• 月薪45000~47400元 新竹縣寶山鄉 工作經歷不拘 7天前更新
    ✅ 底薪保障:試用期 33,300 元,只要表現穩定、通過考核,月薪立即調升至 45,000 元。 ✅ 績效獎金:45K 只是基本!只要出勤正常、技術熟練。配合度高,獎金另外算! ✅ 休假制度:作息平衡,固定週休二日。我們重視效率,不鼓勵無謂加班,讓你賺到錢也能兼顧家庭與生活品質。 ✅ 技術增值: 學習精密洗孔、核心鑽孔技術,成為科技廠不可或缺的專業施工人才 📝 工作內容: 1. 負責廠房、無塵室環境之精密洗孔施工。 2. 配合工程進度進行鑽孔,防火填塞與現場環境維護。 3. 需穿著無塵服(環境乾淨、恆溫,避開戶外曝曬)。 💪 我們在找這樣的你: • 出勤紀錄優良,具備責任感。 • 能適應無塵室穿著需求(有相關經驗薪資面議)。 • 無經驗可,我們會手把手帶你到上手。
    展開
    全勤獎金績效獎金生日假伙食津貼需穿著員工制服
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19038&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們在第一線負責晶片製造過程,改善機台製程參數的設定,提升良率並讓機台每單位時間產出增加,也降低生產成本;半導體製程可大致分為四大模組,大致流程順序為薄膜沈積、黃光微影製程、溼式與乾式蝕刻、熱製程與離子摻雜(擴散)。 1. To be responsible to drive leading edge process/device/advanced packaging development and optimization of CMOS/Flash/Specialty devices in order to meet scaling, performance, reliability, and manufacturability requirements. 2. Identify and solve IC process and device problems. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    展開
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19037&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 我們確保晶片的品質、持續提升良率,提供給客戶具有競爭力且高品質的晶片,讓電子產品不但先進且效能穩定;製程整合工程師為半導體製造中的重要協調者,需要與客戶溝通了解客製化的晶片應用需求,再將訊息帶回廠內,與各工程單位合作。良率精進工程師監控晶片的良率與缺陷,使用量測機台監測晶片的缺陷,找出可能的問題,再與製程解決問題。 1. A highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for logic, flash memory, and specialty products. 2. Working with a team which may include device, integration, yield, lithography, etch and thin films or external suppliers to drive leading-edge integrated module development, control and improvements. 3. Be responsible for sustaining ownership such as day-to-day operations, troubleshooting equipment and mentoring technicians. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    展開
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19036&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: As a member of the IIP (Integrated Interconnect & Packaging) team, you will initiate novel package concepts, own and drive advanced package development, new product package structure and configuration optimization. You will be responsible for 3DFabric technology research and development. Including InFO, CoWoS, Coupe and SoIC process/integration development for customer‘s variety applications. 1. Integration (1) Develop advanced 3DIC (InFO, CoWoS, Coupe and SoIC) processes and sustain baseline. (2) Package level reliability, failure mode analysis and improvement plan. (3) Customer technical interface, new tape out and lot handle. (4) Handover developed technologies to manufacturing groups for production. 2. Module Development (1) Be responsible for CVD/PVD/CMP/Lithography/Etch/Polymer/Bonding/Clean module development for 3DIC projects. (2) New technology, materials survey, and process improvement on 3DIC package structures. (3) Process development and tool transfer to mass-production development. 3. Simulation (1) Conduct risk assessment and provide mitigation plan for IC packages by simulation and experiment. (2) Practice FEM and DOE in problem solving and path finding particularly on packaging. (3) Continue improvement in simulation methodology, material modeling and script automation. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    展開
  • 面議(經常性薪資達4萬元或以上) 台中市大甲區 5年工作經驗 今天剛更新
    The Supply Chain Manager is responsible for the overall management and smooth operation of all Supply Chain activities (Sales, Purchase, Production Planning, Logistics). • Plan and execute strategic supply chain initiatives to drive cost efficiency, strengthen supplier relationships, and ensure the cost-effective, reliable and timely supply of goods • Collaborate closely with internal cross-functional teams and external suppliers to align supply chain strategies with business objectives • You function as the main point of contact with Supply Chain teams in the Netherlands • As part of the Management Team you report directly to the General Manager Responsibilities • Facilitate seamless order intake & confirmation, securing on time delivery of goods according to planned demand • Ensure continuous order alignment and stock development insights are in place, and actively shared with Supply Chain teams in the Netherlands • Function as bridge builder between Supply Chain teams in Taiwan and the Netherlands • Coordinate purchasing activities with production planning and warehouse departments to maintain inventory at planned levels • Maintain inventory control, with key focus on obsolete and end of life stock development • Actively maintain existing supplier relationships, assessing performance and reliability to secure supply chain continuity • Identify, evaluate and validate new suppliers to ensure supply base diversity, competitiveness and capacity resilience • Lead and supervise supplier selection process, ensuring selection criteria and cross-functional evaluations are in place, and recommendations are made based on cost, quality and reliability factors • Collaborate closely with Design, Engineering, Quality and Operations to make sure supplier capabilities align with technical and commercial requirements • Facilitate timely budgetary quotations from suppliers to assess new product’s technical & commercial feasibility • Conduct and supervise supplier negotiations on unit price, tooling investments and commercial T&C • Continuous cost analysis and benchmarking, monitoring and assessing product pricing impact, to enable swift insight on operational profitability • Support contract management activities, including contract drafting and negotiation • Ensure stable and continuous production, whilst best meeting planned demand from the Netherlands • Adjust production planning (MRP driven) according to Sales requests to meet changes in market demand • Strategize production requirements based on yearly look-ahead considering production efficiency • Improve ERP interfacing between Taiwan and the Netherlands • Ensure on time production start-up of new products according to planning • Active BOM management in collaboration with project teams to make sure product pricing meets budgetary constraints
    展開
    全勤獎金年節獎金年終獎金免費供餐健保
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19035&source=1111&tags=Domestic+Campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Novel devices developing for specialty technology. 2. Device Simulation, Test-chip design tape out and measurement system developing. 3. Process flow developing for production. 4. Collaborate with related teams for Design Collaterals (DRM/DRC/LVS/SPICE/PDK) developing. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    展開
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19034&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. Responsibilities: At the beginning of new module research, IC design engineers and R&D engineers would closely cooperate with customers. Once the new module technologies are developed, we could accomplish the goal of massive production and have customers’ new product launch in a short time. At TSMC, you will have the opportunity to work with the most advanced module technologies, provide solutions to partners in the global IC design ecosystem, and ensure competitiveness in power, performance, and area. 1. Physical Designer The principal responsibility of the candidate is to perform complete netlist to GDS physical design steps which include floor plan, PNR, timing closure, IR/EM analysis, layout verification, formal verification, and other tape out related tasks. The candidate will work in a talented team to design advanced chips using cutting-edge process nodes while meeting high standard design requirements. 2. Standard Cell Engineer (1) Pathfinding of library characterization for leading edge tech nodes. (2) Support industrial standard library kits generation and QC. (3) In-house library generation flow and/or utility development. (4) RC parasitic extraction analysis and APR related analysis. 3. Layout Engineer (1) IC layout for advanced technology (Std. cell/Memory/AMS/IO). (2) Layout structure development for new technology. (3) Pathfinding for new technology development. (4) Customer engagement and layout support. (5) Design and technology co-optimization (DTCO). (6) AI and automation for layout and physical design. 4. System and Chip Design Solutions Development Please refer to the Link: https://careers.tsmc.com/zh_TW/careers/JobDetail?jobId=516 5. FE design & DFT (1) Test chips development for advanced nodes, including physical design (APR), logic synthesis and DFT (Scan insertion + ATPG). (2) Design flow development for test chips design, which requires the programming skills, Tcl, Python, C-shell scripting etc. (3) Technology benchmarking for PPA evaluation of the advanced nodes. (4) DTCO (Design & Technology Co-Optimization) pathfinding and development. 6. SRAM Engineer (1) SRAM design in advanced nodes for mobile, high-performance computing, IoT, automotive applications. (2) RRAM/MRAM, emerging memory development. (3) In memory computing research and development. 7. Design Flow/Methodology (1) Advanced technology process design kits (PDK) and tech files (DRC, LVS, RC, etc.) development and technical support. (2) Advanced technology design development flow development and technical support. (3) Automation program development to support design kits and flow development productivity/quality. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    展開
  • 面議(經常性薪資達4萬元或以上) 屏東縣東港鎮 1年工作經驗 1天前更新
    1. 負責操作3D列印設備,進行建築/工程設計文件的模型製作與輸出加工 2. 對建築/工程設計文件進行審核和優化處理,確保符合列印及客戶要求 3. 熟悉大圖輸出設備操作,進行建築/工程大圖輸出及後期加工 4. 解決技術問題並改進生產流程,提升輸出效率與品質 5. 執行建築/工程模型及圖紙的安裝與展示,並確保呈現符合專業標準 6. 追蹤並學習新興3D列印技術與行業趨勢,引進創新技術應用於工作流程 7. 確保所有輸出及成品符合建築/工程專業標準及客戶需求
    展開
    全勤獎金年節獎金分紅入股年終獎金激勵獎金
  • 面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 1天前更新
    【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=19033&source=1111&tags=domestic+campus+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: R&D Engineers will be part of a grand joint-force working on advanced technologies, including but not limited to exploratory research in advanced device architecture, market-oriented design IP enablement, device and process integration for manufacturability, package-level interconnect solutions, and novel material/equipment/process evaluations. 1. Research & Pathfinding (1) New material and new process pathfinding to enable new device architecture with integration. (2) New tool pathfinding for new materials to enable the next nodes. (3) Design, execute and analyze experiments to meet R&D engineering specifications. (4) Process stability & manufacturability improvement for yield and reliability qualification. (5) Process/tool transfer to development R&D or volume manufacturing (Fab). (6) Highly motivated individuals with a strong technical background and teamwork skills. 2. Integration (1) Technology definition: design rules, design-technology co-optimization, logic/memory IP evaluations, etc. (2) Technology development infrastructure: productivity enhancement, product inspection methodology, mask-making, and test flow, etc. (3) New test vehicle establishment and validation: improvement of device yield and reliability (learning cycles). Improve yield and reduce defects by quantifying defect attributes using programming skills and developing effective detection methodologies. (4) Customer design enablement: SPICE Modeling and IP qualifications. 3. Module (1) Develop advanced processes, materials, tools, models, and computational methodologies for leading edge technologies. (2) Deliver manufacturable, stable, cost-effective technologies with device performance improvement for yield and reliability qualification. (3) Transfer process and tool to high volume manufacturing fab. 4. R&D Process Center (1) PE: Advanced module process development and baseline sustaining. (2) EE: Handle advanced equipment at R&D stage. Install, warm up, sustain and troubleshooting solve with new technology equipment. (3) MFG: Oversee the daily operations of IC foundry to ensure that all profiling operations, workflow, and customer reports are consistent with agreed upon service operations. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
    展開
  • 月薪45000元 新北市土城區 工作經歷不拘 今天剛更新
    1.具驗光師執照 2.負責內外專業訓練課程,包含課程排定、內容規劃、招募報名、成效報告等
    展開
    年終獎金三節獎金激勵獎金員工團保員工聚餐
  • 月薪45000~60000元 桃園市大園區 工作經歷不拘 8天前更新
    1.電機、機械、水電設備維修保養 2.電機設備及機電儀表工具的操作知識 3.具備電路保護裝置、電動機的操作技能 4.了解配電管線及機務相關設備的操作原理 5.具有電器控制維修專長
    展開
    年終獎金三節獎金績效獎金誤餐費員工聚餐
  • 月薪41000元 新北市蘆洲區 工作經歷不拘 4天前更新
    1. 掌控社區安全,進行建築物及周邊環境的夜間定時安全巡邏,檢查門窗是否安全無虞。 2. 監控社區監視系統,密切注意出入人員及可疑活動,確保住戶安全。 3. 執行緊急處理任務,包括回應和處理警報、入侵行為、不良活動,以及防止火災與竊盜等事故。 4. 遵循相關安全及消防程序,並熟悉急救知識以做好突發情況的應變準備。 5. 操作社區門禁與監控設備,管理鑰匙並維護門禁系統正常運作。 6. 提供良好的客戶服務,協助住戶解決問題,並負責訪客的登記與引導。 7. 管理夜間安全事件紀錄,製作相關報告並提交給主管,嚴格遵守公司安全政策和程序。 歡迎對於維護社區安全充滿熱忱的您加入我們,與我們共同打造一個安心的居住環境!加入我們,立刻投遞履歷!
    展開
    勞保健保職災保險
  • 月薪40000~50000元 台北市信義區 工作經歷不拘 18天前更新
    🌞 全職餐飲人員|誠徵一起扛、一起撐的夥伴! 台北市信義區|穩定排班|品牌成長中! 我們正在找一位「做得了事,也扛得起責」的夥伴 亞米克,是一間把員工當夥伴的餐飲品牌。 我們重視的是:你是不是願意認真做事、有責任心、和大家一起撐場面的人。 ––- 📬【工作內容】 ▸處理各式食材(洗、剝、削、切) ▸餐點製作、飲品調製 ▸餐具清潔與內場環境整理 ▸顧客服務、點餐、收銀 ▸基本環境清潔與外送支援 ⚡每個環節都重要,每個細節都代表我們的用心。 ––- 如果你: ✓不怕早起 ✓願意學、肯吃苦 ✓喜歡有溫度的餐飲工作 👉 那你很可能,就是我們要找的! ––- 🍳【我們需要這樣的你】 ✦對工作負責,不敷衍、不怕麻煩 ✦願意配合團隊、態度積極、好相處 ✦有餐飲經驗更好,沒經驗也能學 ✦能穩定出勤、有團隊精神與使命感 ––- 💼【職缺資訊】 • 時間|05:30–15:30 • 地點|台北市信義區虎林街44之1號 • 福利|工作獎金、制度清楚、團隊氛圍好 • 休假|排休/輪休制 ––- 💖 【加入亞米克的好處】 ☑ 工作穩定,制度明確 ☑ 不搞小圈圈,夥伴都互相幫忙 ☑ 做得好、學得快,一定看得見 ☑ 團隊像家,環境有溫度 💬「工作難免累,但責任讓人有價值。」 👉 如果你願意為一份工作用心、願意扛,那你就是我們要找的人!
    展開
    三節獎金意外險員工團保需穿著員工制服
  • 月薪41000元 新北市蘆洲區 工作經歷不拘 4天前更新
    **年後**上班 1. 負責執行蘆洲社區日班日常管理事項,包括監督公共設施運作與維護。 2. 定期檢點消防機電監視系統,確保設施安全性能正常運作。 3. 配合排班管理與人員調度,確保團隊運行順暢並落實工作流程規劃。 4. 處理客戶服務及來電諮詢,並協助溝通解決住戶需求與緊急情況。 5. 制定年度作業計畫及預算管理,並推動執行社區維運目標。 6. 執行保安設備檢查與安全計劃,並負責緊急應變流程的規劃與執行。 7. 負責書面報告與相關文書作業,確保相關文件準確與即時更新。 歡迎投遞履歷,加入我們的管理團隊,共同營造安全舒適的社區環境!
    展開
    勞保健保職災保險
  • 隨薪所欲