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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 69天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15383&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 機台是工廠穩定運作的基礎，我們在生產線上，負責高端精密、高單價半導體設備的維護、保養並判斷、解決機台發生的問題；如此可減少機台當機的時間與提升機台可運轉的時間，進而降低生產成本並提升公司的獲利能力。 1. Master Nano Diffusion, Thin Film, Lithography, Etching, or Metrology equipment. 2. Sustain and troubleshoot issues with high-tech equipment. 3. Improve and enhance the efficiency and productivity of equipment. 4. Plan and execute the analysis or defect detection projects. 5. Communicate with cross-functional engineers or vendors.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 69天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15382&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 69天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15381&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 69天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15380&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Job Role: 1. Highly motivated veteran and new talents to join force research and pathfinding in Advanced packaging and system integration technologies for both extending Moore‘s Law and in post-Moore era. 2. Long prospective career path in semiconductor technologies looking at more Moore‘s and beyond Moore‘s Law Eco-industry. Responsibilities: 1. Integration engineering for process integration and device/system level modeling, including electrical, thermal, and mechanical modeling. 2. Module engineering in advanced FEOL/MEOL/BEOL wafer process modules, and in advanced system packaging, including wafer level fan-out, interposers, and 3D chip stacking. 3. Silicon photonics expertise in the following areas: optical components design (lens, modulator, detector, waveguide w/ various materials), photonic circuits design (w/ focus on optical communication), and computer system architect (w/ focus on parallel processing and high-speed networking).
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 43天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15378&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 69天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15379&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) process and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 69天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Opening roles for you: 1. Physical Designer 2. Standard Cell Engineer 3. Layout Engineer 4. System and Chip Design Solutions Development 5. FE design & DFT 6. SRAM Engineer 7. Design Flow/Methodology For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=15377&source=1111&tags=domestic+campus+2025_1111
- 1111南台灣職場小語
【推薦給你】可週休二日(或固定休六日)、月薪３萬起工作機會！
- 月薪35000元 新竹市東區 工作經歷不拘 1天前展開
聘僱期間：約至2026年2月底 策劃與執行健康中心各項醫療救護衛生業務，以增進同仁健康。 執行健康中心各項行政業務 執行醫療救護衛生工作—1. 員工傷病評估.急救及照護 執行醫療救護衛生工作—2. 緊急應變救護及訓練 執行醫療救護衛生工作—3. 員工一般疾病護理 計劃與執行健康促進活動 健康管理—健康檢查.複檢.追蹤管理等 場內緊急救護及應變演練 依據職安法相關執行相關健康促進及安委會報告
產假分紅入股員工生日禮金年終獎金三節獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 69天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15376&source=1111&tags=domestic+campus+2025_1111 Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations.
- 月薪37000~55000元 台中市后里區 工作經歷不拘 4天前展開
1.依本身受訓技能，承接工作項目要求之執行，以符合作業標準。 2.現場6S(整理、整頓、清潔、清掃、教養、安全)之執行，以確保生產作業流程順暢。 3.反應與處理異常狀況，以確保生產作業供料順暢。 4.接受員工教育訓練，以符合作業需求。
三節獎金績效獎金員工及眷屬住院慰問金上下班交通車員工健身房 - 月薪30000~45000元 台中市后里區 工作經歷不拘 4天前展開
1.依本身受訓技能，承接工作項目要求之執行，以符合作業標準。 2.現場6S(整理、整頓、清潔、清掃、教養、安全)之執行，以確保生產作業流程順暢。 3.反應與處理異常狀況，以確保生產作業供料順暢。 4.接受員工教育訓練，以符合作業需求。
三節獎金績效獎金員工及眷屬住院慰問金上下班交通車員工健身房 - 月薪32000元 台中市梧棲區 工作經歷不拘 今天展開
1.依規劃實施排程及交期確認 2.交期異常反應.更新及確認 3.協助流程卡印製及發行 4.生產變更 5.上班時間08:30~17:30
員工生日禮金年終獎金員工團保員工餐廳國內旅遊 - 面議（經常性薪資達4萬元或以上） 桃園市新屋區 工作經歷不拘 2天前展開
1.員工申訴處理 2.勞動法令遵循 3.勞資關係維護 4.職場不法侵害 5.RBA系統管理 6.客戶稽核應對 7.供應商稽核執行 8.ESG永續發展 9.員工關懷專案辦理 10.雙向溝通會議辦理 11.其他主管交辦事項 ▶▶▶期間限定大放送◀◀◀ ✅ 新人獎金最高 NT$47,000 加入景碩，立刻獲得肯定! ✅新人績優留任獎金最高 NT$180,000 努力不會被忽視，表現越好，獎金越豐厚! ✅ 介紹獎金最高 NT$60,000 邀請好友一起共享雙倍獎金!
分紅入股員工生日禮金年終獎金禮品意外險 - 月薪30500~52500元 桃園市新屋區 工作經歷不拘 2天前展開
◆工作內容 1.急料進度跟追及運送WIP 2.確認現場生產排程及異常紀錄回報 3.Excel/Oracle/Cimes 簡單文書操作 4.呆滯WIP包裝 5.主管交辦事項 ◆月薪區間：另計”依營運需要常態性加班費”及”月紅利獎金”。 ◆ 無經驗可培訓 ◆ 到職即「正職」，非派遣職。 ◆ 工作時間：做四休二，2~3個月輪班，月休9-10天，每日工時10小時(正常工時8小時+2小時加班) 加班則依實際工作需求安排 【日班】08:30~20:35 【夜班】20:30~08:35 (依單位需求安排班別) –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ▶▶▶期間限定獎金◀◀◀ 1.新人獎金最高可領40,000元 2.回任獎金最高可領20,000元 註:發放金額及時間、相關規定，入職後請參閱公司內部公告，依入職後的公司實際內部公告內容為主 ☛☛☛☛面談時間☚☚☚☚ ❤【每週一、三、五】 14:00PM~16:00PM ~隨到隨面談~ –––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––––– ◆ 另計”依營運需要常態性加班費”、”月紅利獎金”、”年終獎金”、”分紅” ◆ 景碩科技備有員工宿舍，員工汽機車停車場，歡迎各地求職者應徵(宿舍僅供外縣市同仁申請) ◆ 因應新冠肺炎疫情，懇請求職者到場面試能配戴口罩，做好防疫措施，謝謝您的配合！
分紅入股員工生日禮金年終獎金禮品意外險 -
