面議(經常性薪資達4萬元或以上)												桃園市中壢區										3年工作經驗			3天前更新		
		1. Project management for new package (WB/ Hybrid with FC & SiP)
2. Risk assessment for all process of new package. 
3. Support new materials and new process development.
4. Cross-functional coordination to meet customer requirements.
Required expertise: Proficiency in backend packaging processes, such as Mold, Marking, Ball Mount, or Singulation Saw.
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