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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 8天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19036&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) processes and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 8天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19035&source=1111&tags=Domestic+Campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 時薪210~250元 台北市信義區 工作經歷不拘 17天前展開
📣 亞米克，來自台北的溫暖品牌， 每天用一杯飲品、一道餐點，把「用心與美味」送到每位顧客手上。 我們相信：美食是溝通，服務是溫度。 現在，我們正在找你 有熱情、願意一起打拼的你！ ––- 📬【工作內容】 ・食材處理：洗菜、削皮、切料不陌生 ・料理製作：熟悉配方、協助出餐 ・飲品製作：現調手搖飲品 ・清潔維護：餐具與設備清潔整理 ・顧客服務：點餐、收銀、送餐 ・環境整潔：營造舒適氛圍 ・支援外送：讓美味準時送到家 ––- 🍳【我們喜歡這樣的你】 ✓做事不怕學、有條理、願意動手 ✓喜歡團隊合作、也能獨當一面 ✓充滿親和力、態度積極有禮 ✓對餐飲有熱情 ––- 💖【加入亞米克，你會擁有】 ✦餐飲培訓｜不是打工，而是學一技之長 ✦積極工作回饋｜表現佳就有調薪機會 ✦團隊氛圍溫暖｜不怕你問，只怕你不學
三節獎金意外險員工團保需穿著員工制服 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 8天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19034&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 8天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19033&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪50000元 宜蘭縣蘇澳鎮 工作經歷不拘 1天前展開
🎯職務名稱：「🎨營業主管🖌️月薪5萬起」 🎉 藤華精密機械股份有限公司誠摯邀請你的加入！ 成立自民國94年，我們以「品質為核心，推動創新未來」為使命，專注於機械模具進出口，與全球夥伴聯手升級工業製造效率！在這裡，你將站在技術與業務的核心，一起開創無限可能，挑戰自我，一步步邁向更高峰！🌟 💼 福利與發展機會： - 全勤獎金與年終獎金，讓你的努力大值回報！ - 員工結婚補助，團保貼心呵護您的未來！ - 健保、勞保、勞退提繳全數到位，全面保障你的職場生活！ - 十分尊重工作與生活的平衡，週休二日安排充足！ 💡 如果你也有熱忱、有夢想，並希望置身於專業同時滿懷溫暖的團隊中，這裡將是你的理想之地！快加入我們吧，一起締造技術與創新的美好未來！ ✈️ 準備好了嗎？那就今天開始你的新旅程，現在就行動！
需穿著員工制服全勤獎金年終獎金員工團保誤餐費 - 1111南台灣職場小語
【推薦給你】可週休二日(或固定休六日)、月薪３萬起工作機會！
- 時薪200~250元 台北市信義區 工作經歷不拘 17天前展開
📢 亞米克，來自台北的溫暖品牌， 每天用一杯飲品、一道餐點，把「用心與美味」送到每位顧客手上。 我們相信：美食是溝通，服務是溫度。 現在，我們正在找你 有熱情、願意一起打拼的你！ ––- 📬【工作內容】 ・食材處理：洗菜、削皮、切料不陌生 ・料理製作：熟悉配方、協助出餐 ・飲品製作：現調手搖飲品 ・清潔維護：餐具與設備清潔整理 ・顧客服務：點餐、收銀、送餐 ・環境整潔：營造舒適氛圍 ・支援外送：讓美味準時送到家 ––- 🍳【我們喜歡這樣的你】 ✓做事不怕學、有條理、願意動手 ✓喜歡團隊合作、也能獨當一面 ✓充滿親和力、態度積極有禮 ✓對餐飲有熱情 ––- 💖【加入亞米克，你會擁有】 ✦餐飲培訓｜不是打工，而是學一技之長 ✦積極工作回饋｜表現佳就有調薪機會 ✦團隊氛圍溫暖｜不怕你問，只怕你不學
三節獎金意外險員工團保需穿著員工制服 - 月薪45000~60000元 桃園市大園區 工作經歷不拘 6天前展開
1.電機、機械、水電設備維修保養 2.電機設備及機電儀表工具的操作知識 3.具備電路保護裝置、電動機的操作技能 4.了解配電管線及機務相關設備的操作原理 5.具有電器控制維修專長
年終獎金三節獎金績效獎金誤餐費員工聚餐 - 月薪39000~50000元 台北市信義區 工作經歷不拘 17天前展開
👨🍳 誠徵全職煎台人員 為每一份料理負責，為團隊一起努力 💪 💖 我們相信—— 一間店的靈魂，不只是食物，而是一起打拼的人。 亞米克正在找的不只是一雙會煎的手， 而是一個能扛責任、有溫度的夥伴。 ––- 📋【工作內容】 1.煎台出餐操作（煎、煮、整盤組合） 2.食材處理與準備（洗、切、備料） 3.餐點與飲品製作、餐具與環境清潔 4.支援點餐、結帳與基本顧客服務 這不只是一份「工作」，而是一份對品質與夥伴的承諾。 ––- 🕘【職缺資訊】 - 地點｜台北市信義區虎林街44之1號 - 時間｜06:30～15:30（日班） - 休假｜排休／輪休 - 福利｜工作獎金 ––- 🌿【這份工作，適合這樣的你】 ☑ 願意守時、願意承擔、做事不馬虎 ☑ 願意學習，有團隊精神 ☑ 對餐飲有熱情，做每一道料理都用心 ☑ 想要穩定、有制度 ––- 💥【加入亞米克，你會感受到】 ✔穩定、有制度的工作安排 ✔ 一起吃飯、一起扛責的團隊文化 ✔做得好，不會被看不到；努力，一定有人看見。 ––- 🍳「我們想找的，不只是來上班的人， 是願意一起撐起店裡每一天的家人。」 👉 如果你也在找一份值得投入的工作， 那我們，很願意等你來。
三節獎金意外險員工團保需穿著員工制服 - 時薪196元 台南市西港區 工作經歷不拘 今天展開
1. 負責熟悉並正確操作點餐系統，準確紀錄顧客點餐資料 2. 熟悉菜單內容，能為顧客提供菜品推薦與餐點介紹 3. 負責執行結帳作業，熟悉收銀程序及提供找零服務 4. 配合團隊工作，提供餐桌服務，包括備餐、出餐 5. 熟悉食品安全和餐飲衛生規範，維持工作區域與餐具清潔 6. 熟練完成多任務處理，例如接洽顧客需求與同步支援同事 歡迎加入我們的團隊，成為用心服務顧客的重要一員，期待您的加入！
就業保險產假產檢假安胎假家庭照顧假 - 月薪29500元 台中市沙鹿區 工作經歷不拘 4天前展開
1.接聽電話、電腦派單 2.基本電腦文書處理 3.對數字有概念者、數字邏輯性強 4.處理主管交辦事項 5.與師傅溝通協調事宜 6.如有特殊情況需能於同事配班
員工團保伙食津貼員工在職教育訓練勞保健保 - 月薪41000元 新北市蘆洲區 工作經歷不拘 2天前展開
1. 掌控社區安全，進行建築物及周邊環境的夜間定時安全巡邏，檢查門窗是否安全無虞。 2. 監控社區監視系統，密切注意出入人員及可疑活動，確保住戶安全。 3. 執行緊急處理任務，包括回應和處理警報、入侵行為、不良活動，以及防止火災與竊盜等事故。 4. 遵循相關安全及消防程序，並熟悉急救知識以做好突發情況的應變準備。 5. 操作社區門禁與監控設備，管理鑰匙並維護門禁系統正常運作。 6. 提供良好的客戶服務，協助住戶解決問題，並負責訪客的登記與引導。 7. 管理夜間安全事件紀錄，製作相關報告並提交給主管，嚴格遵守公司安全政策和程序。 歡迎對於維護社區安全充滿熱忱的您加入我們，與我們共同打造一個安心的居住環境！加入我們，立刻投遞履歷！
勞保健保職災保險 - 月薪40000~50000元 台北市信義區 工作經歷不拘 17天前展開
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