SSN, HSIO 3. Familar with STA, timing analysis
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 2年工作經驗 今天剛更新
    1. SoC low power design, integration, and modeling 2. SoC adaptive voltage scaling development
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 10年工作經驗 今天剛更新
    Role Summary: We are seeking a Principal Product Engineer to support advanced optical product development, NPI, manufacturing transfer, production ramp, and sustaining engineering in Taiwan. This is a senior individual contributor role requiring deep hands-on experience in fiber optics, optical module manufacturing, process integration, yield improvement, and cross-functional execution with engineering, operations, quality, supply chain, and contract manufacturing teams. The ideal candidate will serve as a technical lead for optical product engineering in Taiwan, helping drive products from development builds through qualification, pilot production, and high-volume manufacturing. Key Responsibilities: • Lead product engineering execution for optical products from prototype builds through qualification, production release, and sustaining support. • Support NPI planning, engineering builds, manufacturing readiness, test readiness, process transfer, and ramp execution. • Drive technical issue resolution across optical assembly, fiber attach, process integration, module test, final test, reliability, and customer quality. • Work closely with design engineering, optical engineering, packaging, test, reliability, operations, quality, and supply chain teams. • Partner with contract manufacturers and suppliers to resolve yield, quality, process, material, and production ramp issues. • Lead data-driven yield improvement using production data, failure pareto analysis, root-cause investigation, corrective action, and process optimization. • Support development and release of optical assembly and fiber attach processes, including process flows, control plans, inspection criteria, process windows, and manufacturing release criteria. • Provide technical leadership for product characterization, margin analysis, failure analysis, reliability learning, and production excursion response. • Help define manufacturing specifications, test limits, outgoing quality controls, and product-level production metrics. • Support customer or supplier technical escalations related to product quality, manufacturing performance, or reliability.
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 3年工作經驗 今天剛更新
    We are looking for a DFT Engineer to define and implement DFT architectures for data center ASIC products. The role involves developing test strategies, integrating DFT features, and improving test coverage for mass production. You will work closely with design teams to ensure robust DFT solutions, yield improvement, and quality. Key Responsibilities • Develop and optimize test strategies to achieve coverage and manufacturing goals; analyze and improve test coverage. • Integrate DFT features at RTL and gate-level, supporting both top and block-level DFT planning and implementation. • Perform ATPG, fault simulation, and coverage analysis. • Collaborate with BE and PD teams to ensure DFT-friendly timing and support IR convergence in test mode. • Lead silicon bring-up and debug of test features; conduct failure and yield analysis. • Work with product teams to facilitate pattern generation, validation, and DPPM improvement.
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 4年工作經驗 今天剛更新
    We are looking for candidates that can communicate complex engineering subjects effectively to cross functioning technical teams and upper management. Strong DFT and testing skills will be put to good use. Successful handling with many external teams from pre-silicon phase cross to post-silicon on advance silicon and assembly process. Key Responsibilities • Drive DFT Excellence: Define DFT architecture specifications that enhance ATE and production test environments, optimize test costs, and improve quality across future MTK ASIC product portfolios. • Product test planning capability: Manage comprehensive post-silicon flow optimization, and test deployment for new product launches • Manufacturing Integration: Serve as a key contributor within MTK’s Global Quality and Operations organization to deliver optimal manufacturing test solutions from early product conception through post-silicon validation • Design Collaboration & Quality Assurance: Partner closely with design teams to ensure accurate implementation of DFT structures and compliance with specifications.
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  • 面議(經常性薪資達4萬元或以上) 新竹縣竹北市 2年工作經驗 今天剛更新
    1. 設計、開發和維護安全啟動(Secure Boot)系統和引導加載程序(Bootloader)。 2. 實施和優化安全措施,包括密鑰管理、數字簽名和加密技術。 3. 與硬體工程師緊密合作,以確保驅動程式與硬體設計的兼容性。 4. 整合應用端的技術要求,與應用開發團隊合作,確保 secure IP 驅動程式的順利整合。 5. 進行安全漏洞分析,並提出相應的緩解策略。
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  • 面議(經常性薪資達4萬元或以上) 新竹市東區 工作經歷不拘 今天剛更新
    職務說明: - 開發相機開放平台功能 for Android手機、AI 相機功能、監控系統和汽車載具應用的相機系統軟體。 - 設計和實施嵌入式相機系統軟體,以支持不同產品線的相機功能。 - 與跨職能團隊合作,整合AI相機功能,車用安全相機軟體,確保符合功能安全標準。 - 為各種硬體平台(包括CPU、GPU和記憶體子系統等SoC組件)優化相機性能。 - 解決與相機系統相關的複雜軟體問題,有助於提高整體產品品質和用戶體驗。 加入聯發科多媒體團隊 (MM): 加入聯發科的相機軟體工程師後將開啟創新與現實應用相遇的旅程。在聯發科,您將成為重新定義多種設備上相機體驗的核心團隊的一份子。您的專業知識將有助於創建令人驚艷的用戶體驗,讓用戶以無與倫比的清晰度和智能捕捉生活時刻。作為相機軟體領域的先驅,您將參與融合尖端人工智慧和強大相機系統的具有挑戰性和令人興奮的項目,確保每張快照或影片都講述一個故事。您的工作將不僅推動相機技術的發展,同時讓全世界圖像互動技術有著重大的影響力。
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  • 無經驗也能轉職成功,高雄台南+月薪三萬工作機會