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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 54天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15379&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 54天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Opening roles for you: 1. Physical Designer 2. Standard Cell Engineer 3. Layout Engineer 4. System and Chip Design Solutions Development 5. FE design & DFT 6. SRAM Engineer 7. Design Flow/Methodology For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111
- 月薪35000~44000元 新竹市東區 工作經歷不拘 今天展開
實習地點：竹科、南科 實習職務：研發/製程/製程整合/智慧製造/資訊/數據分析等 實習期間：2025/7/7-2025/8/31 歡迎大四升碩一(預碩生)、碩班、博班在學學生投遞履歷
產假分紅入股員工生日禮金年終獎金三節獎金 - 月薪35000~44000元 東南亞新加坡 工作經歷不拘 今天展開
實習地點：新加坡 實習職務：研發/製程/製程整合 實習期間：2025/7/1-2025/8/28 歡迎大四升碩一、碩班、博班在學學生投遞履歷
產假分紅入股員工生日禮金年終獎金三節獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 54天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15376&source=1111&tags=domestic+campus+2025_1111 Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 月薪37000~55000元 台中市后里區 工作經歷不拘 4天前展開
1.依本身受訓技能，承接工作項目要求之執行，以符合作業標準。 2.現場6S(整理、整頓、清潔、清掃、教養、安全)之執行，以確保生產作業流程順暢。 3.反應與處理異常狀況，以確保生產作業供料順暢。 4.接受員工教育訓練，以符合作業需求。
三節獎金績效獎金員工及眷屬住院慰問金上下班交通車員工健身房 - 月薪30000~45000元 台中市后里區 工作經歷不拘 4天前展開
1.依本身受訓技能，承接工作項目要求之執行，以符合作業標準。 2.現場6S(整理、整頓、清潔、清掃、教養、安全)之執行，以確保生產作業流程順暢。 3.反應與處理異常狀況，以確保生產作業供料順暢。 4.接受員工教育訓練，以符合作業需求。
三節獎金績效獎金員工及眷屬住院慰問金上下班交通車員工健身房 - 1111南台灣職場小語
【推薦工作】行政內勤、行政助理｜無經驗可，享週休二日！
- 月薪32000元 台中市梧棲區 工作經歷不拘 3天前展開
1.依規劃實施排程及交期確認 2.交期異常反應.更新及確認 3.協助流程卡印製及發行 4.生產變更 5.上班時間08:30~17:30
員工生日禮金年終獎金員工團保員工餐廳國內旅遊 - 面議（經常性薪資達4萬元或以上） 桃園市新屋區 工作經歷不拘 2天前展開
1.員工申訴處理 2.勞動法令遵循 3.勞資關係維護 4.職場不法侵害 5.RBA系統管理 6.客戶稽核應對 7.供應商稽核執行 8.ESG永續發展 9.員工關懷專案辦理 10.雙向溝通會議辦理 11.其他主管交辦事項 ▶▶▶期間限定大放送◀◀◀ ✅ 新人獎金最高 NT$47,000 加入景碩，立刻獲得肯定! ✅新人績優留任獎金最高 NT$180,000 努力不會被忽視，表現越好，獎金越豐厚! ✅ 介紹獎金最高 NT$60,000 邀請好友一起共享雙倍獎金!
國內、外旅遊補助需穿著員工制服分紅入股員工生日禮金年終獎金 - 月薪30500~52500元 桃園市新屋區 工作經歷不拘 2天前展開
◆工作內容 1.急料進度跟追及運送WIP 2.確認現場生產排程及異常紀錄回報 3.Excel/Oracle/Cimes 簡單文書操作 4.呆滯WIP包裝 5.主管交辦事項 ◆月薪區間：另計”依營運需要常態性加班費”及”月紅利獎金”。 ◆ 無經驗可培訓 ◆ 到職即「正職」，非派遣職。 ◆ 工作時間：做四休二，2~3個月輪班，月休9-10天，每日工時10小時(正常工時8小時+2小時加班) 加班則依實際工作需求安排 【日班】08:30~20:35 【夜班】20:30~08:35 (依單位需求安排班別) –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ▶▶▶期間限定獎金◀◀◀ 1.新人獎金最高可領40,000元 2.回任獎金最高可領20,000元 註:發放金額及時間、相關規定，入職後請參閱公司內部公告，依入職後的公司實際內部公告內容為主 ☛☛☛☛面談時間☚☚☚☚ ❤【每週一、三、五】 14:00PM~16:00PM ~隨到隨面談~ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ◆ 另計”依營運需要常態性加班費”、”月紅利獎金”、”年終獎金”、”分紅” ◆ 景碩科技備有員工宿舍，員工汽機車停車場，歡迎各地求職者應徵(宿舍僅供外縣市同仁申請) ◆ 因應新冠肺炎疫情，懇請求職者到場面試能配戴口罩，做好防疫措施，謝謝您的配合！
國內、外旅遊補助需穿著員工制服分紅入股員工生日禮金年終獎金 - 面議（經常性薪資達4萬元或以上） 新北市泰山區 工作經歷不拘 2天前展開
1. 缺陷檢測程式設計與維護。 2. 檢測機台狀況掌控及產能控管。 3. 缺陷檢測異常分析與處理。 4. 建立缺陷檢測程式相關BKM。
員工餐廳按摩室員工電影國內旅遊產假 - 月薪50000~70000元 新北市泰山區 工作經歷不拘 2天前展開
1. Linux系統管理人員，協助design team處理系統環境業務。 2. 日常機房巡檢及系統組態管理。 3. 光罩驗證程式開發 (ICV / Calibre DRC) 4. TCL / Python cell 開發. (P-Cell / Py-Cell development)
員工餐廳按摩室員工電影國內旅遊產假 - 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 工作經歷不拘 6天前展開
負責產品: RF校正軟體與半導體檢測平台控制軟體 相關產品請參考網站 http://www.mpi-corporation.com/ast/ 本公司軟體團隊，主要工作內容會依據個人的屬性與技能分類為下: 加入團隊後在試用期間將依據個人特質與屬性進行工作分配 1.自動化流程開發與維護 2.自動化機器視覺開發與維護 3.自動化功能驗證測試 4.硬體整合設計開發 5.程式架構設計開發 6.Windows base UI 介面設計開發 7.RF校正軟體開發與維護 工作環境: 本部門為國際人員組成，軟體團隊技術開發與國外有合作，也因此英文聽說能力需要基本的水平，以因應產品開發時的溝通與討論。處此之外，主工作內容為系統整合，因此也需大量的與硬體設計人員進行溝通與討論。歡迎想要參與國際團隊與學習國際團隊工作模式的你加入團隊。 The Software team at AST MPI is looking for a talented Software Engineering. You will join a highly experienced, growing and international team development and delivery of semiconductor prober control software to our customers. You will also help the team evolve and expand by creating new feature and influencing specialization areas.
就業保險產假產檢假安胎假家庭照顧假 - 面議（經常性薪資達4萬元或以上） 新竹縣竹北市 工作經歷不拘 6天前展開
Product Responsibility: Development of RF calibration software and semiconductor testing platform control software. For related products, please refer to our website: http://www.mpi-corporation.com/ast/ Job Description: Our software team classifies work responsibilities based on individual attributes and skills. After joining the team, tasks will be assigned during the probationary period according to personal traits and expertise: Development and maintenance of automated processes Development and maintenance of machine vision for automation Functional verification and testing of automation features Design and development of hardware integration Architecture design and development Development of Windows-based UI interfaces RF calibration software development and maintenance Working Environment: This department consists of an international team collaborating with overseas partners in technical development. Therefore, basic proficiency in English listening and speaking is required for product development communication and discussion. Additionally, as the main responsibility involves system integration, extensive communication and discussion with hardware design engineers are necessary. We welcome individuals who aspire to participate in an international team and learn global work practices to join our team.
就業保險產假產檢假安胎假家庭照顧假 -
