面議(經常性薪資達4萬元或以上) 新竹市東區 4年工作經驗 今天剛更新
1. Package related structure stress analysis including warpage, material study.
2. Package and board level stress modeling for TCT, drop and vibration.
3. IC and package thermal analysis, modeling and characterization
4. Chip-Package-PCB thermal co-simulation and design.
5. System level thermal simulation 6. System level stress simulation
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