面議(經常性薪資達4萬元或以上) 新竹縣寶山鄉 工作經歷不拘 62天前更新
【本職缺僅接受台積電官方網站投遞】
請至台積電官方網站投遞個人履歷表,此職缺履歷登錄網址:
https://careers.tsmc.com/careers/JobDetail?jobId=15380&source=1111&tags=domestic+campus+2025_1111
Established in 1987 and headquartered in Taiwan, TSMC pioneered the pure-play foundry business model with an exclusive focus on manufacturing its customers’ products. In 2023, the company served 528 customers with 11,895 products for high performance computing, smartphones, IoT, automotive, and consumer electronics, and is the world’s largest provider of logic ICs with annual capacity of 16 million 12-inch equivalent wafers. TSMC operates fabs in Taiwan as well as manufacturing subsidiaries in Washington State, Japan and China, and its ESMC subsidiary plans to begin construction on a fab in Germany in 2024. In Arizona, TSMC is building three fabs, with the first starting 4nm production in 2025, the second by 2028, and the third by the end of the decade.
The Job Role:
1. Highly motivated veteran and new talents to join force research and pathfinding in Advanced packaging and system integration technologies for both extending Moore‘s Law and in post-Moore era.
2. Long prospective career path in semiconductor technologies looking at more Moore‘s and beyond Moore‘s Law Eco-industry.
Responsibilities:
1. Integration engineering for process integration and device/system level modeling, including electrical, thermal, and mechanical modeling.
2. Module engineering in advanced FEOL/MEOL/BEOL wafer process modules, and in advanced system packaging, including wafer level fan-out, interposers, and 3D chip stacking.
3. Silicon photonics expertise in the following areas: optical components design (lens, modulator, detector, waveguide w/ various materials), photonic circuits design (w/ focus on optical communication), and computer system architect (w/ focus on parallel processing and high-speed networking).
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