月薪38000~75000元 桃園市龜山區 工作經歷不拘 1天前更新
1. Package model behavior exploration for warpage and crack by using Ansys mechanical simulation.
2. amelioration by using Ansys optimization algorithm.
3. Thermal dissipation for CFD and coupling-dimensional domains simulation for Joule heat or electromigration / electrophoresis pathfinding.
4. PCB / Substrate / Package physical modeling and simulation optimization for reliability quality.
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