面議(經常性薪資達4萬元或以上) 新竹市東區 8年工作經驗 765天前更新
職責要求
1.Work with Contract Manufacturers to evaluate and validate manufacturing processes and possible failure modes
2.Technical issue resolution, establish lessons learnt practice and feedback to cross functional teams
3.Liaison between engineering and manufacturing for all aspects of hardware builds, include box builds, SMT assembly, die attachment, and wire bonding of microelectronics
4.Provide production support for manufacturing operations on a daily basis to remedy issues, enable on-time product deliveries, improve quality, and reduce cost, as well as analyze defect data and implement improvements to drive down defect rates
5.Maintain awareness of daily/weekly tasks/assignments to deliver products within the budgetary and schedule constraints. Work closely with the assembly, process technicians, material expediters/planners, production leads and operation program managers to ensure successful hardware fabrication
6.Participate in strategic supplier selection as needed for sustaining support
7.Support die attach and wire bonding, and other high precision assembly operations for wafer and module level packaging processes
8.Identifies and implements processes and product improvement opportunities at the suppliers to reduce manufacturing costs while improving the first past yield and product quality
任職資格
1.Bachelor’s degree in electrical, mechanical, or manufacturing engineering
2.8+ years of experience in manufacturing and hardware development of electronic products
3.Familiarity with manufacturing & SMT assembly process
4.Familiarity with Industry standards as they apply to circuit card and mechanical fabrication and assembly (IPC, JSTD, ASME, etc.)
5.Familiarity with properties and processes used in PWA assembly (Screen printing, SPI, pick and place, reflow oven, AOI, AXI, FPT, and ICT)
6.Understanding of lab analysis on PWB/A for DFX or failure
7.Familiarity with analytical tools and or failure analysis techniques (such as SEM, FTIR, Strain Gauge Analysis, EDX, SAM, and Optical Microscopy)
8.Experience with semiconductor/MEMS/GaN/GaAs process flows
9.Familiarity with Minitab, Mentor Graphics, Valor, Agile, and Oracle as plus
10.Familiarity with flex and rigid flex fabrication as plus
11.Ability to travel up to 50% domestic and international
12.Proficiency in English to be able to conduct technical and business discussions in the resource’s related field
13.Mandarin and English, Ability to influence through excellent written and verbal communications skills
展開 產假國內、外旅遊補助全勤獎金年節獎金員工團保