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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 月薪45000~47400元 新竹縣寶山鄉 工作經歷不拘 3天前更新展開
✅ 底薪保障：試用期 33,300 元，只要表現穩定、通過考核，月薪立即調升至 45,000 元。 ✅ 績效獎金：45K 只是基本！只要出勤正常、技術熟練。配合度高，獎金另外算！ ✅ 休假制度：作息平衡，固定週休二日。我們重視效率，不鼓勵無謂加班，讓你賺到錢也能兼顧家庭與生活品質。 ✅ 技術增值： 學習精密洗孔、核心鑽孔技術，成為科技廠不可或缺的專業施工人才 📝 工作內容： 1. 負責廠房、無塵室環境之精密洗孔施工。 2. 配合工程進度進行鑽孔，防火填塞與現場環境維護。 3. 需穿著無塵服（環境乾淨、恆溫，避開戶外曝曬）。 4. 下方警戒與落塵，集水防護作業。無懼高症，有攀岩愛好者🉑。 💪 我們在找這樣的你： • 出勤紀錄優良，具備責任感。 • 能適應無塵室穿著需求（有相關經驗薪資面議）。 • 無經驗可，我們會手把手帶你到上手。 【移動自由獎勵】：凡願意配合區域調動者，另享優渥「異地安家津貼」與「職等加給」。
全勤獎金績效獎金生日假伙食津貼需穿著員工制服 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 34天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19038&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 34天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19037&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 34天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19036&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) processes and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 34天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19035&source=1111&tags=Domestic+Campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 時薪210~250元 台北市信義區 工作經歷不拘 43天前更新展開
📣 亞米克，來自台北的溫暖品牌， 每天用一杯飲品、一道餐點，把「用心與美味」送到每位顧客手上。 我們相信：美食是溝通，服務是溫度。 現在，我們正在找你 有熱情、願意一起打拼的你！ ––- 📬【工作內容】 ・食材處理：洗菜、削皮、切料不陌生 ・料理製作：熟悉配方、協助出餐 ・飲品製作：現調手搖飲品 ・清潔維護：餐具與設備清潔整理 ・顧客服務：點餐、收銀、送餐 ・環境整潔：營造舒適氛圍 ・支援外送：讓美味準時送到家 ––- 🍳【我們喜歡這樣的你】 ✓做事不怕學、有條理、願意動手 ✓喜歡團隊合作、也能獨當一面 ✓充滿親和力、態度積極有禮 ✓對餐飲有熱情 ––- 💖【加入亞米克，你會擁有】 ✦餐飲培訓｜不是打工，而是學一技之長 ✦積極工作回饋｜表現佳就有調薪機會 ✦團隊氛圍溫暖｜不怕你問，只怕你不學
三節獎金意外險員工團保需穿著員工制服 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 34天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19034&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 時薪500~800元 新北市土城區 工作經歷不拘 4天前更新展開
1. 負責藥品調劑，包括處方審核及確保調劑正確性。 2. 進行用藥指導及健康諮詢服務，協助顧客了解正確用藥方法及健康管理。 3. 負責藥品備藥、補貨與訂購，確保藥品供應充足。 4. 熟悉藥品相關法規和政策，並依據規範執行相關作業。 5. 管理藥品庫存，監控有效期限，確保藥品品質與安全。 6. 處理藥品不良反應事件，提供專業解決方案及建議。 7. 參與店務營運管理，包括效能提升及銷售目標達成。 歡迎加入我們的團隊，成為守護健康的重要角色，期待您的加入！立即投遞履歷！
產假產檢假全勤獎金年節獎金年終獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 34天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19033&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 時薪200~250元 台北市信義區 工作經歷不拘 43天前更新展開
📢 亞米克，來自台北的溫暖品牌， 每天用一杯飲品、一道餐點，把「用心與美味」送到每位顧客手上。 我們相信：美食是溝通，服務是溫度。 現在，我們正在找你 有熱情、願意一起打拼的你！ ––- 📬【工作內容】 ・食材處理：洗菜、削皮、切料不陌生 ・料理製作：熟悉配方、協助出餐 ・飲品製作：現調手搖飲品 ・清潔維護：餐具與設備清潔整理 ・顧客服務：點餐、收銀、送餐 ・環境整潔：營造舒適氛圍 ・支援外送：讓美味準時送到家 ––- 🍳【我們喜歡這樣的你】 ✓做事不怕學、有條理、願意動手 ✓喜歡團隊合作、也能獨當一面 ✓充滿親和力、態度積極有禮 ✓對餐飲有熱情 ––- 💖【加入亞米克，你會擁有】 ✦餐飲培訓｜不是打工，而是學一技之長 ✦積極工作回饋｜表現佳就有調薪機會 ✦團隊氛圍溫暖｜不怕你問，只怕你不學
三節獎金意外險員工團保需穿著員工制服 - 月薪45000~60000元 桃園市大園區 工作經歷不拘 9天前更新展開
1.電機、機械、水電設備維修保養 2.電機設備及機電儀表工具的操作知識 3.具備電路保護裝置、電動機的操作技能 4.了解配電管線及機務相關設備的操作原理 5.具有電器控制維修專長
年終獎金三節獎金績效獎金誤餐費員工聚餐 - 月薪39000~50000元 台北市信義區 工作經歷不拘 43天前更新展開
👨🍳 誠徵全職煎台人員 為每一份料理負責，為團隊一起努力 💪 💖 我們相信—— 一間店的靈魂，不只是食物，而是一起打拼的人。 亞米克正在找的不只是一雙會煎的手， 而是一個能扛責任、有溫度的夥伴。 ––- 📋【工作內容】 1.煎台出餐操作（煎、煮、整盤組合） 2.食材處理與準備（洗、切、備料） 3.餐點與飲品製作、餐具與環境清潔 4.支援點餐、結帳與基本顧客服務 這不只是一份「工作」，而是一份對品質與夥伴的承諾。 ––- 🕘【職缺資訊】 - 地點｜台北市信義區虎林街44之1號 - 時間｜06:30～15:30（日班） - 休假｜排休／輪休 - 福利｜工作獎金 ––- 🌿【這份工作，適合這樣的你】 ☑ 願意守時、願意承擔、做事不馬虎 ☑ 願意學習，有團隊精神 ☑ 對餐飲有熱情，做每一道料理都用心 ☑ 想要穩定、有制度 ––- 💥【加入亞米克，你會感受到】 ✔穩定、有制度的工作安排 ✔ 一起吃飯、一起扛責的團隊文化 ✔做得好，不會被看不到；努力，一定有人看見。 ––- 🍳「我們想找的，不只是來上班的人， 是願意一起撐起店裡每一天的家人。」 👉 如果你也在找一份值得投入的工作， 那我們，很願意等你來。
三節獎金意外險員工團保需穿著員工制服 -
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