- 月薪33280元 高雄市楠梓區 工作經歷不拘 4天前更新展開
中班上班時間: 15:00 -23:30, 固定班別, 排班制(非固定休六日) 工作內容: • 三班制（排休），操作倉儲及進出貨系統，確保資料正確性與即時性 • 管理貨物進出，執行定期盤點及儲位規劃調整 • 使用 NXP 倉庫管理系統完成進貨、銷售及存放管理作業 • 與各單位協調，完成跨部門作業 • 操作 SAP 系統相關功能 • 執行主管交辦事項 • 需搬運貨箱（重量低於 20 公斤） • 需使用推車搬運貨物（重量約 200 公斤），將產品由產線推回倉庫 應徵條件: • 可接受操作英文介面系統 • 英文能力：聽、說、讀、寫略懂 • 高中職以上學歷，科系不限
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 台北市南港區 工作經歷不拘 4天前更新展開
***Please upload English resume onto our official platform: https://reurl.cc/1bbx6m Job Descriptions - The selected candidate will participate in Wi-Fi/BT software/firmware design , implementation, integration, validation and maintenance phases for standard based and non-standard based Wi-Fi/BT/BLE products for IOT and automotive markets. - Lead/participate in complex feature integrations/enhancements, Wi-Fi/BT/BLE SoC bring up, and technical issue solving. - Research, design and develop cutting edge technologies for industrial features and IEEE/WFA/BT/BLE spec. Ranging from Wi-Fi enterprise access point, embedded clients and other wireless technologies. - Participate the full life cycle of IC – spec designing, pre-silicon validation, chip bring-up, software development, customer engaging and supporting. Support customers remotely or onsite as needed. Qualifications - MS in EE, CE, or CS. - Proficient in C programming language. - Experience on Linux / Android programming is a plus - Knowledge on real-time OS (FreeRTOS / ThreadX) programming is a plus - Knowledge of ARM assembly is a plus - Team player and excellent interpersonal, communication and writing skills - Independent, self-motivated and willing to learn
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 高雄市楠梓區 工作經歷不拘 4天前更新展開
- Data analysis to ensure handler work on baseline. Ex. MCBA, index time, temperature control and HW interface maintenance 資料分析確保機台運作在基準條件, 包含作動不順, 作動時間, 溫度控制, 及機台介面維護 - SOP, OCAP, PM document creation. 建立標準化流程,異常處理文件,及保養維護文件 - Responsible for the performance of handler. 負責機台性能及相關報告 - Handle the improvement project on handler. 持續進行機台的改善計畫 - Management recipes of handler and spare parts 機台參數管理及備品管理 - Provide technology and operation training to shift assistant engineer and operators in manufacture lines to support production smoothly. 訓練助理工程師與作業員以利生產線順利運作 - Co-work with worldwide handler team for evaluation/improvement 與其他機台團隊跨國合作, 導入評估, 問題改善
分紅入股年終獎金三節獎金激勵獎金員工團保 - 月薪31900~35900元 高雄市楠梓區 工作經歷不拘 4天前更新展開
工作內容： • 與倉庫、報關行、快遞及貨運業者溝通，處理出口及提貨相關作業 • 執行每日成品與半成品出貨作業（含 SAP 系統操作、出口報單種類、統計方式、開立提單） • 接收內部出貨指令，協調倉庫進行包裝作業 • 與各單位協調，完成跨部門作業 • 與報關行及貨運代理（Forwarder）聯繫並進行工作協調 • 追蹤貨件遞送進度及異常狀況 • 執行主管交辦事項 • 每兩個月調整班表，輪值月份需於每週六上班，並於平日排休 應徵條件: • 大學畢業，國際貿易、運籌管理、企業管理相關科系尤佳 • 英文能力：聽略懂、說略懂、讀中等、寫中等 • 具 1 年以上相關工作經驗者佳 • 具英檢證書或 TOEIC 550 分以上者佳 • 熟悉 Microsoft Word（如函數及樞紐分析）及 Excel 等辦公軟體者優先
分紅入股年終獎金三節獎金激勵獎金員工團保 - 月薪29500元 高雄市楠梓區 工作經歷不拘 4天前更新展開
早班上班時間: 07:30-16:00, 固定班別, 排班制(非固定休六日) 工作內容: • 負責倉庫收貨、出貨及庫存管理 • 管理貨物進出，執行定期盤點及儲位規劃調整 • 三班制（排休），工作期間需全程穿著無塵服 • 操作 SAP 系統（GR、GI、Shipping、庫存管理等） • 分片機器操作 • 冷凍庫作業（攝氏 5 度冷房） • 拆箱作業 • 執行主管交辦事項 • 需搬運貨箱（重量低於 20 公斤） • 需使用推車搬運貨物（重量約 200 公斤），將產品由產線推回倉庫 應徵條件: • 可接受操作英文介面系統 • 英文能力：聽、說、讀、寫略懂 • 高中職以上學歷，科系不限
分紅入股年終獎金三節獎金激勵獎金員工團保 - 月薪45000~57000元 新北市泰山區 3年工作經驗 5天前更新展開
1. 協助新產品之研究、開發與測試驗證。 2. 執行產品性能分析、問題排除及改善方案評估。 3. 跨部門協調與專案執行。 4. 配合公司培訓計畫，逐步提升產品研發與管理能力。 培訓與發展 1. 完整的教育訓練與導師制度。 2. 產品研發專業技能培養。 3. 專案執行與跨部門溝通能力養成。 4. 未來可晉升為產品開發計劃經理、產品開發專案經理、研發主任工程師或技術管理職位。
員工電影國內旅遊員工聚餐尾牙家庭日 - 面議（經常性薪資達4萬元或以上） 新竹市東區 5年工作經驗 5天前更新展開
熟悉 layout tool : Virtuoso/CustomCompiler verification : Hercules/calibre/ICV 『具工作經驗者，薪資另議』
員工電影國內旅遊員工聚餐尾牙家庭日 - 面議（經常性薪資達4萬元或以上） 台北市南港區 工作經歷不拘 4天前更新展開
Please also apply unto our platform: https://nxp.wd3.myworkdayjobs.com/careers/job/Taipei/Supply-Chain-Planner_R-10062641 Job Description Supply Chain Modeling -Manage the integral supply chain to match demand and supply, using the master planning system -Drive to set Supply Chain Parameters (e.g. Supply Chain Model, Lead times, Safety Stocks) in planning system according to product life cycle. S&OP Support -Cowork together with BU/BL Capacity planners on S&OP process -Review resource loading situation impacting S&OP. Order Management -SO Management: Be responsible for fulfillment of customer sales orders, customer programs forecast and safety stock replenishment -PO Management: Plan and release feasible plans to manufacturing sites fulfilling demand and loading policy. Monitor and control supply deviation -Based on demand and supply situation, communicate with BU/BL to align business strategy -Returns Management: Support and arrange returns (quality, technical, logistics and commercial returns) according to relevant procedures. -Exceptional Management: a) In case of allocation, follow allocation process and decision b) In case of tight supply, co- work with BU/BL and Customer Service and Site for production priority to prevent customer line down c) Support New Product Introduction Improvements / PDCA -Regular review KPI and initiate improvement activities in case KPIs are below targets -Participate in projects Education Degree in business administration, industrial engineering or information management (preferable) Personal Requirements - Integral working and thinking style - Analytical thinking - Independence / problem solving - Team player with good cooperation and information conduct
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹市東區 10年工作經驗 4天前更新展開
The key areas of responsibility of the jobholder are: - Collaborate closely with foundries, NXP technology teams, and business lines to qualify and release advanced FinFET processes. - Provide technical leadership in semiconductor device physics, especially in FinFET architecture and behavior. - Interface with internal and external stakeholders on critical development and transfer projects. - Lead and steer projects to meet timelines and business objectives. - Make key decisions on process integration, balancing technical, logistical, and strategic factors. - Support NTI process transfers within foundries and NXP joint ventures Requirements / preferences: - Bachelor‘s or Master‘s degree in Electrical Engineering, Physics, or related field. - Minimum 10 years of experience in semiconductor device engineering, with a strong focus on advanced logic/RF devices. - Proven hands-on experience with HKMG and FinFET technologies in production or development environments. - Deep understanding of semiconductor device physics, especially HKMG and FinFET. - Strong analytical skills in yield enhancement and electrical data analysis. - Fluent in English and Mandarin. - Demonstrated leadership in development, transfer, or ramp-up projects. - Excellent communication and influencing skills. - Proactive, pragmatic, and results-driven mindset. - Experience working with foundries and leveraging external manufacturing capabilities .
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹市東區 10年工作經驗 4天前更新展開
***Please apply for this position on NXP official website: https://pse.is/8ms2kr Role Purpose Lead the development and optimization of high-voltage (HV) and BCD device architectures. This role requires a deep understanding of device physics and a data-driven approach to ensure industry-leading performance and reliability for power management solutions. Key Responsibilities － Device Development: Lead the architecture design and optimization of HV devices (LDMOS, EDMOS, ESD) on 180nm to 55nm BCD nodes. － Physics Analysis: Analyze and optimize Device Physics parameters, including BV, Rdson, SOA, and reliability (HCI/NBTI). － Simulation & Modeling: Utilize TCAD for 2D/3D process and device simulations to accelerate development cycles. － Device Verification: Define verification plans and execute statistical analysis using JMP for DOE and WAT data. － Design Integration: Work within Cadence environments for layout review and test structure design. － Cross-functional Collaboration: Partner with PI and PE teams to resolve yield, reliability, and manufacturing bottlenecks. Required Qualifications － Experience: Master‘s or Ph.D. in EE, Physics, or related field with 10+ years of semiconductor industry experience. － Technical Expertise: 1. Profound knowledge of Device Architecture and Device Physics. 2. Hands-on experience in 180nm to 55nm BCD process nodes. － Tools: 1. Expertise in TCAD (Sentaurus / Silvaco). 2. Expertise in JMP for statistical data analysis. 3. Proficiency in Cadence (Layout/Virtuoso). Preferred Qualifications (Plus) － Advanced Power Devices: Experience with GaN, SiC, or IGBT development. － Silicon Photonics: Knowledge of Photonics integration and device physics. － Domain Knowledge: 1. Process Integration (PI): Understanding of mask flow and doping profiles. 2. Product Engineering (PE): Experience in CP/FT data correlation and yield enhancement. Competencies － Accountability: Strong ownership of project milestones and outcomes. － Critical Thinking: Ability to identify root causes in complex device failures. － Interpersonal Skills: Effective communication across design and foundry teams. － Data-driven: Committed to objective decision-making through rigorous data analysis.
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 新竹市東區 10年工作經驗 4天前更新展開
Role Summary: The NVM Reliability team is responsible for characterizing, modeling, and enabling next-generation Non-Volatile Memory technologies, enabling new product creation company-wide. Job Responsibility: －Interface with foundries and other external suppliers of technology and IP to assess reliability margin to product applications. －Establish qualification requirements for new technology and product introduction. －Perform rigorous statistical analysis of reliability characterization data. －Enable high reliability during volume production by working with product groups to address risk areas. －Support business groups with customer requests for technical information, including reliability characterization results, risks assessments, and consultation on issues. －Communicate study conclusions and recommendations to internal and external teams. Job Qualification: －Bachelor‘s, Masters, or Doctoral degree in Electrical Engineering, Applied Physics, or equivalent, with 10 years of industry experience. －Experienced in data processing and analysis (e.g. Python, JMP, Matlab, Exensio). －Software development experience, such as familiarity with microcontroller software development (C/C++) is desired. －Interest in statistics and solid-state device fundamentals, especially as applied to emerging non-volatile memory technologies like MRAM and RRAM. －Must be curious, proactive, and detail-oriented. －Able to work in a team environment, communicate effectively in English and Mandarin, and solve problems.
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 高雄市楠梓區 3年工作經驗 4天前更新展開
Job Responsibilities - To be the owner for manufacturing test on the released products. - Responsible for test program introduce to mass production - Responsible for NPI (after R-gate released) test data analysis and feedback to BL/PETE if any improvement needed - To be the owner for duplicated test hardware by performing debug and qualification, MSC (Gage R&R) analysis and release report - Responsible for 1st line hold lot disposition, including low yield, QA fail .......etc - To initial and work with related process owners on testing processes, documentation, and best practices - Participate in or drive test automation initiatives when applicable Required Qualifications - 3+ years of experience as a Test Engineer - Solid understanding of software/system testing methodologies - Familiarity with Linux environments and command-line operations - Experience with machine language (e.g., Java, C++) - Experience in system, embedded, hardware, or manufacturing testing - Strong analytical and problem-solving skills - Strong sense of ownership and responsibility for product quality English communication, reading, writing
分紅入股年終獎金三節獎金激勵獎金員工團保 - 面議（經常性薪資達4萬元或以上） 高雄市楠梓區 工作經歷不拘 4天前更新展開
Job Description - Main contact window with business lines (BLs) to deliver a high quality and manufacturable product for IC test production, meeting or exceeding the required time to market or product cost. - Take lead of new product introduction (NPI) for IC test - To coordinate with related BLs (business line) and align with wafer/final test factories to prepare the product transfer - To improve new product introduction procedure to enable smooth product transfer - To reduce risk and impact to customers and factories, escalation management, e.g. reduce risk and impact by right and timely escalation - To ensure no gap on test tooling availability Facilitate IC test data review and process for planning forecast, take responsibility on test technical data (and improvement plan) in time and accuracy - To follow up test improvement projects, hold lots, progress of New Product Introduction, test buy off…etc. - Process of Test Engineering Notice and Enovia ECO Requirement - Bachelor degree (or above), Engineering background is preferred. - Excellent communication skills (English/Mandarin, TOEIC＞600) - Good logic thinking - Be familiar with MS Office tool - 1 yrs experience in IC testing or related working experience is preferred
分紅入股年終獎金三節獎金激勵獎金員工團保 -
