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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 月薪30000~40000元 新竹縣竹北市 工作經歷不拘 3天前更新展開
1. 協助進行電路板設計布局，優化電子元件位置與連接路徑。 2. 支援通訊相關設備的測試與故障排除，提供技術建議。 3.執行光電模組產品測試流程並整理測試報告 4.協助製作生產流程文件及完善技術資料 5.準備與編寫技術報告，並進行相關文件歸檔管理。 6.執行主管交辦的工程相關事項，及時反饋進度與問題。
產假年終獎金員工聚餐尾牙勞保 - 月薪32000元 台北市中正區 工作經歷不拘 2天前更新展開
1. 客戶關係管理：負責與客戶溝通、維護並建立良好的合作關係，提供快速且精確的回應。 2. 行政庶務處理：協助文件整理、資料輸入以及內部數據更新，確保資料準確性。 3. 業務支援：負責訂單處理與追蹤，確保供應鏈中各環節順暢運作。 4. 溝通與協調：與內外部團隊合作解決問題，促進工作流程的順利進行。 5. 資料分析與報告：收集並整理營運數據，撰寫分析報告供決策參考。 6. 活動協助：協助內部會議與活動的安排，確保活動順利進行。 7. 供應商聯繫：負責與供應商洽談，確認採購進度，保障物料供應。 8. 時間管理：有效安排工作時程，協助主管分配每日工作優先級。
就業保險員工生日禮金年終獎金激勵獎金績效獎金 - 月薪28800~28800元 新北市中和區 工作經歷不拘 1天前更新展開
場地巡視,服務及收取臨停和月租繳費,電腦資料key-in及報表填寫,場地清潔及維護,支援及場地設備簡易狀況排除及主管交辦事項
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16567&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16568&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation.
- 月薪30000~32000元 台南市中西區 無工作經驗 6天前更新展開
1、協助專業技師執行各項查檢勤務工作。 2、協助處理一般文書建檔歸檔及追蹤之行政工作和工務資料庫管理。 3、負責各項工具/物料管理(含進料、接料、檢查庫存備料)。 4、差勤管理系統登入與管理、請(維)修單執行與追蹤。 5、負責製作會議記錄並追蹤處理決議事項。
- 時薪190元 台中市霧峰區 工作經歷不拘 6天前更新展開
🎉【恩加牙醫診所誠徵 晚班長期工讀生】 📍想培養醫療相關經驗？想找一份穩定又有成就感的兼職工作？ 我們正在找的，就是你！ 恩加牙醫診所歡迎對醫療、助人工作有興趣的你加入團隊， 在友善的環境中學習、成長，為未來打下專業基礎！ 🔹工作內容 ✔ 協助診間準備與環境整理 ✔ 協助牙醫師與助理完成基本任務 ✔ 簡單行政工作與病患接待 ✔ 無經驗可，由資深人員帶領學習 🔹我們提供 ✅ 學習牙科知識與臨床流程的機會 ✅ 友善團隊氛圍、完整培訓制度 ✅ 表現良好者，有機會轉正或長期合作發展 🔹我們希望你 ✔ 長期穩定配合（至少半年以上） ✔ 對醫療工作有興趣、願意學習 ✔ 細心負責、守時有禮 ✔ 大學生、社會新鮮人皆歡迎！ 📩 意者請投遞履歷或來電洽詢 📅 面試時間彈性安排，歡迎預約了解詳情！
勞保健保 - 月薪30000元 宜蘭縣五結鄉 工作經歷不拘 6天前更新展開
1.清潔和維護客房及公共區域，熟悉清潔用品及設備的正確操作 2.補充和管理客房用品，妥善整理工作車與備品間 3.處理客人需求問題，提供基本國、台語溝通服務 4.遵守清潔標準程序，紀錄並回報重要事項 5.回報客房狀況並協助進行簡易故障排除
員工生日禮金年終獎金三節獎金績效獎金意外險 - 時薪190元 台中市霧峰區 工作經歷不拘 6天前更新展開
🎉【恩加牙醫診所誠徵 午班長期工讀生】 📍想培養醫療相關經驗？想找一份穩定又有成就感的兼職工作？ 我們正在找的，就是你！ 恩加牙醫診所歡迎對醫療、助人工作有興趣的你加入團隊， 在友善的環境中學習、成長，為未來打下專業基礎！ 🔹工作內容 ✔ 協助診間準備與環境整理 ✔ 協助牙醫師與助理完成基本任務 ✔ 簡單行政工作與病患接待 ✔ 無經驗可，由資深人員帶領學習 🔹我們提供 ✅ 穩定工時、彈性排班（午班／晚班可討論） ✅ 學習牙科知識與臨床流程的機會 ✅ 友善團隊氛圍、完整培訓制度 ✅ 表現良好者，有機會轉正或長期合作發展 🔹我們希望你 ✔ 長期穩定配合（至少半年以上） ✔ 對醫療工作有興趣、願意學習 ✔ 細心負責、守時有禮 ✔ 大學生、社會新鮮人皆歡迎！ 📩 意者請主動投遞履歷或來電洽詢 📅 面試時間彈性安排，歡迎預約了解詳情！ #恩加牙醫 #長期工讀 #牙科兼職 #診所徵才 #醫療實習機會 #學生兼職 #午晚班工讀
勞保健保 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16569&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Job Role : 1. Highly motivated veteran and new talents to join force research and pathfinding in Advanced packaging and system integration technologies for both extending Moore‘s Law and in post-Moore era. 2. Long prospective career path in semiconductor technologies looking at more Moore‘s and beyond Moore‘s Law Eco-industry. Responsibilities: 1. Integration engineering for process integration and device/system level modeling, including electrical, thermal, and mechanical modeling. 2. Module engineering in advanced FEOL/MEOL/BEOL wafer process modules, and in advanced system packaging, including wafer level fan-out, interposers, and 3D chip stacking. 3. Silicon photonics expertise in the following areas: optical components design (lens, modulator, detector, waveguide w/ various materials), photonic circuits design (w/ focus on optical communication), and computer system architect (w/ focus on parallel processing and high-speed networking).
- 時薪190~190元 桃園市龍潭區 工作經歷不拘 1天前更新展開
(1)協助執行牙科部內各項醫療及行政相關事宜。 (2)維持部內環境整齊清潔。 (3)每日依規定對醫療裝備及器械做保養、清潔及消毒。 (4)提供醫師執行醫療時必要之協助，熟悉醫療用品之準備及操作方式。 (5)執行櫃台作業時，協助患者就診、報到、批價、病歷整理黏貼等相關事宜。 (6)熟悉各項牙科衛教，能對患者在治療前後做適當的說明。 (7)確實執行部科交辦之任務及工作。
產檢假產假年終獎金員工及眷屬喪葬補助需穿著員工制服 -
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