-
職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 桃園市楊梅區 工作經歷不拘 6天前展開
嗨~同學們 隨著學校畢業時間的來到， 專題、論文、未來工作接踵而來， 你/妳想要在畢業前就先取得工作機會，讓自己可以更早規劃未來嗎? 想在起跑點就先取得先機嗎? 不想錯失好工作、好機會 你/妳的心聲，我們聽到了~~~ 即日起，景碩將展開【預聘計畫】 讓你/妳可以領先同學們，提早做好規劃 凡2025年準備畢業的同學們， 皆可參加【預聘計畫】 只需投遞您的履歷， 就可以提早取得先機!!! 一、身分條件 2025年準應屆畢業生(尚未取得畢業證書可) 二、職缺工作內容 1.產品良率改善與品質問題整合及解決。 2.各量產產品良率改善與品質監控。 3.協助製程重大異常調查及長期性問題改善。 4.對外客戶會議。 ▶▶▶期間限定大放送◀◀◀ ✅ 新人獎金最高 NT$47,000 加入景碩，立刻獲得肯定! ✅新人績優留任獎金最高 NT$180,000 努力不會被忽視，表現越好，獎金越豐厚! ✅ 介紹獎金最高 NT$60,000 邀請好友一起共享雙倍獎金!
分紅入股員工生日禮金年終獎金禮品意外險 - 面議（經常性薪資達4萬元或以上） 新竹縣新豐鄉 工作經歷不拘 6天前展開
嗨~同學們 隨著學校畢業時間的來到， 專題、論文、未來工作接踵而來， 你/妳想要在畢業前就先取得工作機會，讓自己可以更早規劃未來嗎? 想在起跑點就先取得先機嗎? 不想錯失好工作、好機會 你/妳的心聲，我們聽到了~~~ 即日起，景碩將展開【預聘計畫】 讓你/妳可以領先同學們，提早做好規劃 凡2025年準備畢業的同學們， 皆可參加【預聘計畫】 只需投遞您的履歷， 就可以提早取得先機!!! 一、身分條件 2025年準應屆畢業生(尚未取得畢業證書可) 二、職缺工作內容： 1.生產產量品質及交期管理；規劃生產規格、物料、產線、機台及成本，確保最適人力與設備效率。 2.製程不良率及報廢之改善，評估最適化之產品生產流程，制定製造程序及標準。 3.作業人員之管理、訓練。 4.6S工作環境及安全維護。 5.生產製程中標準作業規範WI之制定及推行。 6.生產設備之保養及維護；保養SOP的制定與推行。 7.設備製程品質監控及改善。 ▶▶▶期間限定大放送◀◀◀ ✅ 新人獎金最高 NT$47,000 加入景碩，立刻獲得肯定! ✅新人績優留任獎金最高 NT$180,000 努力不會被忽視，表現越好，獎金越豐厚! ✅ 介紹獎金最高 NT$60,000 邀請好友一起共享雙倍獎金!
分紅入股員工生日禮金年終獎金禮品意外險 - 面議（經常性薪資達4萬元或以上） 桃園市新屋區 工作經歷不拘 6天前展開
1.業務開發 2.客戶服務與管理 3.歡迎具製造業/半導體業經驗，對業務領域有興趣者 ▶▶▶期間限定大放送◀◀◀ ✅ 新人獎金最高 NT$47,000 加入景碩，立刻獲得肯定! ✅新人績優留任獎金最高 NT$180,000 努力不會被忽視，表現越好，獎金越豐厚! ✅ 介紹獎金最高 NT$60,000 邀請好友一起共享雙倍獎金!
分紅入股員工生日禮金年終獎金禮品意外險 - 面議（經常性薪資達4萬元或以上） 桃園市楊梅區 工作經歷不拘 6天前展開
1.協助規劃產品流程所需技術及設備參數評估。 2.製程生產參數之測試及驗證。 3.製程能力及製程管制規格制定。 4.製程良率改善及提升。 【求職Q&A】 您的疑慮，景碩先來幫您回答 Q1:公司有提供宿舍或租屋津貼嗎? A1: (1)針對外縣市同仁或是居住地離公司25公里以上者，提供便利實惠套/雅房員工宿舍，每月僅需支付1200-1500元(依房型而定),讓外縣市員工免煩惱，一卡皮箱即可輕鬆入住! *目前宿舍安排於桃園新屋廠區周邊，距幼獅廠約20分鐘左右車程，請自備交通工具通勤。 (2)提供租屋津貼4000元。 Q2:公司附近交通便利嗎? A2:幼獅廠周邊具幼獅交流道；幼獅廠距楊梅市區約5分鐘車程，距埔心市區約10分鐘車程，可輕鬆抵達楊梅或埔心鬧區。 Q3:工作時間? A3:常日班8:30-17:30，彈性工時8小時(例如:上班9:30，下班18:30)，讓您可以避開上班尖峰時間，依個人所需自由安排上下班時間。 Q4:公司是否有供餐? A4:提供自助餐，不用煩惱午餐要吃甚麼！ Q5:面試前須準備什麼? A5:帶著一顆熱忱的心及優質的工作態度，讓景碩與您一同成長茁壯!! –––––––––––––––––––––––––––––––––––––––––– ▶▶▶期間限定大放送◀◀◀ ✅ 新人獎金最高 NT$47,000 加入景碩，立刻獲得肯定! ✅新人績優留任獎金最高 NT$180,000 努力不會被忽視，表現越好，獎金越豐厚! ✅ 介紹獎金最高 NT$60,000 邀請好友一起共享雙倍獎金!
分紅入股員工生日禮金年終獎金禮品意外險 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 5天前展開
執行元件開發各項工作，配合團隊完成所執行之任務 1.負責元件測試鍵佈局工作 2.建立元件電性量測條件，整理及分析電性資料 3.負責元件量測程式建立與維護 4.負責實驗室軟硬體設備建立與維護
產假分紅入股員工生日禮金年終獎金三節獎金 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 73天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15392&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. TSMC Corporate Planning Organization (CPO) plays a strategic role in TSMC‘s growth. We develop global planning and provide quick responsiveness to coordinate needs between factories and customers, driving for business effectiveness to bring world-changing innovation into reality. Responsibilities: Our key responsibilities include: 1. We ensure customers‘ demands are well satisfied in the rapid market, win customer trust, enhance operation efficiency, and reach profit maximization. 2. We drive for business effectiveness to bring world changing innovation into reality. 3. Our resources, production and demand planning, pricing, and system integration team develop flexible planning and provide quick responsiveness to coordinate needs between factories and customers. We seek individuals who meet the following criteria: 1. Possess experience in Business, Industrial Engineering, Computer Science, Information Systems, Information Science, or Semiconductor Industry. 2. Have skills in logic thinking and communication, learning agility, and business acumen. Opening roles for you: 1. Account PC Planner 2. Fab Production Control Planner 3. Fab Rationalization Engineer 4. Operation Resources Planning Engineer 5. Data Engineer 6. Data Scientist 7. Corporate Planning Associate For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=15392&source=1111&tags=domestic+campus+2025_1111
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 46天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15393&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Opening roles for you: 1. Buyer & Planner 2. Logistics Management (LWM & IEB) 3. Green Supply Chain (ESG) 4. Green Supply Chain (Auditor) 5. Green Supply Chain (Waste) For detailed job description, please refer to: https://careers.tsmc.com/careers/JobDetail?jobId=15393&source=1111&tags=domestic+campus+2025_1111
- 1111南台灣職場小語
徵【助理】無經驗可、週休二日/固定休六日
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 46天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15395&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Finance Specialist: The candidate will be positioned and rotate among different functions within Finance Division, including Financial Planning, Investment Management, Foreign Exchange Management, Funding and Cashier, Treasury Investment, Customer Credit, and SEC Compliance. 2. Accounting Specialist: (1) Provides financial information to management by researching and analyzing accounting data; preparing reports. (2) Rotate within Accounting: Reporting & Analysis Dept., Account service Dept.(Operations, R&D and SG&A), General Accounting Dept., Forecast and Planning Dept. 3. Risk Management Specialist (RM): What Risk Management Division covers in tsmc: (1) Responsible for the leadership, innovation, culture, governance, and management necessary to identify, evaluate, mitigate, and monitor the company‘s operational and strategic risks. (2) Develop and enhance Enterprise Risk Management tools, practices, and policies to analyze and report enterprise risks, in accordance to enterprise risk management framework. (3) Ensure the organization‘s risk management policies and strategies are in compliance with applicable regulations, rating agency standards, leading standards and strategic imperatives of the organization. (4) Cultivate the culture and raise risk competency through ongoing stakeholders‘ engagements and education/training programs. (5) Oversee or monitor the effectiveness of risk management system, through ongoing compliance checks and validation exercises. (6) Monitor and analyze risks within the company and reports the risk management status and improvement needed to the executives/management. (7) Support the Board its oversight role in assessing the robustness of risk management system. (8) Lead or provide key inputs into the company‘s enterprise risk or other committees that oversees the enterprise risk management process and ensures alignment with organizational objectives. (9) This position will also have responsibilities in Insurance and Risk Management and Business Continuity Management including emergency response.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 73天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15394&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. HR Business Partner (1) Responsible for the daily HR administrative request to support the employees and managers. (2) Implement HR annual activities with line managers. (3) Work as an HR contact window mainly for 1st line employee’s inquiries regarding HR policies, procedures, and benefits. (4) Support HRBP Manager on the assigned HR projects for HR solution implementation. 2. Talent Acquisition Specialist (1) Partner with line managers and internal resources to identify recruitment opportunities. (2) Process-oriented; use strategic approaches to allocate and engage passive candidates. (3) Provide data insights to identify opportunities to improve candidate experience. (4) Work on global recruiting projects and conduct process and system enhancement.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 73天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15391&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: You will be tasked with one or more of the following responsibilities: 1. Development and integration of Factory Automation Systems. 2. Development and integration of Advanced Technology. 3. Development and integration of Office Automation Systems. 4. Development and integration of Cloud Computing, Kubernetes or Big Data Analytics Systems. 5. Build/Development Scalable Platform for managing container applications.
- 月薪39400元 新竹縣寶山鄉 工作經歷不拘 73天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15389&source=1111&tags=domestic+campus+2025_1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 工作任務: 1. 你喜歡動手解決精密機械、設備問題嗎？ 2. 你想要突破半導體機台量產技術的極限，並持續挑戰未來科技的無限可能嗎？ 3. 〝模組副工程師〝就是最適合你的位置，你將運用最先進的操作系統及AI人工智慧界面來進行設備維修、保養，與公司一起成長，共同突破機台的生產極限，成為推動半導體領域解決問題的工程專業人才！ 工作內容: 1. 負責半導體產品線機台設備維修及保養 2. 管理及改善機台零件系統、包含廠商與下包商之零件備品管理 3. 設計機台保養制具及流程改善以增進機台穩定性 4. 需配合日、夜/假日班輪值(約每四週輪值一次大夜班，一次輪值六天) 5. 加入TSMC ,訓練成為模組副工程師後, 您將享有: A. 挑戰百萬年薪: (1) 高競爭力的薪資水準及獎酬機制 (2) 夜班獎金：每月輪值大夜班一次(六天)除夜班津貼外，另發放鼓勵獎金NT$8,000，每月輪值均能領取，等於每月加薪NT$8,000 (未滿六天按比率計算 ) (3) 分紅獎勵：每季依公司營運獲利分享業績獎金, 讓您1年、4季、12個月都能領取豐厚的薪資獎酬 B. 豐富寬廣的培訓發展，以及職涯升遷: (1) 專業訓練：全球最先進的中科訓練中心，十二吋廠儲備模組副工程師安排六周全職訓練課程 (2) 職涯升遷：垂直往上或水平轉換的職務機會，永不設限 C. 高規格的工作環境: (1) 美食饗宴：24小時提供多樣化異國美食 (2) 休假優給：給予優於勞基法之彈性休假及病假
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 73天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15388&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis with reliability modeling, manufacturing production quality management and reliability assessment, research, and development of new analysis methodology/technique. 3. Customers problem resolving for production quality / reliability issues.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 73天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15387&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device( logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 73天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=15386&source=1111&tags=domestic+campus+2025_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology.
-
