月薪38000~75000元 桃園市龜山區 工作經歷不拘 3天前更新
1. Package model behavior exploration for warpage and crack by using Ansys mechanical simulation.
2. amelioration by using Ansys optimization algorithm.
3. Thermal dissipation for CFD and coupling-dimensional domains simulation for Joule heat or electromigration / electrophoresis pathfinding.
4. PCB / Substrate / Package physical modeling and simulation optimization for reliability quality.
展開 家庭照顧假年節獎金員工生日禮金年終獎金禮品