面議(經常性薪資達4萬元或以上) 台北市內湖區 5年工作經驗 今天剛更新
1. 負責智慧型裝置產品之主動式(Active Cooling)與被動式(Passive Cooling)散熱方案設計與優化。
2. 參與 RFP/RFQ 階段的 Thermal Solution 規劃,包含可行性評估、效能分析及成本估算。
3. 使用 FloTHERM / Ansys Icepak 建立熱模型,執行熱模擬分析與設計優化。
4. 規劃並執行產品熱測試與驗證,分析 Thermal Performance、進行 Root Cause Analysis,並推動問題改善。
5. 建立及維護 Thermal 相關技術文件,包括 PTS、Thermal Test Plan、Thermal Design Guide 等。
6. 與跨功能研發團隊合作,並研究與評估新型散熱技術、材料及 Thermal Solution,推動未來產品應用
== English ==
1. Responsible for the design and optimization of active and passive cooling solutions for smart device products.
2. Participate in RFP/RFQ-stage thermal solution planning, including feasibility assessment, performance evaluation, and cost estimation.
3. Build thermal models and perform thermal simulation, analysis, and design optimization using FloTHERM / Ansys Icepak.
4. Plan and execute thermal testing and validation, analyze thermal performance, conduct Root Cause Analysis, and drive issue resolution and improvement.
5. Develop and maintain thermal-related technical documentation, including PTS, Thermal Test Plans, and Thermal Design Guides.
6. Collaborate with cross-functional engineering teams to research and evaluate new thermal technologies, materials, and thermal solutions for future product applications.
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