- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 時薪196~196元 台北市中山區 工作經歷不拘 25天前更新展開
身為引領時尚潮流的藥妝產業一員 你比任何人都更追求美麗的第一手資訊 及健康趨勢的市場脈動 也要將這份熱情感染給你所服務的每一位顧客 讓他們也可以跟你一樣Look Good, Feel Great 同時也要讓顧客可以感受到專屬於他的完美購物體驗 因此你和其他的團隊成員們身負重任 要確保門市所有的營運流程及時與正確的完成 除了定期及例行工作之外 你還需要能主動思考並用更聰明簡捷的工作方式 才能讓我們可以超越顧客的期待 另外善用好奇心及主動學習 可以讓你有跳躍式的成長與進步 而迅速及有效行動力 將會讓你在屈臣氏能得到更多的成就
年終獎金春酒激勵獎金績效獎金員工團保 - 時薪196~196元 台北市士林區 工作經歷不拘 25天前更新展開
身為引領時尚潮流的藥妝產業一員 你比任何人都更追求美麗的第一手資訊 及健康趨勢的市場脈動 也要將這份熱情感染給你所服務的每一位顧客 讓他們也可以跟你一樣Look Good, Feel Great 同時也要讓顧客可以感受到專屬於他的完美購物體驗 因此你和其他的團隊成員們身負重任 要確保門市所有的營運流程及時與正確的完成 除了定期及例行工作之外 你還需要能主動思考並用更聰明簡捷的工作方式 才能讓我們可以超越顧客的期待 另外善用好奇心及主動學習 可以讓你有跳躍式的成長與進步 而迅速及有效行動力 將會讓你在屈臣氏能得到更多的成就
年終獎金春酒激勵獎金績效獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪50000~65000元 台南市新市區 工作經歷不拘 3天前更新展開
【工作說明】 1. 負責生產設備日常維護、保養及穩定運轉 2. 處理設備故障、異常分析及問題排除 3. 進行設備效能改善，提升生產效率及稼動率專案 【應徵條件】 理工相關科系，無經驗可 【上班時間】 需配合四班二輪與加班 日班:07:30-19:35；夜班:19:30-7:35 【薪資條件】 以工作20天計算，早班50,000~55,000元、夜班60,000~65,000元(含輪班津貼及加班費) 【特殊備註】 正式生產前需至高雄廠培訓
家庭日員工結婚補助生育補助社團補助員工在職教育訓練 - 月薪33500~33500元 台北市中山區 工作經歷不拘 5天前更新展開
身為引領時尚潮流的藥妝產業一員 你比任何人都更追求美麗的第一手資訊 及健康趨勢的市場脈動 也要將這份熱情感染給你所服務的每一位顧客 讓他們也可以跟你一樣Look Good, Feel Great 同時也要讓顧客可以感受到專屬於他的完美購物體驗 因此你和其他的團隊成員們身負重任 要確保門市所有的營運流程及時與正確的完成 除了定期及例行工作之外 你還需要能主動思考並用更聰明簡捷的工作方式 才能讓我們可以超越顧客的期待 另外善用好奇心及主動學習 可以讓你有跳躍式的成長與進步 而迅速及有效行動力 將會讓你在屈臣氏能得到更多的成就
年終獎金春酒激勵獎金績效獎金員工團保 - 時薪196~196元 台北市中山區 工作經歷不拘 27天前更新展開
看到藥妝店必逛的你 划手機必追美妝部落客的你 想學習更多保健知識的你 只要你符合上面任一項 你就是我們要找的人 想提升自己的專業，小屈補助你考美容丙級 想免費出國旅遊，小屈每年提供12間門市開心去玩 想為環境盡一份心力，小屈每年舉辦志工活動還有志工假 加入小屈，你能得到更多 歡迎想挑戰不同職涯的你成為小屈人
年終獎金春酒激勵獎金績效獎金員工團保 - 時薪196~196元 台北市中山區 工作經歷不拘 27天前更新展開
看到藥妝店必逛的你 划手機必追美妝部落客的你 想學習更多保健知識的你 只要你符合上面任一項 你就是我們要找的人 想提升自己的專業，小屈補助你考美容丙級 想免費出國旅遊，小屈每年提供12間門市開心去玩 想為環境盡一份心力，小屈每年舉辦志工活動還有志工假 加入小屈，你能得到更多 歡迎想挑戰不同職涯的你成為小屈人
年終獎金春酒激勵獎金績效獎金員工團保 - 月薪32000~32000元 台北市士林區 工作經歷不拘 27天前更新展開
身為引領時尚潮流的藥妝產業一員 你比任何人都更追求美麗的第一手資訊 及健康趨勢的市場脈動 也要將這份熱情感染給你所服務的每一位顧客 讓他們也可以跟你一樣Look Good, Feel Great 同時也要讓顧客可以感受到專屬於他的完美購物體驗 因此你和其他的團隊成員們身負重任 要確保門市所有的營運流程及時與正確的完成 除了定期及例行工作之外 你還需要能主動思考並用更聰明簡捷的工作方式 才能讓我們可以超越顧客的期待 另外善用好奇心及主動學習 可以讓你有跳躍式的成長與進步 而迅速及有效行動力 將會讓你在屈臣氏能得到更多的成就
年終獎金春酒激勵獎金績效獎金員工團保 - 日薪2800~3200元 新北市新莊區 工作經歷不拘 4天前更新展開
1. 專案領導及管理，可獨立作業，監督水電工程現場 2.按照藍圖進行高低壓配電線路施工、電路維修及電器設備安裝 3.配置水電消防配管配線、高低壓電氣設備安裝 4.一般建築物的供水與消防給水管路的簡單基本設計、施工與維護，含污水、排水系統
年終獎金績效獎金免費供餐上下班車資補助意外險 - 月薪30500~38000元 台北市士林區 工作經歷不拘 7天前更新展開
1. 遵照大樹聽力中心的專業與服務流程，為客戶進行聽力檢測及諮詢服務，並根據目標分配達成業績指標 2. 了解顧客的需求，以顧問式銷售方式進行助聽器的衛教和推廣，改善其聽覺品質 3. 定期關懷顧客助聽器的使用狀況，建立良好的客戶互動與溝通 4. 協助舉辦大樹聽力保健活動、衛教活動等等，推廣聽覺的重要性 5. 負責客群開發與客戶關係管理 6. 其他主管交辦事項
國內旅遊國外旅遊員工聚餐尾牙禮品 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
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