月薪41000~57000元 新北市泰山區 工作經歷不拘 11天前更新
R&D Pilot Line Fab
• Updating the Fab engineers on customer issues and technology needs.
• Supporting root cause defect and unique fail mode analysis.
Process Integration
• Delivering advanced technology to meet future product nodes.
• Developing recipes to meet structural & electrical requirements.
• Managing wafers though Dry Etch levels in support of special requirements.
Other Process Areas
• Working in cross-functional teams to jointly develop device structures.
• Supporting cross-functional failure analysis and yield improvement.
Dry Etch peers
• Maintaining or developing expertise in multiple process, hardware, or technology areas.
• Serving as a resource for peers in recipe & process development.
Qualifications:
• Understanding in: Transport phenomena, Electromagnetics, Atomic/Molecular physics, and Surface phenomena
• Solid trouble shooting, experimental design and data analysis skills
• Strong computer skills, including MS Office
• Basic understanding of plasma sources used in plasma etching
• Understanding in the principles of dry etch processing
• Rudimentary understanding of process control and Statistical Process Control (SPC)
Education/Experience:
MS/PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics
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