1. Frontend IC substrate design including the SIP/SOP/RF/System package by using Cadence APD or PCBs Allegro
2. Manufacturing backend Validation with CAM350 features alignment and design discrepancy comparison.
3. Mechanical drawing for manufacturing process with AutoCAD.
4. Customers TV/DUT design integration and collaboration.
5. Impedance simulation and measurement for transmission line.
1. Electromagnetic simulation and electrical modeling by using Ansys EM suite.
2. SI/PI high frequency / high speed signal integrity / power integrity / antenna radiation with Ansys EM/ADS systems.
3. 3D full wave FEM/FDTD large-scale simulation and validation with EMpro and HFSS HPC.
4. Signal emulation and performance simulation in PCB/Substrat of optical module.