面議(經常性薪資達4萬元或以上) 新竹市東區 5年工作經驗 今天剛更新
*For Logic/RF IC application Technical Manager
1.Follow up department directions to complete assigned tasks
2.Accountability in Logic/RF/MS technologies production marketing
3.Logic/RF IC application study and exploration, W2PH2WG2M direction plan and execution
4.Capable to communicate with internal teams, including TD, sales, IPDS, FAE, CE and COP etc.
5.Capable to do customer facing activities, including promotion, market sensing, channel establishment etc.
6.Analyze product segments to define market SAM, foundry technical trends, UMC opportunity, competition, solutions and business proposals
*For advanced package technology Technical Manager
1.Follow up department directions to complete assigned tasks
Accountability in promote and present advanced package technologies(2.5D/3DIC...ect.)
2.Capable to communicate with TD
3.Enrich advanced package technology & MFG promotion materials
4.Provide technology presentation
5.Analyze product segments to define UMC opportunity, solutions and proposals
6.Provide product market trend, supply chain/ BOM, technology spec., IP
requirements and product competition in the market
7.Support advanced package technology benchmark and foundry competition
8.Evaluate capacity demand and forecast
9.Predict market trend up and down
10.Support to build capacity simulation model with internal
11.Cooperate with Sales teams/ CP/ P&L/ CE/ FAE to increase market share, product margin and profit in UMC business
展開 產假分紅入股員工生日禮金年終獎金三節獎金