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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 13天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22579&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程，改善機台製程參數的設定，提升良率並讓機台每單位時間產出增加，也降低生產成本；半導體製程可大致分為四大模組，大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 高雄市前鎮區 8年工作經驗 53天前更新展開
職責要求 1.制定品牌策略與年度主題 : 規劃品牌長期發展方針、核心價值、年度品牌主題與集團品牌承接策略，支持高階經營決策。 2.維護品牌一致性與市場定位 : 確保客房、餐飲、會員俱樂部等各營運端之品牌視覺、定位、產品設計與對外形象一致，並具市場競爭力。 3.統籌公關傳播與媒體關係:規劃年度及階段性公關傳播計畫，維繫媒體、政府機關、KOL 關係，主導採訪、公關活動與宣傳企劃執行。 4.管理品牌預算、專案與跨部門協作 : 負責品牌推廣與公關預算編列、資源調配、成本效益控管，並建立跨部門品牌溝通 SOP，推動大型節慶、聯名與品牌專案。 5.負責輿情監控、危機處理與 ESG 品牌溝通 :建立即時輿情監控機制，處理負面評論與突發事件，統一對外溝通口徑；同時將 ESG 理念融入品牌核心，確保對外宣傳與企業實際作為一致。 任職資格 1.大學以上，具有品牌管理/公關或行銷策略規劃相關經驗 8 年以上，具有5年以上團隊管理經驗 2.具媒體公關與危機處理能力 3.具良好跨部門溝通能力
國內、外旅遊補助生育補助年終獎金員工團保三節獎金 - 月薪40000~45000元 桃園市桃園區 工作經歷不拘 7天前更新展開
【大樹藥局】儲備幹部計畫開跑 這是一個從第一線到決策核心的培育計畫 快速了解一間公司的運作 不只是執行，而是參與決策。 ––––––––- 培訓時間：一年 培訓事項： 第一階段｜門市營運基礎 熟悉第一線運作、了解門市營運及流程 第二階段｜後勤單位歷練 後勤單位基礎作業訓練 第三階段｜核心任務承接 實際參與單位運作，承接明確任務與績效指標 第四階段｜專案參與 跨部門專案執行，接觸策略與決策思維 資格條件： 1.科系：不拘 2.精通英文或日語 3.多益成績:700↑(須提供相關證明，例:成績單、證書) 特質： 1.具高抗壓性、積極、耐心、細心之特質 2.良好的溝通協調、邏輯、分析能力 3.工作積極有熱忱，有強烈的責任感，願意挑戰自我
國內旅遊國外旅遊員工聚餐尾牙禮品 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 13天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22578&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率，提供給客戶具有競爭力且高品質的晶片，讓電子產品不但先進且效能穩定；製程整合工程師為半導體製造中的重要協調者，需要與客戶溝通了解客製化的晶片應用需求，再將訊息帶回廠內，與各工程單位合作。良率精進工程師監控晶片的良率與缺陷，使用量測機台監測晶片的缺陷，找出可能的問題，再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪65000元 台南市 工作經歷不拘 4天前更新展開
1. 負責工程進度管理與監督，包括擬定工程計劃並確保施工計劃按時完成。 2. 熟悉建築法規與標準，確保施工過程完全遵循建築相關法規與安全規範進行。 3. 詳閱施工圖及工程圖紙，提供準確施工技術指導以及即時解決現場施工問題。 4. 執行品質管理，包含監督施工品質、進行品質檢查、測試並撰寫詳細品質報告。 5. 管控工地成本及資源分配，負責預算規劃與監控，避免過度支出與資源浪費。 6. 與承包商、設計師及相關單位進行有效溝通，協調並解決工程介面的問題。 7. 執行安全與法規管理，包含工地的風險評估、安全檢查，並確保職業安全教育的落實。 歡迎加入我們的建築工程團隊，共創高品質建築設計與施工成果，期待您的加入！
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 13天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22576&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel process/device/product developing for Specialty technologies. 2. Process Integration/Module, Device Analysis/Simulation, Modeling, Test-chip design tape out and WAT/Bench measurement system developing. 3. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪40000元 高雄市楠梓區 工作經歷不拘 6天前更新展開
我們是一家專注於先進半導體技術的公司，致力於為全球客戶提供高效能半導體製程解決方案。我們的服務主要涵蓋製程技術研究、設備管理以及跨領域技術合作，服務對象包括全球知名科技公司與製造業客戶。 須配合無塵室環境並接受派駐日本。 工作內容： 1. 負責開發和優化半導體製程技術，包括製造工藝設計與數據分析，確保新產品製程順利導入量產。 2. 熟練操作半導體製程設備，進行相關製程數據的分析及效能提升。 3. 執行設備日常維護及故障排除，撰寫設備技術報告，並進行技術升級和改善。 4. 分析製作晶片設計規格，參與IP演算法研究及數位模組設計。 5. 測試半導體元件與積體電路，對設備進行精確調試及檢測。 6. 負責無塵室設備的日常維護，並制定設備保養計畫以確保生產順暢與提升產品良率。 7. 與跨部門技術團隊進行協作與技術支持，協助處理製程相關問題。 8. 撰寫技術文件與申請專利，密切關注技術發展與市場趨勢。 我們歡迎對尖端半導體產業充滿熱忱的人才加入我們的行列！加入我們的團隊，您將有機會參與全球範圍的技術專案，見證和塑造科技的未來。立即投遞履歷，我們期待您的加入！
全勤獎金年節獎金年終獎金三節獎金意外險 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 13天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22575&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development. productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪50000~65000元 台南市新市區 工作經歷不拘 今天剛更新展開
【工作說明】 1. 負責生產設備日常維護、保養及穩定運轉 2. 處理設備故障、異常分析及問題排除 3. 進行設備效能改善，提升生產效率及稼動率專案 【應徵條件】 理工相關科系，無經驗可 【上班時間】 需配合四班二輪，約每2～3個月進行日夜班輪調 日班:07:30-19:35；夜班:19:30-7:35 【薪資條件】 以工作20天計算，早班50,000~55,000元、夜班60,000~65,000元(含輪班津貼及加班費) 【特殊備註】 正式生產前需至高雄廠培訓
家庭日員工結婚補助生育補助社團補助員工在職教育訓練 - 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 13天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=22574&source=1111&tags=AO+2027_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of over 17 million 12-inch equivalent wafers in 2025. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Description : Come and join an innovative and challenging team, where groundbreaking ideas shape the future of semiconductor technology. As an R&D Engineer, you will work on advanced technology development, such as exploratory research in advanced device architectures, device and process integration for manufacturability, advanced module process development, as well as the evaluation of novel materials, equipment, and processes. Responsibilities: 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration For Device Engineers: (1) Transistor Architecture & Design: Pioneering device design for advanced nodes. (2) Advanced Characterization: Defining the parameters of technological progress by characterizing state-of-the-art devices, establishing SPICE modeling targets, and conducting bench electrical measurements (I-V, C-V). (3) Simulation & Modeling: Utilizing TCAD (Technology Computer-Aided Design) and HSPICE to simulate device characteristics, optimize performance, and fortify model integrity. (4) Test Key Design: Crafting precision test key designs to facilitate accurate electrical modeling, design rule validation, and comprehensive device characterization. (5) Customer design enablement: Providing SPICE Model. For Integration Engineers (or Process Integration Engineers) : (1) Process Flow Integration: Integrating devices across various process modules (Lithography, Etch, Thin Films/Epi, Diffusion, CMP) to build a robust, manufacturable baseline for yield and device learning. (2) Experimentation & Lot Handling: Designing advanced Experiments (DOE) to meet device KPIs. Periodically serving as the on-duty engineer to coordinate and handle device lots in the R&D fab. (3) Yield & Reliability Learning: Conducting big data analysis (using JMP, Python, or custom iEDA tools) to identify process design weaknesses, hardware issues, or yield detractors. (4) Technology Transfer: Transitioning the proven, optimized advanced integration baseline process from the R&D phase to fab for high-volume manufacturing. 3. Module R&D Engineer (1) Pioneer Next-Generation Technologies: Research and develop advanced processes, novel materials, next-generation tooling, and cutting-edge computational/simulation methodologies for leading-edge semiconductor nodes. (2) Drive High-Impact Innovation: Deliver highly manufacturable, stable, and cost-effective process technologies. Optimize device physics and performance to meet stringent yield, reliability, and qualification standards. (3) Bridge Lab-to-Fab Scaling: Lead the technology transfer of advanced processes and hardware solutions from R&D phase to High-Volume Manufacturing (HVM) fabs, witnessing your research scale into global production. 4. R&D Process Center (1) PE: Develop advanced module process, optimizing stability and manufacturability to ensure high yield and reliability. Transfer processes and tools to volume manufacturing while collaborating with cross-functional teams and external suppliers to drive leading-edge module integration. Additionally, manage day-to-day operations, troubleshoot equipment, and mentor technicians to sustain operational excellence. (2) EE: Manage advanced semiconductor equipment (Diffusion, Thin Film, Lithography, or Etching) by performing warm-ups, troubleshooting, and efficiency enhancements. Plan and execute defect detection projects to analyze performance while collaborating closely with cross-functional engineers and vendors to ensure optimal equipment productivity and stability. (3) MFG: Oversee daily IC foundry operations, managing work schedules, direct labor, and cross-functional collaboration (PE/PIE/EQ) to ensure consistent service delivery. Drive productivity, manage multiple projects with overlapping deadlines, and analyze data to keep operations running smoothly. Additionally, contribute to process improvements and maintain robotic/detection systems to meet customer and business objectives.
- 月薪46000元 台中市后里區 工作經歷不拘 今天剛更新展開
1. 條線廠【RSB整備員】技術員 主要職務： ※ 精密軋延機組輥。 ※ 出入口整備。 ※ 輥環車削。 ※ 機台整修等。 2. 本公司有一貫培訓教育機制，操作與維護工作均有輪調機制。 –––––––––––––––––––– ▲ 操作維修技術性質，具CNC工具機相關經驗者佳。 ▲ 需配合［輪班排休］，常態性早、中、晚班輪。 ▲ 輪班津貼/加班費 另計。
社團補助需穿著員工制服員工在職教育訓練良好升遷制度員工（調職）搬家安家費 - 面議（經常性薪資達4萬元或以上） 台北市松山區 5年工作經驗 5天前更新展開
用創新思維與數據驅動，打造更智慧的線上商業成長 如果你對電商、數位零售與商業發展充滿熱情，並期待透過數據分析、跨部門合作及創新專案，持續提升線上業績與顧客體驗，這個角色將提供你參與全通路商業成長的重要機會。 在這個角色中，你將負責線上生意專案推動及新商業模式發展，透過與商品、行銷、供應鏈、IT及營運團隊合作，打造更流暢的消費體驗，並持續推動線上商業運營的成長。 1. 管理並優化日常線上業務運營，以推動銷售成長並提升客戶體驗。 2. 與跨部門共同規劃、協調並執行線上行銷活動及業務項目。 3. 支持各項新業務舉措，包括「賣家中心」（Seller Center）及其他策略性電商專案。 4. 與跨部門團隊合作，確保線上業務專案順利實施並持續優化業務流程。 5. 完成上級指派的其他職責與專案任務。
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※台南廠提供優質單身宿舍，讓您免去找房、搬家與通勤煩惱，安心展開職涯新生活。 歡迎外縣市優秀人才加入，一起在台南發展、成就未來！ 如果你認為 HR 不只是支援單位，而是推動企業成長的重要夥伴； 如果你喜歡深入第一線，了解現場需求，透過人才策略協助事業單位解決問題； 如果你享受獨立作業、勇於承擔，並樂於與團隊共同成長，那麼這個職務非常適合你。 這不只是一份招募工作，更是一個能從 Talent Acquisition 逐步發展成 HR Business Partner 的舞台，讓你的專業真正影響組織、影響人才、也影響公司的未來。 您將負責： ✔主導台南廠招募作業，並適時支援海外據點招募需求。獨立規劃並執行人才招募策略，協助事業單位找到關鍵人才。 ✔深入了解各部門運作與人力需求，成為主管最信賴的人才顧問。 ✔建立並經營多元招募管道（1111、LinkedIn、校園徵才等），提升雇主品牌及招募成效。 ✔ 執行完整招募流程，包含履歷篩選、面談安排、人才評估、Offer協調、報到安排及新人關懷，提升招募轉換率。 ✔ 定期提供招募分析報表，追蹤各項招募KPI，提出改善方案，持續提升招募效率。 ✔ 持續優化招募制度與流程，結合AI工具及自動化應用，提升招募品質、效率與候選人體驗。 ✔負責移工專案及擔任仲介窗口，確保移工管理作業順利執行。 歡迎具備以下特質的您主動應徵加入團隊！！ ✔ 具備敏銳的人才洞察力，能快速理解組織需求及人才特質。 ✔ 善於與主管建立合作關係，能從商業需求出發規劃招募策略。 ✔ 熟悉各類招募管道及人才搜尋技巧，具備主動獵才（Sourcing）能力。 ✔ 對數據敏感，能透過招募數據分析持續優化流程與提升成效。 ✔ 樂於學習AI工具與數位應用，持續改善招募流程及提升工作效率。 ✔ 具備良好的溝通協調能力、細心與執行力，能同時管理多項招募專案。
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