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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=475&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Organization Introduction: We are power grid design and sign-off team for digital design inside TSMC. The mission is to develop power grid design and co-optimize with semiconductor process in advanced technology nodes for most updated commercial design contents (CPU, GPU, SoC, etc.) Our power grid designs are references for worldwide 1st Tier design houses. Responsibilities: 1. Develop power grid structure for most updated commercial design contents (CPU, GPU, SoC, etc.) and check IR/EM (Electron-Migration) performance. 2. Provide design solutions for IR/EM and routing optimization. 3. Co-work with process R&D for process tuning to achieve better PDN (Power Delivery Network) design. 4. Support TSMC advanced process node test chip PDN sign-off checks, including PDN quality check, static/dynamic IR sign-off, and EM sign-off for successful chip tape-out. 5. Provide guidance and suggestion to PnR (Place and Route) designer on PDN issue fixing.
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=324&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced module process development and baseline sustaining 2. Process stability/manufacturability improvement for yield and reliability qualification 3. Process/tool transfer to volume manufacturing
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=328&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. Develop AI rule generator and QC pattern generator for complex design rule. 2. Automation for Design Rule Quality Check flow by python. 3. Automation for Design Rule Quality Check flow by excel VBA. 4. Advance technology and design co-optimization for manufacturing & PPAC.
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=302&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. RD Integration starts with the definitions, including transistor architecture and design building blocks, of a new technology node. Then, a manufacturable process flow is developed for evaluations and further improvements. The tasks may involve multidiscipline technical knowledge bases and project management skills. The job will require a lot of collaborations, so frequent communication should be expected. Test structure are designed in order to evaluate the manufacturing processes. Test vehicles will be built, and real chips will be validated through yield, performance, and reliability learning cycles. The goal is to deliver an optimized semiconductor technology that will meet the required chip performance, power, area-per-function, costs, and time-to-market (PPACt) for our customers. Responsibilities: 1. 10 Å CMOS platform technology development. 2. With focus on transistor characterization, design, targeting, and performance step-up. 3. Lot handling & on-duty (night shift and weekend) rotation.
- 面議（經常性薪資達4萬元或以上） 台南市善化區 1年工作經驗 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=392&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. In R&D, special technologies and mature processes are necessary for the continuous stable growth of TSMC. Specialty Technology builds on this firm foundation to develop new technologies, expand into new fields, and develop diverse product applications such as image sensing components, embedded technology, analog power and special technology, analog and sensing components, and special modules. Responsibilities: 1. R&D Process Engineer (Etch) (1) Be highly motivated and possess a strong technical background, demonstrating capabilities to develop and sustain etch process technologies for R&D specialty products. (2) Be responsible for sustaining ownership such as day-to-day operations, equipment troubleshooting and mentoring technicians. (3) Co-work with other module, integration, or external suppliers to drive leading-edge integrated module development, control and improvements. 2. R&D Process Engineer (1) Responsible for CVD/PVD/CMP/Grind/Trim/DIF/BOND development activities in R&D specialty module. (2) Deliver innovation and solution to conquer the problems in wafer stacking processes. (3) Maintain processes POR and SPC control. 3. R&D Integration Engineer (1) Responsible for lot handling and process flow setup. (2) Process flow optimization to improve WAT or yield performance. (3) Need support holiday on-duty.
- 月薪40000~40000元 彰化縣田中鎮 工作經歷不拘 2天前更新展開
1. 制定公司資金規劃及財務制度優化。 2. 月底結帳作業、財務報表編制與科目餘額表編制及各類調節表編製。 3. 每月生鮮存貨盤點、定期營業器具盤點。 4. 配合國稅局查核及會計師查帳所需資料提供。 5. 製作科目餘額表、各類調節表、銀行存款收支日報表、銀行往來授信明細表等。 6. 每曰房帳收入檢核及立冲帳傳票作業。 7. 完成例行付款開票及電子支付作業。 8.薪資及各類所得扣繳申報、二代健保申報作業。 9.營業稅申報作業。 10.其他主管交辦事項。
- 面議（經常性薪資達4萬元或以上） 台南市善化區 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=286&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Responsible for Mask process 2. Smooth product pilot run for next generation process 3. Continue improvement in tools reliability and stability. 4. Advanced technology transfer and Continuous Improvement Plan(CIP). 5. A highly motivated individuals with a strong technical background and capabilities to develop and sustain process technologies for flash memory and logic products. 6. Working with a team which may include device, integration, yield, lithography or external suppliers to drive leading-edge integrated module development, control, and improvements. 7. Be responsible for sustaining ownership, such as day-to-day operations, equipment troubleshooting, and mentoring technicians.
- 面議（經常性薪資達4萬元或以上） 台南市善化區 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址：https://careers.tsmc.com/careers/JobDetail?jobId=293&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Mask equipment maintenance and trouble shooting. 2. New mask equipment installation. 3. Efficiency and throughput improvement on mask equipment. 4. Continuous improvement on mask quality. 5. Cooperation with equipment vendors and cross-functional engineers.
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=306&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. GPU computation for mask defect detection. 2. Transformer/style transfer to simulate tool’s inspection images for inline defect check. 3. CNN for auto defect classification.
- 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 1天前更新展開
1.先進半導體蝕刻製程設備規畫建置。 2.下世代半導體蝕刻製程技術開發。 3.中心專案計畫所需之各類蝕刻材料製程(IBE/ALE/ICP etching)規劃與執行。 4.半導體元件整合與驗證。 5.主管交辦事項。
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=399&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1.Support Layout production and quality verification for advanced node 2.Advanced node path finding for best speed, power and area by using layout technique. 3.Methodology development for layout optimization, productivity and quality enhancement. 4.Machine Learning/AI exploratory for layout quality and productivity enhancement.
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 42天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=461&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: Building world-class cloud native infrastructure and ramping to high-volume production is key to enabling TSMC to scale worldwide. We are looking for a highly motivated engineer to join our global systems development team to support TSMC fabrication worldwide. The ideal candidate is highly technical with multi-discipline engineering skillset, that can push the limits of complex system design at large scale. Responsibility: 1. Develop state-of-the-art applications 2. Continue to refactor existing applications 3. Write and pass various kinds of tests (unit/feature/integration) to ensure software quality 4. Apply software design principles, such as 12-factor app, to ensure software quality 5. Ensure sustainability and performance of applications by working with SRE to define SLI/SLO and providing metrics for monitoring/alerting 6. Collaborate with peers in design, pair programming and code reviews 7. Willing to learn new IT technology
- 月薪45000~55000元 新竹縣竹北市 2年工作經驗 4天前更新展開
1.針對逾期帳款、呆帳催收透過電話及法務程序回收債權。 2. 逾期相關報表製作與彙整。 3. 進行跨區呆帳案件溝通協調並回報。 4.依據個人績效另計業績獎金。
員工購物優惠員工低利貸款國內、外旅遊補助員工在職教育訓練良好升遷制度 -
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