面議(經常性薪資達4萬元或以上) 新竹市東區 工作經歷不拘 12天前更新
Main work content:
1. Fan-out structure/ material/ process flow design
2. Fan-out RDL layout drawing review
3. Packaging direct material survey, evaluation, improvement & qualification
4. Design rule establishment & maintenance
5. Package failure analysis
6. Coordinate & lead project in design portion & co-work with process, integration & simulation teams
7. Direct communication with customers
* 研究領域與半導體相關者或具有半導體產業實習經驗者尤佳
* 此為研發替代役應徵專用職缺,投遞前請確認是否符合114年度研發替代役資格。
* 實際薪資依學歷、科系、相關工作經驗、專業證照、特殊專長與語言能力綜合核敘。
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