-
職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 10天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16564&source=1111&tags=AO+2026_1111 因為期待無限可能，所以選擇台積電！ 台積公司致力於營造一個充滿挑戰、持續學習且充滿樂趣的工作環境，並提供高於業界平均水準的薪酬與福利。加入台積電，您將有機會與世界一流的卓越夥伴共事，透過最先進的製程技術，共同成就改變世界的偉大事業。每一項突破與創新，都凝聚了我們的努力與心血。 2026年台積電預辦登積計畫：招募2026年應屆畢業生與研發替代役 台積電誠摯邀請「志同道合」的您，透過「線上應徵」事先註冊履歷。符合資格者將享有優先面試的機會！ 參與2026年預聘暨研發替代役熱門職缺，您將可： ▪ 畢業前即拿到聘書 ▪ 與優秀產業菁英共事 ▪ 在國際舞台盡情發揮 截止收件日：2025/10/31 如您對此計畫感興趣，台積電將前往校園辦理實體行動徵才車活動；活動當天不僅請您喝咖啡，並安排畢業校友與同學們互動交流，機會難得敬請把握機會。校園場次與報名資訊請參考官網（如未報名成功，也歡迎至現場和台積人資互動，現場投遞履歷，還可抽《限量》積星神秘小禮！） 此外，我們特別為同學安排了校園徵才實體與線上說明會，歡迎踴躍報名參加，以便了解公司市場趨勢、組織概況，並掌握求職技巧！報名連結：請參考官網 建議您根據學習領域與專業，投遞申請以下2~4個職位。符合主管需求者，將會收到面談邀請通知。 ▋歡迎志同道合的你，一起加入台積電 ▋世界上的每一個夢，都由我們來圓夢 Because we believe in endless possibilities, we choose TSMC! TSMC offers a wide variety of fulfilling experience and opportunities across our organization in many different locations. By joining TSMC, you will work with the high-performing teams in the industry and achieve your full potential through a comprehensive and systemized learning program here. We are devoted to achieving technology advancement, pursuing manufacturing excellence, and optimizing customer service. 2026 TSMC Advanced Offer and R&D Substitute Service Program Welcome to submit your resume via our application systems and apply to the following vacancies : 2026 TSMC Advanced Offer(AO) and R&D Substitute Service Program (RDSS). You will then be able to: • Get the offer before graduation. • Work with professional experts in the industry. • Fulfill yourself on the world stage. Application Deadline: October 31, 2025 Attending Campus Recruitment events with TSMC to enjoy a coffee with the industry experts to find out what suit you the best. For campus event schedule and registration details, please refer to TSMC career website (even if you are unable to register successfully, feel free to visit our booth and have a chat with us.) Submit your resume now, and gain a chance to win a limited TSMC’s gift! We’re also organizing a series of 〝TSMC Campus Recruitment Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We’re also organizing a series of 〝TSMC Campus Recruitment On-Site & Online Briefing Session〝, where you can find out more about industry trend, career opportunities, and life at TSMC. Registration link: Please refer to the career website We recommend you applying for two to four positions based on your academic background and professional expertise. If your qualifications meet the position requirements, you will receive an invitation for interviews. ▋Join TSMC｜Together, We Grow ! 2026 TSMC AO&RDSS Recruitment Job (Please refer to the job in the career website for the details for each job below): R&D (研究與發展組織) 1-1 Research and Development Engineer (R&D) 1-2 Design and Technology Platform Engineer (DTP) 1-3 Specialty Engineer (Specialty) 1-4 Integrated Interconnect & Packaging Engineer (IIP) Operations (營運組織) 2-1 Process Integration Engineer (PIE) 2-2 Process Engineer (PE) 2-3 Equipment Engineer (EQ) 2-4 Intelligent Manufacturing Engineer (IMC/MFG) 2-5 Facility Engineer (FAC) 2-6 Product Engineer (PE) 2-7 Advanced Packaging Technology and Service Engineer (APTS) 2-8 Quality & Reliability Engineer (Q&R) 2-9 Module Associate Engineer (MAE) Corporate Business (策略暨支援組織) 3-1 Information Technology Engineer (IT) 3-2 Corporate Planning Organization (CPO) 3-3 Materials Management Engineer (MM) 3-4 Human Resources Specialist (HR) 【履歷填寫重點提醒】 1. 請務必優先填寫完成「畢業學校、畢業年份、就讀科系」後再更新履歷細節資訊，在系統資料送出後，您仍可以在收到面試邀請前持續更新內文。 2. 請詳細填寫履歷資料，包括學歷、專業關鍵字及自傳等內容；若您非外籍人士，除專業關鍵字外，其他欄位請以全中文填寫即可。 3. 自傳與專業關鍵字欄位有字數限制(1000字)，請確認字數是否符合要求，以免導致網頁無法成功送出。 4. 若履歷欄位為下拉式選單，當找不到合適內容時，可點選「其他」手動資料送出。 更多2026預聘暨研發替代役招募活動，請密切關注台積電FB粉絲專頁@加入台積 共創奇蹟 【Notes for Resume Submission】 1. Please prioritize completing the 〝Graduation School, graduation year and major〝 sections when submitting your resume. You can continue to update the content before receiving an interview invitation after the system data has been submitted. 2. Please click “Apply” and provide detailed resume information, including your education level, profession (with keywords that best describe your domain expertise) and autobiography, etc. If you are not a foreigner, please fill out the form (except for the keywords) in Mandarin. 3. Please make sure that the total work counts of your autobiography and keywords (domain description) are within a maximum of 1,000 characters respectively to prevent technical issues. 4. If a resume field is presented as a dropdown menu and you cannot find a suitable option, you may select 〝Other〝 and manually submit the required information. For more information about the 2026 Advanced Offer (AO) and R&D Substitute Service Program (RDSS), please follow our TSMC Facebook fan page@加入台積 共創奇蹟
- 月薪35000~60000元 高雄市三民區 2年工作經驗 4天前更新展開
1. 審核有關各項費用支付之發票、單據及帳務處理。 2. 審核廠商貨款或費用等應收付款項帳務。 3. 專案帳務損益。 4. 審核與申報各項稅務作業。 5. 稅務機構函文往來處理。 6. 熟成本會計，編制進耗存表，並進行分析。 7. 完成費用暫估及編製月結報表。 8. 編製各項差異分析報表。 9. 編製總帳財報、合併報表。 10. 配合會計師查帳作業，並將調整分錄入帳。 本職位具有重要的財務管理職責，對公司財務的準確性和穩定性負有重要責任。同時，本職位也提供了良好的職業發展前景，並有機會晉升為高級財務職位。 歡迎符合要求的求職者申請本職位，並將個人簡歷及相關證明文件發送至招聘單位。
全勤獎金年節獎金員工生日禮金年終獎金三節獎金 - 月薪33000~80000元 高雄市三民區 工作經歷不拘 今天剛更新展開
【工作內容】 社區大樓網路整合性服務 1.推廣和銷售寬頻網絡業務。 開拓新客戶，維護老客戶。 2.瞭解需求： 瞭解客戶需求，提供合適的寬頻網絡解決方案。 3.市場分析： 關注行業動態，分析競爭對手情況。 4.技術支持： 為客戶提供技術咨詢和支持。 5.內部協調： 與公司內部其他部門保持良好溝通協調，確保客戶需求得到滿足。 6.遵守規定： 遵守公司規章制度，維護公司形象。 7.新社區開發進場與維護。 【條件需求】 1. 不懼困難，能吃苦耐勞，善於溝通，善解人意。 2. 有高度服務的熱誠、有積極的工作態度，。 3. 對賺錢有興趣，想當老闆的人。 4. 對服務有興趣，積極學習，不斷提升能力。 5. 具汽、機車駕照。 【薪資】 前三個月：底薪 33000~40000區間 通過考核：底薪 33000~60000區間+個人工作獎金+公司配給獎金 ※薪資，我們會依照你的工作表現與能力展現成果來適時地給予調整。※ 【休假】 依行政機關行事曆公告當月應休幾日為依據配合排休。
全勤獎金年節獎金員工生日禮金年終獎金三節獎金 - 月薪45000元 桃園市楊梅區 2年工作經驗 4天前更新展開
1.付款流程與帳款管理 審核廠商請款和費用支出單據、驗收文件及合約付款條件 安排應付帳款支付時程，控管現金流 追蹤保固保留款、工程請款與回款進度 2.文中系統導入與流程優化 協助文中系統建置、帳務資料轉入與使用流程規劃 3.帳務處理與財務報表編製 負責日常記帳、傳票編製、帳務核對 編製月報、季報、年度財務相關報表 協助年度結帳及配合會計師查核作業 建立各工地成本資料，整理合約 負責扣繳、二代健保等申報 主管交辦事項
產假產檢假安胎假家庭照顧假年終獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 10天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 10天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 10天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16567&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪32000元 台北市中正區 2年工作經驗 7天前更新展開
1.文書資料處理與歸檔，簽核文件的整理及相關發送作業 2.協助公司活動與會議安排，並負責會議記錄與追蹤 3.管理郵件收發分類、執行文具與設備採購作業 4.熟練使用Microsoft Office套件，進行資料輸入與報表製作 5.更新公司官網內容，處理電子公文系統與資料庫維護 6.熟悉環境衛生法規，提供專業行政支援與相關報告製作 7.管理辦公室環境與設備，協助零用金和銀行業務處理
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 10天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16568&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 時薪230元 新北市板橋區 工作經歷不拘 1天前更新展開
樂田環境~ 福利佳 個案多 同仁優 每月160 小時月薪五萬元以上 1. AA碼+轉帳費+加班費 2.油料費補貼 3.勞健保+勞退+團保意外險+長照機構責任險 4.免費訓練長照積分認證20小時/年 5.依員工績效考核，每年發給績效獎金 6.依營運狀況及員工服務狀況發放年終獎金 7.端午節及中秋節獎金 8.特休補償金發放 9.補助員工體檢 10.加班費依據勞基法規定給付 11.員工聚餐（春酒、尾牙、不定期聚餐）
年節獎金年終獎金三節獎金績效獎金員工團保 - 月薪40000~50000元 台北市中正區 3年工作經驗 7天前更新展開
1.審核與處理各類費用支付單據及帳務事宜 2.編製合併與財務報表，進行費用控管分析 3.執行營業稅及營所稅等申報與稅務規劃 4.操作ERP系統(鼎新)，熟練Excel製作預算與報表 5.進行環保專案財務規劃及成本控管核算 6.配合會計師查帳及內部稽核流程改善 7.處理銀行往來及風險管理，提供財務建議
- 面議（經常性薪資達4萬元或以上） 台北市大同區 2年工作經驗 3天前更新展開
工作內容： 1. 店家拜訪及貨架商品維護，並需與通路門市主管溝通 (日常) 2. 訪店加強商品生動化陳列【排面.海報.冰箱.補貨.陳列…等】(日常) 3. 鮮度管理/庫存查核與安全庫存掌控、異常回報 (日常) 4. 市場及競品資訊蒐集分享 (日常) 5. OUTLOOK週行程安排 (每週) 6. 擔當區域內店家差異分析 (每月) 7. 訂單及到貨異常協助處理 (不定期) 8. 協助通路販促活動規劃 (不定期)
就業保險產假產檢假家庭照顧假年終獎金 - 時薪230元 新北市樹林區 工作經歷不拘 1天前更新展開
樂田環境~ 福利佳 個案多 同仁優 每月160 小時月薪五萬元以上 1. AA碼+轉帳費+加班費 2.油料費補貼 3.勞健保+勞退+團保意外險+長照機構責任險 4.免費訓練長照積分認證20小時/年 5.依員工績效考核，每年發給績效獎金 6.依營運狀況及員工服務狀況發放年終獎金 7.端午節及中秋節獎金 8.特休補償金發放 9.補助員工體檢 10.加班費依據勞基法規定給付 11.員工聚餐（春酒、尾牙、不定期聚餐）
年節獎金年終獎金三節獎金績效獎金員工團保 -
上一頁 下一頁
第 3674 / 18134 頁
第 3664 / 18134 頁第 3665 / 18134 頁第 3666 / 18134 頁第 3667 / 18134 頁第 3668 / 18134 頁第 3669 / 18134 頁第 3670 / 18134 頁第 3671 / 18134 頁第 3672 / 18134 頁第 3673 / 18134 頁第 3674 / 18134 頁第 3675 / 18134 頁第 3676 / 18134 頁第 3677 / 18134 頁第 3678 / 18134 頁第 3679 / 18134 頁第 3680 / 18134 頁第 3681 / 18134 頁第 3682 / 18134 頁第 3683 / 18134 頁第 3684 / 18134 頁
