-
職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 月薪30000~35000元 宜蘭縣宜蘭市 工作經歷不拘 27天前更新展開
＜維修人員(學徒or師傅)＞ •工作內容 1.協助本店機器修繕服務(維修品大多為小型引擎農機) 2.主動與客戶溝通修繕事宜(報價、告知取件、維修狀況等) 3.維修顧客之接待與需求服務，維護客戶關係 4.協助門市銷售機器時，新機器之發動測試、錯誤排除 5.維修之餘，協助門市服務部之庶務事項(帶看貨物、補貨等) 6.組裝機器、農機具、二次加工貨物等 7.協助主管交辦事務處理 8.協助保持環境整潔 •具備能力 ⑴須擁有服務的熱忱 ⑵具備抗壓性、效率、細心及責任感 ⑶具備解決問題及團隊溝通之能力 ⑷具備不排斥學習新事物的熱忱 •加分條件 ⑴曾從事服務業相關工作(五金、賣場等) ⑵台語溝通能力順暢 ⑶熟悉電腦文書系統操作（Excel、Word) (4)擁有汽車or機車駕照 (5)熟悉維修技能及故障排除 •休假制度 排休＋固定休（達年資享有法定特休） •福利 (1)全勤獎金、年終獎金、維修績效獎金 (2)定期員工聚餐、不定期員工旅遊 (3)享有員購福利 歡迎所有求職者
全勤獎金年節獎金績效獎金員工聚餐尾牙 - 面議（經常性薪資達4萬元或以上） 桃園市中壢區 工作經歷不拘 今天剛更新展開
中原大學化學系徵聘專任助理教授(含)以上1名 一、學歷：具博士學位 。 二、專精領域： 1.歡迎化學相關領域優秀人才申請，「物理化學」、「無機化學」領域尤佳。 2.具備英語授課能力為佳。 三、應徵資料，請備妥下列文件： 1.獨立研究方向說明書(兩頁)。 2.推薦函三封。 3.個人履歷表(含自傳及現職)。 4.學經歷影本。 5.成績單【持國外學歷者，畢業證書、成績單須經駐外單位驗證；博士候選人請 附指導委員會主席(Committee Chairman)或院、系(所)主管(Dean, Chairperson )完 成論文答辯、審查及畢業日期證明函】。 6.博士論文及相關研究著作(作品)。 7.可教授之課程及其內容大綱 8.教育部教師證書(無則免)。 9.個人資料表及學術著作點數表(請至本系網頁下載) https://reurl.cc/gabVKV 四、收件截止日：114年10月17日止，以掛號送達(郵戳為憑)。 五、收件地址：320桃園市中壢區中北路200號，中原大學化學系收； 信封左下方請註明應徵職務名稱，錄取與否均不退件。 六、聯絡人及電話：莊敬主任 ，(03)265-3300或265-3312，E-mail: gjchuang@cycu.edu.tw
週休二日勞保健保 - 論件計酬40000~80000元 桃園市中壢區 工作經歷不拘 今天剛更新展開
本公司主要業務為電商銷售，自成立以來以銷售優質車為方向，讓買賣雙方均能達到放心、滿意、購車方便為理念。 必備條件: 1. 微笑/親切/有禮貌 2. 細心/貼心/負責任 3. 拒絕愛遲到的夥伴 福利制度： 1. 彈性上下班 2. 享有工作獎金 3. 有專人培訓/歡迎無經驗的人才加入我們團隊 工作內容: 1. 接待客人至指定位置提供汽車商品介紹 2. 提供顧客諮詢服務、產品解說，並適時提供產品購買建議 3. 負責貸款協助及其他相關事宜 4. 網路平台廣告編輯與維護 5. 維護客戶關係提供售後服務 6. 協助產品報價查詢 7. 亦可配合選擇論件計酬 面試地址:桃園市中壢區延平路500號12樓-最佳商務中心
尾牙春酒員工購物優惠員工在職教育訓練良好升遷制度 - 論件計酬800~1600元 新北市淡水區 2年工作經驗 今天剛更新展開
1.針對預約的顧客進行確認 2.芳香課程的說明與芳療課程操作，讓顧客選擇適合的課程 3.提供芳香的療程、精油按摩舒壓等一般SPA相關工作服務
產假全勤獎金生日假上下班車資補助員工聚餐 - 月薪35000元 新北市淡水區 3年工作經驗 今天剛更新展開
1-規劃公司人才開發、及教育訓練課程 2-塑造公司組織氣候及企業文化，以符合發展需要，引導各部門經營方向與公司營運目標方向一致 3.美容諮詢，針對顧客膚質建議其產品使用，提供顧客高品質服務 4.提供相關的保養建議、美容相關業務、保養品銷售
產假全勤獎金生日假上下班車資補助員工聚餐 - 月薪28590~40000元 桃園市中壢區 工作經歷不拘 今天剛更新展開
本公司主要業務為電商銷售，自成立以來以銷售優質車為方向，讓買賣雙方均能達到放心、滿意、購車方便為理念。 必備條件: 1. 微笑/親切/有禮貌 2. 細心/貼心/責任心 3. 拒絕愛遲到的夥伴 工作內容: 1. 具備電腦文書作業與電腦美工軟體技能佳 (無相關工作經驗將會有前輩教學，簡易好上手) 2. 網路平台廣告編輯上下架 3. 自媒體運用與推廣 4. 協助業務人員處理銷售業務相關之公司內部作業或部門後勤支援 5. 維護辦公室環境與設備之整潔 6. 廣告維護以及於有效時間回覆訊息 7. 亦可配合選擇論件計酬 面試地址:桃園市中壢區延平路500號12樓-最佳商務中心
尾牙春酒員工購物優惠員工在職教育訓練良好升遷制度 - 日薪1700~1900元 高雄市鳳山區 工作經歷不拘 今天剛更新展開
1.視行業而定，跟隨師父學習專業的技能，並且處理該行業最基礎的工作 2.監督水電工程現場施工 3.水電消防配管配線、高低壓電氣設備安裝 4.按照藍圖進行高低壓配電線路施工、電路維修及電器設備安裝 5.有/無經驗皆可，肯吃苦，有顆向上之學習精神者 6.太陽能光電系統/汽車安全配備/線路配置 •••需有汽車駕照•••手排者為佳•••
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 28天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16573&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. 智慧製造工程師為創造晶圓產出最大化，滿足客戶交期，為公司帶來營收；身為工廠的第一線管理者，需掌握生產流程，藉由良好且精準派工提升機台生產效率，帶領技術員團隊確保製造流程順暢運行並達成每日的產能目標。 As a global semiconductor technology leader, TSMC is seeking an Intelligent Manufacturing Engineer to join our team. Our commitment to driving manufacturing excellence has led us to integrate artificial intelligence, machine learning, expert systems, and advanced algorithms to build up an intelligent manufacturing environment. Join TSMC, we are the most advanced technology team and connect with the world, as we head towards an unlimited future. We look forward to you joining us! You will be assigned to one of the following five roles according to your interest, experiences, and technical background. Responsibilities: 1. MFG Intelligent Manufacturing Engineer 2. CIM Intelligent Manufacturing Engineer 3. Data Analyst & Data Scientist 4. AMHS (Automated Material Handling System) Engineer 5. PIDS/WAT (Wafer Acceptance Test) Engineer 6. PIDS/NTO (New TapeOut) Engineer 7. Quality Management Engineer
- 論件計酬40000~80000元 桃園市中壢區 工作經歷不拘 今天剛更新展開
本公司主要業務為電商銷售，自成立以來以銷售優質車為方向，讓買賣雙方均能達到放心、滿意、購車方便為理念。 必備條件: 1. 微笑/親切/有禮貌 2. 細心/貼心/責任心 3. 拒絕愛遲到的夥伴 工作內容: 1. 接待客人至指定位置介紹車輛性能及特色 2. 具備電腦文書作業與電腦美工軟體技能佳 (無相關工作經驗將會有前輩教學，簡易好上手) 3. 網路平台廣告編輯上下架 4. 自媒體運用與推廣 5. 協助業務人員處理銷售業務相關之公司內部作業或部門後勤支援 6. 維護辦公室環境與設備之整潔 7. 協助產品報價查詢及相關售後服務 8. 亦可配合選擇論件計酬 面試地址:桃園市中壢區延平路500號12樓-最佳商務中心
尾牙春酒員工購物優惠員工在職教育訓練良好升遷制度 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 28天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16574&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源，提供晶圓生產所需之電力、水、氣體、化學品、空調等，為台積高度智慧自動的生產單位，供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任，如何精進節水、節能、減碳、環保的廠務運轉技術，更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for the planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system is operating at the highest level of quality when on duty. 4. Construction management & project coordination.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 28天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology.
- 月薪40000~80000元 台北市大安區 2年工作經驗 4天前更新展開
1.顧客管理、服務、接待。 2.提供醫美微整形相關諮詢。 #具醫美諮詢工作相關經驗一年以上 #月薪=底薪+獎金(療程/產品)
就業保險產假產檢假家庭照顧假分紅入股 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 28天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16576&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production.
-
上一頁 下一頁
第 1572 / 19408 頁
第 1562 / 19408 頁第 1563 / 19408 頁第 1564 / 19408 頁第 1565 / 19408 頁第 1566 / 19408 頁第 1567 / 19408 頁第 1568 / 19408 頁第 1569 / 19408 頁第 1570 / 19408 頁第 1571 / 19408 頁第 1572 / 19408 頁第 1573 / 19408 頁第 1574 / 19408 頁第 1575 / 19408 頁第 1576 / 19408 頁第 1577 / 19408 頁第 1578 / 19408 頁第 1579 / 19408 頁第 1580 / 19408 頁第 1581 / 19408 頁第 1582 / 19408 頁
