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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 月薪33000~45000元 新北市三峽區 工作經歷不拘 2天前展開
1.認識、學習操作及維修牙醫器材設備 2.指導患者做好口腔衛生及保健 3.協助牙醫師看診跟看診前準備器械 讓看診流程順暢 4.器械消毒、Ｘ光攝影之清潔及準備 5.接受診所課程，提升自我的醫療專業度 有意從事牙科助理 願意長期從事正職工作 無誠勿試 有經驗者優先錄取，無經驗歡迎加入 星期日上班者另有假日津貼 上班時間：一周休二日 *一個月上滿44診
產假產檢假安胎假全勤獎金年終獎金 - 時薪210~250元 台北市內湖區 工作經歷不拘 6天前展開
1.不需跟專職輔導老師一樣，但也要有部分輔導解題能力 2.行政助理，協助導師排課派課、現場管理 福利：有全勤獎金、有代班獎金、可免費參加每次段考同樂會用餐、可免費參加尾牙。
三節獎金不用補班員工在職教育訓練良好升遷制度 - 時薪210~250元 台北市內湖區 工作經歷不拘 6天前展開
1.不需跟專職輔導老師一樣，但也要有部分輔導解題能力 2.行政助理，協助導師排課派課、現場管理 福利：有全勤獎金、有代班獎金、可免費參加每次段考同樂會用餐、可免費參加尾牙。
三節獎金不用補班員工在職教育訓練良好升遷制度 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16565&source=1111&tags=AO+2026_1111 Description : R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 月薪32000元 台北市中正區 工作經歷不拘 2天前展開
💼【業務助理】熱烈招募中！ 你是擅長管理時間與處理多項任務的高手嗎？對細節有驚人的專注力且充滿團隊精神？那麼你就是我們正在尋找的一員！ ✨ 工作內容： 1. 客戶關係管理：協助業務快速完成訂單流程，提供準確又貼心的服務。 2. 行政庶務處理：負責文件整理、資料輸入等，確保所有資料都一絲不苟！ 3. 業務支援：需要的時候協助公司產品送貨，讓每張訂單都能順利完成。 4. 活動協助：定期參與展覽或課程研討會，為團隊出一份力！ 5. 時間管理：智慧地安排工作優先級，成為主管的強力後盾！ 🎯 加入我們，感受團隊活力十足的氛圍，並成為不可或缺的一環！準備好迎接挑戰並在工作中尋找成就感了嗎？期待看到你的加入！👏
就業保險員工生日禮金年終獎金激勵獎金績效獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16566&source=1111&tags=AO+2026_1111 Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16567&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 1111南台灣職場小語
【推薦工作】作業員、技術員、包裝員｜無經驗可、享週休二日！
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16568&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪31000元 宜蘭縣五結鄉 工作經歷不拘 3天前展開
1.清潔和維護客房及公共區域，熟悉清潔用品及設備的正確操作 2.補充和管理客房用品，妥善整理工作車與備品間 3.處理客人需求問題，提供基本國、台語溝通服務 4.遵守清潔標準程序，紀錄並回報重要事項 5.回報客房狀況並協助進行簡易故障排除
員工生日禮金年終獎金三節獎金績效獎金意外險 - 時薪230元 新北市板橋區 工作經歷不拘 4天前展開
樂田環境~ 福利佳 個案多 同仁優 每月160 小時月薪五萬元以上 1. AA碼+轉帳費+加班費 2.油料費補貼 3.勞健保+勞退+團保意外險+長照機構責任險 4.免費訓練長照積分認證20小時/年 5.依員工績效考核，每年發給績效獎金 6.依營運狀況及員工服務狀況發放年終獎金 7.端午節及中秋節獎金 8.特休補償金發放 9.補助員工體檢 10.加班費依據勞基法規定給付 11.員工聚餐（春酒、尾牙、不定期聚餐）
年節獎金年終獎金三節獎金績效獎金員工團保 - 時薪230元 新北市樹林區 工作經歷不拘 4天前展開
樂田環境~ 福利佳 個案多 同仁優 每月160 小時月薪五萬元以上 1. AA碼+轉帳費+加班費 2.油料費補貼 3.勞健保+勞退+團保意外險+長照機構責任險 4.免費訓練長照積分認證20小時/年 5.依員工績效考核，每年發給績效獎金 6.依營運狀況及員工服務狀況發放年終獎金 7.端午節及中秋節獎金 8.特休補償金發放 9.補助員工體檢 10.加班費依據勞基法規定給付 11.員工聚餐（春酒、尾牙、不定期聚餐）
年節獎金年終獎金三節獎金績效獎金員工團保 - 時薪230~250元 新北市土城區 工作經歷不拘 4天前展開
樂田環境~ 福利佳 個案多 同仁優 每月160 小時月薪五萬元以上 1. AA碼+轉帳費+加班費 2.油料費補貼 3.勞健保+勞退+團保意外險+長照機構責任險 4.免費訓練長照積分認證20小時/年 5.依員工績效考核，每年發給績效獎金 6.依營運狀況及員工服務狀況發放年終獎金 7.端午節及中秋節獎金 8.特休補償金發放 9.補助員工體檢 10.加班費依據勞基法規定給付 11.員工聚餐（春酒、尾牙、不定期聚餐）
年節獎金年終獎金三節獎金績效獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16570&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 3天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16571&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
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