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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16575&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 加入台積電，成為產品工程師，你將有機會參與世界級先進製程技術，與頂尖團隊合作，挑戰技術極限！你將負責協助產品導入量產、提升良率，並確保產品符合客戶的最高標準。在這裡，你將學習到最先進的半導體技術，並為推動科技發展貢獻力量。我們的專業涵蓋非常廣，從成熟廠到先進廠、從邏輯產品到特殊應用甚至到封裝測試，能夠對產品有全面的了解與完整分析的能力。 1. Leading edge product development. Learn the most advanced technology in semiconductor manufacturing, identify effective process solution for yield and chip performance improvement. 2. Involving cross-team work for joint project development. Coordinate with customer/Fab/different support team closely to address improvement opportunities and work-out the solution. 3. Expanding wider vision with learning device engineering, manufacturing process, yield / WAT analysis, design rule, wafer CP test knowledge, by using comprehensive analysis skills to solve product issue. 4. Developing HV, embedded memory, RF, MEMS, and CIS products falls under the category of 〝More than Moore〝. In this role, you will collaborate with R&D and customers to develop new applications using mature Si process technology. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16576&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: TSMC‘s advanced packaging process is an efficient and high-density packaging technology that mainly targets the demand for high-performance semiconductor components, including microprocessors, graphics processors, artificial intelligence chips, etc. This technology uses advanced 3D stacking technology to vertically stack multiple chips and uses high-density packaging materials to fix them together. This technology can improve the performance of components, reduce power consumption, reduce package size, and increase system integration. TSMC‘s packaging process includes various technologies such as CoWoS, InFO. Among them, CoWoS is a technology that connects different chips through copper wires through silicon interconnect technology to achieve high-frequency and high-speed data transmission. InFO technology directly encapsulates chips on the substrate, connecting chips and substrates through tiny copper wires, achieving a more compact and efficient packaging solution. TSMC‘s advanced packaging process can improve chip performance and production efficiency, and meet the packaging technology requirements of modern high-performance electronic products, such as smartphones, artificial intelligence, high-performance computing, and other fields. TSMC‘s advanced packaging organization include Testing R&D Engineer conduct exploratory research in DFT test architecture, evaluate next-gen test technology of several device (logic SOC, HPC, AP, RF, etc.),which used 3D silicon stacking and advanced packaging technologies and closely teamwork with international customer from new product introduction to mass production. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 面議（經常性薪資達4萬元或以上） 新竹縣寶山鄉 工作經歷不拘 6天前展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=16577&source=1111&tags=AO+2026_1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. As of 2024, TSMC serves more than 500 customers and manufactures over 11,000 products for high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. It is the world’s largest provider of logic ICs, with an annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and the Company began construction on a specialty technology fab in Dresden, Germany, in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 品質與可靠性工程師：為守護客戶產品不受任何缺陷影響，建立優良的產品品質與可靠度，以協助客戶在市場上搶得先機、強化競爭力；QR致力於開發領先全球的電子、物理、材料與化學等科學分析專業及可靠度統計量測方法，應用於我們的產線，確保從晶片設計、製程開發、產品量產到封裝測試等階段的品質及可靠度問題皆有完整的解決方案，同時提供最先進的材料與故障分析等服務，成為公司各組織、客戶以及供應商最信任的合作夥伴。 1. Quality and Reliability roles. 2. Failure & TEM analysis, Reliability data analysis, manufacturing production quality management and reliability assessment, research, and development of new analysis protocol. 3. Customers problem resolving for production quality / reliability issues. Fostering a global inclusive workplace reflects TSMC’s core values and business philosophy and is essential for our future success. Our commitment to global inclusive workplace allows us to create an environment where every employee, regardless of gender, age, disability, religion, race, ethnicity, nationality, political affiliation, or sexual orientation, can bring their unique perspective and experiences to work, enabling us to drive profitability, increase productivity, and unleash innovation. We strive to create a workplace that is equitable and accessible to all employees. We are committed to fostering an inclusive culture where every employee feels valued and empowered to contribute to our mission and provide excellent service to our global customers.
- 月薪34000~37000元 新竹縣竹北市 工作經歷不拘 2天前展開
1.國/內外,VPC探針卡產品導入 2.客戶探針卡使用狀況回報 3.客戶端產品驗證及現場故障排除 【自我推薦獎金】 即日起，主動應徵本職缺，並到職滿三個月(試用過後成為正職員工)，可得獎金6,000元。 獎勵期間自即日起至2025/12/31，視招募情況可提前結束。
就業保險產假產檢假安胎假家庭照顧假 - 月薪38000~45000元 新竹縣湖口鄉 工作經歷不拘 4天前展開
工作內容: (1) 乾式真空泵浦之新機製造、維修保養。 (2) 產品工程中檢驗、完成品檢驗相關作業。 (3) 半導體設備相關部品、零件清洗保養。 條件: 1.無經驗可，有專人培訓。 2.可配合上中班(津貼360元/天)、加班(加班費計算優於勞基法,外加誤餐費100元)。
就業保險安胎假產假產檢假家庭照顧假 - 面議（經常性薪資達4萬元或以上） 新竹縣湖口鄉 工作經歷不拘 2天前展開
1.設備日常點檢、維修及保養 (包含:拋光機, 清洗機, 旋乾機…) 2.提升設備產能及穩定性 3.製程藥液更換及parts更換 4.SOP制定與更新：包含操作、維修及保養等 5.異常處理與分析，良率改善及製程改善 6.稽核應對與相關文件準備 7.生產管理 8.主管交辦事項
員工停車位或停車補助員工餐廳國內旅遊員工聚餐慶生會 - 1111南台灣職場小語
【推薦給你】可週休二日(或固定休六日)、月薪３萬起工作機會！
- 月薪34000~80000元 桃園市中壢區 工作經歷不拘 2天前展開
1.改善計畫提出與執行(生產力提升) 2.機台調度、空間與設施規劃 (Layout) 3.產能規劃、統籌、分析 4.生產標準訂定 5.品質提升專案 6.成本分析 7.專案執行
產假分紅入股員工生日禮金意外險員工團保 - 月薪41000~57000元 新北市泰山區 工作經歷不拘 5天前展開
1. 低功率行動型記憶體開發 2. 新測試覆蓋率程式開發 3. 新產品電性及物性除錯分析 『具工作經驗者，薪資另議』
員工餐廳按摩室員工電影國內旅遊產假 - 月薪35000~70000元 新竹縣湖口鄉 工作經歷不拘 2天前展開
【工作內容】 1.新製程/新材料/新機台評估及量產 2.品質良率改善 3.製程流程簡化/產能提升/材料人力減少等cost down專案 4.特殊工程品handle 5.相關生產的製程系統改善 6.FEMEA管理與維護 7.製程相關機台及生產參數維護與改善 8.主管交辦事項 【工作班制】 作四休二 或 作三休三 、輪班（07:20-19:20／19:20-07:20） 【工作地點】新竹湖口工業園區 ※依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資 ※輪班津貼/班制津貼另計
- 面議（經常性薪資達4萬元或以上） 高雄市前鎮區 工作經歷不拘 2天前展開
1. 客戶稽核前準備、稽核應對以及稽核後改善追蹤 2. 品質系統、靜電防護管理系統推動(包含內外部稽核) 3. 有害物質管理作業(供應商、廠內以及客戶) 4. 專案推行 5. 主管交辦事項
- 月薪35000~48000元 桃園市新屋區 工作經歷不拘 10天前展開
1. 與製造部門串聯溝通生產效率。 2. 規劃生產短期(2週)目標及進度。 3. 專案管理，提升生產效率。 4. 主管交辦事項。 ▶▶▶期間限定大放送◀◀◀ ✅ 新人獎金最高 NT$47,000 加入景碩，立刻獲得肯定! ✅新人績優留任獎金最高 NT$180,000 努力不會被忽視，表現越好，獎金越豐厚! ✅ 介紹獎金最高 NT$60,000 邀請好友一起共享雙倍獎金!
分紅入股員工生日禮金年終獎金禮品意外險 - 面議（經常性薪資達4萬元或以上） 新竹市東區 工作經歷不拘 3天前展開
工作項目： 投入224G TIA類比電路開發 應徵條件： 1. 碩士以上，電機工程、電信工程、電控工程、電子工程相關科系畢業者 2. 具相關工作經驗者尤佳
就業保險產假產檢假安胎假家庭照顧假 -
