面議（經常性薪資達4萬元或以上） 高雄市楠梓區 2年工作經驗 3天前更新
Job Description
- Assist in establishing and maintaining the Die Bond process
- Monitor daily production to ensure process stability, yield, and quality performance - Conduct root cause analysis (RCA) of process issues and implement corrective and preventive actions- Support new product introduction (NPI), including process setup, validation, and documentation
- Optimize process parameters to improve yield, efficiency, and reliability
- Collaborate with cross-functional teams (e.g., Production, Equipment, Quality, Innovation)
- Analyze data and prepare process reports
- Participate in continuous improvement projects (e.g., cost reduction, capacity increase)
**Education & Qualifications**
- Bachelor‘s or Master‘s degree in a related field, including: Materials Science, Chemical Engineering, Mechanical Engineering, Electrical / Electronic Engineering
- Basic knowledge of semiconductor packaging processes is preferred
- Strong analytical and problem-solving skills
- Good communication skills and a team-oriented mindset
- English proficiency: TOEIC score of 650 or above, or equivalent certification
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