-
職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 月薪28590~37912元 雲林縣斗六市 工作經歷不拘 5天前更新展開
1.辦理病患出、入院相關作業流程手續。 2.每日登錄病人使用各項醫療、護理處置、衛材之計價及漏帳費用之催繳。 3.請領及請購醫材，庫房管理之大量點滴、衛材、各項表單、日常用品的補充與歸類。 4.臨時交辦事項。
績效獎金三節獎金年終獎金年節獎金員工體檢 - 論件計酬40000~80000元 桃園市中壢區 工作經歷不拘 5天前更新展開
本公司主要業務為電商銷售，自成立以來以銷售優質車為方向，讓買賣雙方均能達到放心、滿意、購車方便為理念。 必備條件: 1. 微笑/親切/有禮貌 2. 細心/貼心/責任心 3. 拒絕愛遲到的夥伴 工作內容: 1. 接待客人至指定位置介紹車輛性能及特色 2. 具備電腦文書作業與電腦美工軟體技能佳 (無相關工作經驗將會有前輩教學，簡易好上手) 3. 網路平台廣告編輯上下架 4. 自媒體運用與推廣 5. 協助業務人員處理銷售業務相關之公司內部作業或部門後勤支援 6. 維護辦公室環境與設備之整潔 7. 協助產品報價查詢及相關售後服務 8. 亦可配合選擇論件計酬 面試地址:桃園市中壢區延平路500號12樓-最佳商務中心
- 時薪190~200元 桃園市中壢區 工作經歷不拘 5天前更新展開
1、協助門診驗光檢查作業。 2、協助使用眼科檢查儀器。 3、協助門診相關作業流程。 #兼職時段： 週一～週六晚診：18:00~21:00 #限視光科系(在學)或畢業3年內者
就業保險產假產檢假家庭照顧假分紅入股 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 5天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16574&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 廠務工程師為整合各項廠區資源，提供晶圓生產所需之電力、水、氣體、化學品、空調等，為台積高度智慧自動的生產單位，供應最高品質、最穩定的生產作業環境。近年廠務工程師更肩負環境保護與永續的責任，如何精進節水、節能、減碳、環保的廠務運轉技術，更是廠務工程師可以發揮專業與創意的主舞台。 1. Responsible for the planning, constructing, operating, and maintaining semiconductor plant facility systems, including risk analysis of facility system operations and supply quality, allocating resources and energy, managing construction safety. 2. Provide a stable facility system, including power, water, gas, chemicals and HVAC, to meet wafer production requirements. 3. Collaborate with other departments to ensure that the facility system is operating at the highest level of quality when on duty. 4. Construction management & project coordination.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 5天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology.
- 時薪190~190元 桃園市八德區 工作經歷不拘 5天前更新展開
1.熟悉使用掃把、拖把和吸塵器等清潔工具進行環境清理 2.負責廢棄物分離與資源回收處理，熟悉回收分類規範 3.執行園內公共區域走廊及衛生間的日常清掃與保養 4.具備基本安全意識，熟悉清潔用品使用安全及其應用方法 5.適時提供日常垃圾清理，維持室內外整潔與衛生標準 6.協助處理特殊清潔要求，應對緊急清潔情況 7.適度與小朋友互動，確保清潔時兒童活動的安全 8.愛乾淨潔癖的你歡迎加入~
勞保健保 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 5天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16576&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production.
- 月薪36000~40000元 台南市中西區 工作經歷不拘 5天前更新展開
1、負責門診及跟刀醫療業務。 2、協助醫師執行醫療業務。 3、負責手術前/後衛教說明。 4、協助使用眼科檢查儀器。 5、其他(主管交辦事項) ◎ 需具備護理師執照(無眼科經驗可) ◎ 薪資=月薪+獎金(多種獎金制度) ◎ 排班排休制，單週40小時 (四周變形工時)，無大夜班! ◎ 每月依照國定假日(紅字)天數休假(8~14天)
就業保險產假產檢假家庭照顧假分紅入股 - 時薪190元 台中市潭子區 工作經歷不拘 5天前更新展開
1.熟練使用Adobe Photoshop、Illustrator進行平面設計作業 2.具備基礎攝影技能，拍攝並處理影像素材 3.具備視覺設計能力，熟悉色彩搭配及版面編排 4.創作品牌識別設計，增強品牌視覺呈現效果 5.設計社交媒體內容，製作吸睛的動態及靜態圖像 6.了解運動文化，掌握運動相關設計趨勢 7.協助製作運動活動視覺素材及專案設計
產假禮品激勵獎金績效獎金生日假 - 月薪33000~48000元 高雄市仁武區 工作經歷不拘 2天前更新展開
1.光電系統案場維運及巡檢。 2.PV模組、變流器、通訊等設備查修更換。 3.監控電廠效能狀態。 4.會操作三用電錶 5.新建光電案場監工及光電案場驗收 6主要工作案場：台中以南。 (*)加分條件 1.具汽車駕照（手排）。 2.具備電性基礎常識。 3.具水電配管、配線等1年以上工作經驗或相關證照者。 (*)意者請洽 何建慶0976015565
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 5天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16577&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis, manufacturing production quality management and reliability assessment, research, and development of new analysis protocol. 3. Customers problem resolving for production quality / reliability issues.
- 月薪55000~70000元 台北市大安區 工作經歷不拘 5天前更新展開
1.醫務行政：熟悉診所設立相關法規，配合主管單位審查，健保相關業務管理 2.醫療流程： 建立現場服務SOP並落實督導管理。 3.推動管理部門的決議及專案活動執行。 4.醫師人力資源安排、協調及開發。 #公司有年加薪制度，個人可憑工作能力在薪資上穩定成長 #具醫療儀器業務經驗者佳
就業保險產假產檢假家庭照顧假分紅入股 -
上一頁 下一頁
第 174 / 14469 頁
第 164 / 14469 頁第 165 / 14469 頁第 166 / 14469 頁第 167 / 14469 頁第 168 / 14469 頁第 169 / 14469 頁第 170 / 14469 頁第 171 / 14469 頁第 172 / 14469 頁第 173 / 14469 頁第 174 / 14469 頁第 175 / 14469 頁第 176 / 14469 頁第 177 / 14469 頁第 178 / 14469 頁第 179 / 14469 頁第 180 / 14469 頁第 181 / 14469 頁第 182 / 14469 頁第 183 / 14469 頁第 184 / 14469 頁
