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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪50000~65000元 台南市新市區 工作經歷不拘 1天前更新展開
1.定期維護、保養生產設備機台 2.生產機台故障排除及異常查修 3.設備問題改善及異常分析與追蹤處理 4.維持生產機台設備的正常運轉 ※ 無經驗可(完整在職訓練) 薪資條件： 工作20天(含5天加班天) 早班50,000~55,000元(含早班津貼及加班費) 夜班60,000~65,000元(含晚班津貼及加班費) *高雄南科廠正式生產前，將先於高雄楠梓廠訓練，之後再依照南科廠產能作調動。
國外旅遊員工聚餐慶生會尾牙自強活動 - 月薪31000元 台南市善化區 工作經歷不拘 1天前更新展開
1. 調製冷熱飲：熟悉飲料調製技術，能獨立進行冷熱飲創新調製，掌握比例及口味調整。 2. 備料準備及品質控制：負責每日飲品製作原料的準備，確保新鮮度及高品質監控。 3. 使用設備及吧台維護：熟悉吧台調製器具及飲品設備的使用，定期進行清潔和維護。 4. 顧客服務與體驗提供：分析客戶需求，提供個性化飲品推薦及專業建議，營造良好消費體驗。 5. 現金處理與收銀結帳：負責正確操作收銀機，處理現金支付及結帳作業。 6. 食品衛生規範及店舖清潔：確保食品安全，維護飲品區及公共區域的清潔與衛生符合標準。 7. 飲品研發及菜單更新：參與新飲品的創新研發，定期協助更新酒單或飲料菜單的內容。 歡迎熱愛冷熱飲與顧客服務的您加入我們，一同打造專屬的飲品體驗！立即投遞履歷，我們期待您的加入！
- 月薪32000~32000元 台北市中山區 工作經歷不拘 1天前更新展開
身為引領時尚潮流的藥妝產業一員 你比任何人都更追求美麗的第一手資訊 及健康趨勢的市場脈動 也要將這份熱情感染給你所服務的每一位顧客 讓他們也可以跟你一樣Look Good, Feel Great 同時也要讓顧客可以感受到專屬於他的完美購物體驗 因此你和其他的團隊成員們身負重任 要確保門市所有的營運流程及時與正確的完成 除了定期及例行工作之外 你還需要能主動思考並用更聰明簡捷的工作方式 才能讓我們可以超越顧客的期待 另外善用好奇心及主動學習 可以讓你有跳躍式的成長與進步 而迅速及有效行動力 將會讓你在屈臣氏能得到更多的成就
年終獎金春酒激勵獎金績效獎金員工團保 - 時薪196~196元 台北市中山區 工作經歷不拘 1天前更新展開
看到藥妝店必逛的你 划手機必追美妝部落客的你 想學習更多保健知識的你 只要你符合上面任一項 你就是我們要找的人 想提升自己的專業，小屈補助你考美容丙級 想免費出國旅遊，小屈每年提供12間門市開心去玩 想為環境盡一份心力，小屈每年舉辦志工活動還有志工假 加入小屈，你能得到更多 歡迎想挑戰不同職涯的你成為小屈人
年終獎金春酒激勵獎金績效獎金員工團保 - 月薪35000~40000元 新竹市東區 1年工作經驗 1天前更新展開
***【挑戰月薪$50,000起 (高獎金制度)】*** 1. 巡迴大樹藥局門市 2. 邀請客戶來各聽篩站進行聽力篩檢、衛教 3. 洽談並舉辦內外部公益聽篩活動 4. 其他主管交辦⾏政事務處理 【其他津貼】區域加給、交通津貼
禮品激勵獎金績效獎金員工團保三節獎金 - 時薪196~196元 台北市中山區 工作經歷不拘 1天前更新展開
看到藥妝店必逛的你 划手機必追美妝部落客的你 想學習更多保健知識的你 只要你符合上面任一項 你就是我們要找的人 想提升自己的專業，小屈補助你考美容丙級 想免費出國旅遊，小屈每年提供12間門市開心去玩 想為環境盡一份心力，小屈每年舉辦志工活動還有志工假 加入小屈，你能得到更多 歡迎想挑戰不同職涯的你成為小屈人
年終獎金春酒激勵獎金績效獎金員工團保 - 時薪197元 台南市善化區 工作經歷不拘 1天前更新展開
1. 擔任冷熱飲調製，負責依照標準作業程序準確製作飲料，包含冰品、熱飲及特調飲品。 2. 熟練掌握飲料配方及調製技巧，能快速製作符合客人需求的多樣化飲品。 3. 掌握基本設備操作如製冰機、奶泡機、攪拌機等，定期檢查與簡易維護設備運行情況。 4. 熟悉食品安全及衛生規範，確保工作區域及設備清潔達到食品安全標準。 5. 協助執行店鋪日常營運，如庫存管理、備料整理及原料補充等工作。 6. 處理基本收銀機操作，提供簡單快速的點單服務，並與顧客保持友善互動。 7. 定期維持店內整潔與秩序，進行清潔工作並確保顧客用餐環境舒適。 歡迎您加入我們的團隊，一起創造優質飲品及舒適的服務體驗！期待您的加入！
- 月薪32000~32000元 台北市士林區 工作經歷不拘 1天前更新展開
身為引領時尚潮流的藥妝產業一員 你比任何人都更追求美麗的第一手資訊 及健康趨勢的市場脈動 也要將這份熱情感染給你所服務的每一位顧客 讓他們也可以跟你一樣Look Good, Feel Great 同時也要讓顧客可以感受到專屬於他的完美購物體驗 因此你和其他的團隊成員們身負重任 要確保門市所有的營運流程及時與正確的完成 除了定期及例行工作之外 你還需要能主動思考並用更聰明簡捷的工作方式 才能讓我們可以超越顧客的期待 另外善用好奇心及主動學習 可以讓你有跳躍式的成長與進步 而迅速及有效行動力 將會讓你在屈臣氏能得到更多的成就
年終獎金春酒激勵獎金績效獎金員工團保 - 日薪2800~3200元 新北市新莊區 工作經歷不拘 今天剛更新展開
1. 專案領導及管理，可獨立作業，監督水電工程現場 2.按照藍圖進行高低壓配電線路施工、電路維修及電器設備安裝 3.配置水電消防配管配線、高低壓電氣設備安裝 4.一般建築物的供水與消防給水管路的簡單基本設計、施工與維護，含污水、排水系統
- 面議（經常性薪資達4萬元或以上） 新北市五股區 2年工作經驗 1天前更新展開
📢 徵才｜機械設備繪圖員 職務名稱： 機械設備繪圖員 工作內容 機械設備圖面繪製與修改 CAD圖面製作及校對 配合工程需求完成設計圖面 主管交辦事項 應徵條件 ✔ 具機械設備繪圖相關工作經驗 ✔ 熟悉 AutoCAD（CAD）繪圖軟體操作 ✔ 具相關繪圖或技術證照者佳 ✔ 工作細心、具責任感，能獨立作業 薪資待遇 面議（依工作經驗及能力敘薪） 工作地點 新北市五股區民義路2段35-3號 上班時間 早上8:00-下午5:00，中午休息一小時。 福利制度 勞健保、年終獎金、三節禮金、供餐。 歡迎具備相關經驗者加入我們的團隊！
全勤獎金年節獎金意外險員工團保員工宿舍 - 月薪30500~38000元 台北市士林區 工作經歷不拘 1天前更新展開
1. 遵照大樹聽力中心的專業與服務流程，為客戶進行聽力檢測及諮詢服務，並根據目標分配達成業績指標 2. 了解顧客的需求，以顧問式銷售方式進行助聽器的衛教和推廣，改善其聽覺品質 3. 定期關懷顧客助聽器的使用狀況，建立良好的客戶互動與溝通 4. 協助舉辦大樹聽力保健活動、衛教活動等等，推廣聽覺的重要性 5. 負責客群開發與客戶關係管理 6. 其他主管交辦事項
禮品激勵獎金績效獎金員工團保三節獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 1天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
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