月薪32000~70000元 桃園市龜山區 工作經歷不拘 9天前
1. Package model behavior exploration for warpage and crack by using Ansys mechanical simulation.
2. amelioration by using Ansys optimization algorithm.
3. Thermal dissipation for CFD and coupling-dimensional domains simulation for Joule heat or electromigration / electrophoresis pathfinding.
4. PCB / Substrate / Package physical modeling and simulation optimization for reliability quality.
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