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職缺名稱公司名稱上班地點工作經驗更新薪資待遇
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址:https://careers.tsmc.com/careers/JobDetail?jobId=461&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Role: Building world-class cloud native infrastructure and ramping to high-volume production is key to enabling TSMC to scale worldwide. We are looking for a highly motivated engineer to join our global systems development team to support TSMC fabrication worldwide. The ideal candidate is highly technical with multi-discipline engineering skillset, that can push the limits of complex system design at large scale. Responsibility: 1. Develop state-of-the-art applications 2. Continue to refactor existing applications 3. Write and pass various kinds of tests (unit/feature/integration) to ensure software quality 4. Apply software design principles, such as 12-factor app, to ensure software quality 5. Ensure sustainability and performance of applications by working with SRE to define SLI/SLO and providing metrics for monitoring/alerting 6. Collaborate with peers in design, pair programming and code reviews 7. Willing to learn new IT technology
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=532&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: Front-end to back-end large scale digital circuit design for system-on-chips and 3DICs, responsible for designing with the state-of-the-art process technologies and developing corresponding CAD flows that explores cutting edge design methodologies and latest EDA tools, either for internal first-in-the-industry testchips or leading customer’s products
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=541&source=104 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. The Role: Software Engineer, Backend Development at TSMC IT focus on designing the most flexible, scalable backend architecture with optimized performance to support TSMC world-class manufacture, engineering and business systems. The ideal candidate has a highly technical multi-discipline engineering skillset that can push the limits of complex system design at large scale. Responsibilities: 1.Implement the features and services of backend for TSMC software products 2.Develop state-of-the-art code 3.Continue to refactor existing applications 4.Contribute to write tests to ensure software quality 5.Apply software design principles to ensure software quality 6.Ensure sustainability and performance of software applications 7.Willing to learn new IT technologies
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=545&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1.Hands on SOC chip/ block implementation from gate level netlist to GDS tape-out. 2.Develop IC design methodology 3.Chip tape-out; Design methodology development
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=353&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Development of world-class cutting-edge technology, and responsible for the success of the A14/N2 technology: (1) Process integration across process modules, including test key design, tape out, device analysis, simulation, model, and robust. (2) Test key designs for design rule validation, electrical modeling, and yield learning. (3) Characterization of state-of-the-art devices, spice targets‘ setting for modelling, occasional bench measurement. (4) Lot handling: periodically serves as on-duty engineer to coordinate device lots‘ handling. 2. Advanced process integration development: integration and baseline sustaining to meet process KPIs on performance/ yield/ reliability/ manufacturability in A14/N2 program. 3. Advanced integration baseline process transfer to volume production. 4. Data analysis to identify the issue and issue owner. 5. Co-work with various teams to evaluate new processes and solve the issue. 6. Routine integration logistic job.
- 面議（經常性薪資達4萬元或以上） 新竹市 3年工作經驗 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=451&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Responsibilities: 1. Advanced 2.5D and 3D packaging technology development. 2. Design flows, including APR, EM/IR, Thermal, and SI/PI, enablement. 3. Design kits generation and QA. 4. 3DIC solution adoption support with key customers.
- 面議（經常性薪資達4萬元或以上） 新竹市 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=253&source=1111 Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade. Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) is committed to upholding the employment rights of accessibility individuals. In accordance with Taiwan Disability Rights Protection Act, we have established a dedicated recruitment section for those with a disability certificate and warmly welcome them to join TSMC. Responsibilities: 1. Operation, maintenance and monitoring of IT systems. 2. Responsible for incident management and internal IT support as a member of the on-call service. 3. Write scripts (Python, PowerShell, Bash, etc.) for IT operation automation (e.g., auto-recovery and ITSR automation). 4. Collaborate with DevOps teams and Infra teams to ensure the reliability of IT systems.
- 月薪32200元 台南市善化區 工作經歷不拘 2天前更新展開
【本職缺僅接受台積電官方網站投遞】 請至台積電官方網站投遞個人履歷表，此職缺履歷登錄網址: https://careers.tsmc.com/careers/JobDetail?jobId=505&source=1111 台積公司成立於1987年，率先開創了專業積體電路製造服務之商業模式，自此成為世界領先的專業積體電路製造服務公司。台積公司以領先業界的製程技術及設計解決方案組合支援其客戶及夥伴生態系統的蓬勃發展，以此釋放全球半導體產業的創新。身為全球的企業公民，台積公司的營運範圍遍及亞洲、歐洲及北美，致力成為企業社會責任的行動者。2023年，台積公司提供最廣泛的先進製程、特殊製程及先進封裝等288種製程技術，為528個客戶生產1萬1,895種不同產品。台積公司企業總部位於台灣新竹。 進一步資訊請至台積公司網站 https://www.tsmc.com.tw 查詢。 說明: 1. 負責廠務系統與半導體機台連接配管、佈線工程、現場施工、安全及品質管理。 2. 施工配管物料估算及領料、進料管理。 3. 焊接機具及施工工具操作、校正、維護與管理。
- 面議（經常性薪資達4萬元或以上） 新竹市東區 5年工作經驗 1天前更新展開
1.擔任公司集團(包含海外辦公室)再生能源分析購買、能源管理、溫室氣體盤查、節能減碳、淨零碳排規劃統籌專案管理人員。 2.公司集團淨零碳排路徑協助 KPI訂定及 ESG永續發展及相關綠色能源推動購買、報告、環境建構等。 3.熟悉ISO14064-1:2018、ISO50001(能源基線、能源績效)相關環境及能源管理系統推動業務統籌。 4.跨部門(含海外辦公室)節能減碳專案推行，彙整統籌相關數據報告。 5.協助電力問題分析改善。
員工在職教育訓練社團補助生育補助產假產檢假 - 面議（經常性薪資達4萬元或以上） 新竹市東區 4年工作經驗 1天前更新展開
1.廠務機電設備等工程、維保、巡檢、緊急狀況處理。 2.能配合日、夜班輪值。 3.電力、氣體設備相關廠務工作及節能專案推動。 4.熟悉 AUTO CAD(看圖、修改) / WORD / EXCEL /專案簡報經驗。
員工在職教育訓練社團補助生育補助產假產檢假 - 面議（經常性薪資達4萬元或以上） 新竹市東區 3年工作經驗 1天前更新展開
1. 配合廠務機電工程含假日設備維保、巡檢、緊急狀況處理。 2. 能配合日班以及夜班輪值。 3. 熟悉 AUTO CAD(看圖、修改) / WORD / EXCEL /專案簡報經驗。 4. 需能獨立規劃自己相關負責工程專案、提報。
員工在職教育訓練社團補助生育補助產假產檢假 - 面議（經常性薪資達4萬元或以上） 新竹縣湖口鄉 工作經歷不拘 5天前更新展開
1. 各項系統正常維護運轉及異常處理 2. 全廠設施或人員運作之安全及紀律之查核 3. 個人負責系統設施之保養維修 4. 協助機台二次銜接配置 5. 內部系統文件維護管理 ◎依學經歷、科系、經驗相關性、特殊需求證照及專長等條件核敘個人薪資。 ◎輪班津貼/班制津貼另計。
- 面議（經常性薪資達4萬元或以上） 新北市泰山區 工作經歷不拘 13天前更新展開
1. 客戶營運作業管理(訂單、營業銷售、應收帳款管理) 2. 客戶關係管理、客戶相關資料管理與分析、異常案件處理 3. 客戶寄售倉管理作業&客戶資料交換系統維護 4. 海外子公司及跨區生意溝通協調 5. 代理商通路管理作業 6. 全球業務相關作業協助 『具工作經驗者，薪資另議』
員工聚餐尾牙家庭日員工運動會員工結婚補助 -
